EP4CGX22BF14I7N vs EP4CGX22BF14C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX22BF14I7N disebabkan oleh Intel dan EP4CGX22BF14C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP4CGX22BF14I7N - 22K LE Cyclone IV GX FPGA, 169-LBGA | Intel (Altera)
EP4CGX22BF14I7N ✓ AktifPengandingan Spesifikasi
| Parametr | EP4CGX22BF14I7N | EP4CGX22BF14C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device | EP4CGX22 | — |
| Logic Elements (LE) | 21,280 | — |
| Logic Blocks | 47 (per digchip datasheet summary) | — |
| Embedded Memory Bits | 774,144 (594 Kbits) | — |
| Maximum User I/O Pins | 72 | — |
| Multipliers (18×18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | 4 (general-purpose) | — |
| Transceivers | 2 (up to 3.125 Gbps) | Up to 4 channels, 3.125 Gbps per channel |
| Core Voltage | 1.2 V | 1.2 V |
| Suhu Operasi | -40 °C to +100 °C (industrial, 'I7N' speed/temp grade) | 0C to +85C (commercial) |
| Kemasan | 169-LBGA (FineLine BGA, F14, 14×14 mm, 1.0 mm pitch) | 169-LBGA (FBGA-169), 14 mm x 14 mm, F14 outline |
| Process Technology | 60 nm | 60 nm (TSMC low-power) |
| Configuration | SRAM, serial (AS) and parallel (AP) modes, JTAG | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (per distributor listings) | Compliant |
| Logic Elements | — | 21,280 |
| Embedded Memory | — | 774,144 bits |
| Embedded 18x18 Multipliers | — | 72 |
| Logic Array Blocks (LABs) | — | 1,330 |
| Maximum User I/O | — | 72 (Cyclone IV GX 22K F14 variant) |
| Speed Grade | — | C7 (commercial, -7 speed) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Configuration Scheme | — | JTAG / Active Serial / Passive Serial (Altera standard) |