EPF10K30ETC144-2 vs EPF10K30ETC144-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K30ETC144-2 disebabkan oleh Intel dan EPF10K30ETC144-3 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K30ETC144-2 | EPF10K30ETC144-3 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Series | FLEX 10KE | FLEX 10KE |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1,728 | — |
| Typical Gates | 30,000 | 30,000 |
| Maximum User I/Os | 102 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Memory Bits | 24,576 | — |
| Embedded Array Blocks (EABs) | 6 | 13 |
| Kemasan | 144-LQFP (TQFP, 20x20 mm) | 144-pin LQFP (TQFP) |
| Speed Grade | -2 | -3 |
| Suhu Operasi | 0C to +70C (Commercial) | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Internal Frequency | up to 80 MHz | — |
| Propagation Delay (typ.) | 0.6 ns | — |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Process Technology | CMOS, SRAM-based | 0.22 µm CMOS SRAM |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | Altera (now Intel) |
| Logic Elements / Cells | — | 1728 |
| Embedded Memory (bits) | — | 24,576 |
| User I/O Count | — | 102 |
| Number of I/O Banks | — | 8 |
| Core Voltage | — | 2.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI (via MultiVolt) |
| Max Internal Frequency | — | 200 MHz |
| Operating Temperature (Commercial) | — | 0 °C to +70 °C |
| Configuration Mode | — | Passive Serial / Active Serial / JTAG |
| Configuration Voltage | — | 5.0 V (EPC) / 2.5 V (core) |
| Lead-Free | — | [DATA_NEEDED: lead-free reflow compatibility] |