EPF10K200SFC672-2 vs EPF10K250EFI672-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K200SFC672-2 disebabkan oleh Altera dan EPF10K250EFI672-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K200SFC672-2 | EPF10K250EFI672-3 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | FLEX 10KE | — |
| Logic Elements | 9,984 | [DATA_NEEDED: exact LE count] |
| System Gates | 200,000 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| User I/O Pins | 470 | 470 |
| Embedded Memory (bits) | 98,304 | — |
| Process Technology | 0.22 µm CMOS | CMOS, SRAM-based configuration |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V |
| I/O Supply Voltage | MultiVolt 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V (multiVolt I/O) |
| Speed Grade | -2 | — |
| Internal Propagation Delay | 0.4 ns | — |
| Maximum Operating Frequency | 200 MHz | — |
| Kemasan | 672-pin FineLine BGA (FBGA), 45 × 45 mm, 1.27 mm pitch | 672-ball FineLine BGA, 1.27 mm pitch |
| Suhu Operasi | 0 °C to +70 °C (Commercial) | 0 °C to 70 °C (commercial) |
| Configuration Method | SRAM-based, passive parallel asynchronous | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| On-chip PLL | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Unknown (legacy Altera non-RoHS device) |
| Family | — | FLEX 10KE |
| Typical Gates | — | 250,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| EAB Dual-Port Width | — | Up to 16-bit |
| Maximum EAB Memory | — | [DATA_NEEDED: bits per EAB] |
| Propagation Delay (tpd) | — | 0.4 ns (typical, -3 speed grade) |
| Configuration Interface | — | JTAG / ByteBlaster (EPC2/EPC8 PROM) |
| Design Entry | — | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog |