EPF10K50VBC356-2N vs EPF10K50VBI356-3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K50VBC356-2N disebabkan oleh Intel dan EPF10K50VBI356-3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EPF10K50VBI356-3N EPF10K50VBI356-3N - 50K Gates, 356-BGA FLEX 10K FPGA | Altera

EPF10K50VBI356-3N - 50K Gates, 356-BGA FLEX 10K FPGA | Altera

EPF10K50VBI356-3N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EPF10K50VBC356-2N EPF10K50VBI356-3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Series FLEX 10K FLEX-10K®
Family FLEX 10K Embedded Programmable Logic Device Family FLEX 10K
Logic Cells 2,880 —
Typical Gates 50,000 —
Total Memory Bits 20,480 —
User I/O 274 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Kemasan 356-LBGA —
Ball Pitch [DATA_NEEDED: ball pitch] —
Internal Frequency 66.67 MHz —
Propagation Delay 0.6 ns —
Logic Family CMOS —
Process Technology 0.42 µm 0.42 µm CMOS SRAM
Tegangan Pemberi Arus 3.3 V —
Suhu Operasi 0 °C to 70 °C (commercial) —
Jenis Pemasangan Surface Mount Surface Mount
Speed Grade -2 -3 (commercial/industrial timing)
Configuration SRAM-based, in-system programmable —
Status RoHS Compliant —
Logic Elements / Cells — 2880
Total RAM Bits — 20480
Number of LABs/CLBs — 360
Number of User I/O — 274
Number of Gates (typical) — 50000
Core Supply Voltage — 3.3 V
Operating Temperature (industrial) — -40 °C to +85 °C
Package Type — 356-LBGA (Ball Grid Array, low-profile)
In-System Programmable — Yes (JTAG IEEE 1149.1)
Lead-Free (Pb-Free) — Yes (suffix "N")

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga