EPF10K200SFC484-3 vs EPF10K200SFC484-1N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K200SFC484-3 disebabkan oleh Intel dan EPF10K200SFC484-1N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K200SFC484-3 - 200K Gate FLEX-10KS FPGA 484-BGA | Intel / Altera
EPF10K200SFC484-3 ObsoleteIntel
EPF10K200SFC484-1N - FLEX-10KE FPGA 200K Gates 484-FBGA | Intel
EPF10K200SFC484-1N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EPF10K200SFC484-3 | EPF10K200SFC484-1N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Series | FLEX-10KS | FLEX-10KE |
| Family | FLEX 10K | FLEX-10KS |
| System Gates | 200,000 | 200,000 |
| Logic Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| User I/O Pins | 369 | — |
| Core Voltage | 2.375 V to 2.625 V | 2.5 V |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| Maximum Internal Frequency | 166.67 MHz | 250 MHz |
| Embedded Memory (RAM bits) | 40,960 (via EABs) | — |
| Global Clock Networks | 4 | — |
| Kemasan | 484-Ball FineLine BGA (PBGA484) | 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch |
| Package Dimensions | 23 mm × 23 mm, 1.0 mm pitch | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Configuration Method | SRAM, JTAG, EPC2 PROM | SRAM (volatile) - IEEE 1149.1 JTAG |
| I/O Standards | 3.3 V LVTTL/LVCMOS, 5.0 V PCI | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Status | Obsolete (last shipped 2007-2010, available via brokers) | — |
| Logic Elements | — | 9,984 |
| Embedded Memory (EAB) | — | 98,304 bits |
| User I/Os | — | 369 |
| Pin-to-Pin Delay | — | 0.3 ns |
| Speed Grade | — | -1 (fastest) |