EP4SGX110HF35I3G vs EP4SGX110HF35C2G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX110HF35I3G disebabkan oleh Intel dan EP4SGX110HF35C2G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX110HF35I3G | EP4SGX110HF35C2G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Logic Elements | 105,600 | 105,600 |
| Embedded Memory Bits | 9,793,536 (9.4 Mbit) | 9,793,536 |
| Maximum User I/O Pins | 488 | — |
| Multipliers (18x18) | 352 | — |
| Core Supply Voltage (nominal) | 0.9 V | — |
| Kemasan | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch | 1152-ball FC-FBGA (HF35, 35 mm body) |
| Family | Stratix IV GX | Stratix IV GX |
| Speed/Grade | I3 (Industrial, -3 speed) | — |
| Suhu Hubungan Operasi | -40 C to +100 C | — |
| Multi-Gigabit Transceivers | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) | Up to 8.5 Gbps |
| Hard IP Blocks | PCIe Gen1/Gen2, external memory PHY | — |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Lead-free | — |
| Process Technology | 40 nm low-power CMOS | 40 nm |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks (M9K/M144K) | — | [DATA_NEEDED: block count] |
| User I/O Pins | — | 488 |
| Number of Transceivers | — | [DATA_NEEDED: channel count] |
| Hard Memory Controllers | — | [DATA_NEEDED: yes/no] |
| Hard PCIe Blocks | — | Yes (Gen1/Gen2) |
| DSP Blocks | — | [DATA_NEEDED: count] |
| Core Voltage (VCC) | — | 0.9 V |
| Operating Temperature Grade | — | Commercial (C2) |
| Speed Grade | — | 2 (core speed bin) |