EP4SGX360KF40C2 vs EP4SGX360KF40I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360KF40C2 disebabkan oleh Intel dan EP4SGX360KF40I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP4SGX360KF40I3N - Stratix IV GX FPGA, 360K LEs, 1517-FBGA | Intel
EP4SGX360KF40I3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP4SGX360KF40C2 | EP4SGX360KF40I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | — |
| Suhu Operasi | 0C to +85C (commercial) | -40C to +100C (Industrial, I3 grade) |
| Kemasan | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-BGA, FC-FBGA |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount |
| Aras MSL | MSL3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| User I/O Pins | — | 744 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Lead-Free | — | Yes |
| Configuration Method | — | JTAG, Passive Serial, Fast Passive Parallel |
| Hard IP Blocks | — | PCIe Gen1/Gen2, External Memory Controllers |