EPF10K50VQC240-2 vs EPF10K50VQC240-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K50VQC240-2 disebabkan oleh Altera dan EPF10K50VQC240-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K50VQC240-2 | EPF10K50VQC240-3 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | FLEX 10K | FLEX 10K |
| Series | FLEX-10K | EPF10K50 |
| Typical Gate Count | 50,000 gates | — |
| Logic Elements (LABs) | 360 | — |
| Logic Cells | 2,880 | — |
| Embedded Array Memory | 20,480 bits | — |
| User I/O Pins | 189 | — |
| Kemasan | 240-BFQFP (240-PQFP / FQFP / QFP-240) | — |
| Number of Terminals | 240 | — |
| Terminal Form | Gull Wing | — |
| Package Code | FQFP | FQFP-240 |
| Package Shape | Square | — |
| Process Technology | 0.42 micrometer CMOS, 4-layer metal | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V | — |
| I/O Supply Voltage (MultiVolt) | 5.0 V / 3.3 V / 2.5 V | — |
| Maximum Internal Frequency | 125 MHz | 125 MHz |
| Propagation Delay (typical) | 0.6 ns | — |
| Suhu Operasi | 0 C to +70 C (Commercial) | 0 °C to +70 °C (Commercial) |
| Temperature Grade | Commercial | — |
| Configuration Scheme | SRAM-based, serial / parallel via EPC1/EPC2 | — |
| JTAG / Boundary Scan | IEEE 1149.1 compliant | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status - legacy Altera FLEX 10K family typically non-RoHS Pb-bearing BFQFP; verify on distributor listing] | [DATA_NEEDED: RoHS compliance status] |
| Typical Gates | — | 50,000 |
| Logic Elements / Cells | — | 2,880 |
| Logic Array Blocks (LABs) | — | 360 |
| User I/Os | — | 189 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Supply Voltage (VCCINT) | — | 3.3 V |
| Propagation Delay (tpd) | — | 0.6 ns |
| Package Type | — | 240-pin PQFP (Plastic Quad Flat Pack) |
| Configuration Method | — | SRAM-based, requires external EPC device or MCU |
| Speed Grade | — | -3 (mid-tier) |