EPF10K50VBI356-3 vs EPF10K50VBI356-3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K50VBI356-3 disebabkan oleh Intel dan EPF10K50VBI356-3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EPF10K50VBI356-3 EPF10K50VBI356-3 - FLEX 10K FPGA, 50K Gates, 356-BGA | Intel

EPF10K50VBI356-3 - FLEX 10K FPGA, 50K Gates, 356-BGA | Intel

EPF10K50VBI356-3 ⚠ Bahagian terakhir untuk beli
Intel
EPF10K50VBI356-3N EPF10K50VBI356-3N - 50K Gates, 356-BGA FLEX 10K FPGA | Altera

EPF10K50VBI356-3N - 50K Gates, 356-BGA FLEX 10K FPGA | Altera

EPF10K50VBI356-3N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EPF10K50VBI356-3 EPF10K50VBI356-3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Masa Terakhir Dibeli
Family FLEX 10K FLEX 10K
Logic Elements / Cells 2,880 2880
Typical Gate Count 50,000 gates —
Total RAM Bits 20,480 bits 20480
Logic Array Blocks (LABs) 360 —
User I/Os 274 —
Bilangan Pin 356 —
Kemasan 356-LBGA —
Process Technology 0.42 µm CMOS SRAM 0.42 µm CMOS SRAM
Core Supply Voltage 3.3 V 3.3 V
Internal Frequency (max) 125 MHz —
Propagation Delay 0.6 ns —
Operating Temperature (commercial) 0 °C to 70 °C [DATA_NEEDED: industrial range per part suffix] —
Speed Grade -3 -3 (commercial/industrial timing)
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Configuration Method JTAG / serial (EPC1/EPC2/uP) —
Series — FLEX-10K®
Number of LABs/CLBs — 360
Number of User I/O — 274
Number of Gates (typical) — 50000
Operating Temperature (industrial) — -40 °C to +85 °C
Package Type — 356-LBGA (Ball Grid Array, low-profile)
In-System Programmable — Yes (JTAG IEEE 1149.1)
Lead-Free (Pb-Free) — Yes (suffix "N")

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