EPF10K30ETC144-2 vs EPF10K30ATC144-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K30ETC144-2 disebabkan oleh Intel dan EPF10K30ATC144-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K30ETC144-2 | EPF10K30ATC144-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | FLEX 10KE | FLEX 10KA |
| Family | FLEX 10KE | FLEX 10KA (Embedded Programmable Logic Device) |
| Logic Elements | 1,728 | 1,728 cells |
| Typical Gates | 30,000 | — |
| Maximum User I/Os | 102 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Memory Bits | 24,576 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Kemasan | 144-LQFP (TQFP, 20x20 mm) | 144-LQFP / TQFP-144 |
| Speed Grade | -2 | -3 |
| Suhu Operasi | 0C to +70C (Commercial) | 0 C to 70 C (Commercial) |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Internal Frequency | up to 80 MHz | — |
| Propagation Delay (typ.) | 0.6 ns | — |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Process Technology | CMOS, SRAM-based | CMOS |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant (lead-free) | — |
| Typical Gate Count | — | 30,000 gates |
| Embedded Memory (RAM bits) | — | 12,288 bits |
| User I/O Pins | — | 102 |
| Core Supply Voltage | — | 3.3 V |
| Internal Frequency (max) | — | 80 MHz |
| Propagation Delay | — | 0.6 ns (typical) |
| Configuration | — | SRAM-based, in-circuit reconfigurable |