EPF10K50VRC240-1 vs EPF10K50VQC240-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K50VRC240-1 disebabkan oleh Intel dan EPF10K50VQC240-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K50VRC240-1 | EPF10K50VQC240-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | FLEX 10K | FLEX 10K |
| Logic Elements | 2,880 | — |
| Typical Gates | 50,000 | 50,000 |
| Embedded Memory | 20,480 bits (189 Kb) | — |
| User I/O | 274 (max) | — |
| Number of I/O Pins | 189 | — |
| Kemasan | 240-RQFP Exposed Pad | — |
| Pins | 240 | — |
| Core Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage (VCCIO) | MultiVolt (2.5 V / 3.3 V / 5 V tolerant) | — |
| Internal Frequency (max) | 66.67 MHz | — |
| Propagation Delay | 0.6 ns | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS |
| Logic Family | CMOS | — |
| Suhu Operasi | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| JTAG Support | Yes (IEEE Std 1149.1-1990) | — |
| Configuration Interface | JTAG / BitBlaster / ByteBlasterMV / Jam STAPL | — |
| Programming Language | Altera MAX+PLUS II / Quartus | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Series | — | EPF10K50 |
| Logic Elements / Cells | — | 2,880 |
| Logic Array Blocks (LABs) | — | 360 |
| User I/Os | — | 189 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Supply Voltage (VCCINT) | — | 3.3 V |
| Maximum Internal Frequency | — | 125 MHz |
| Propagation Delay (tpd) | — | 0.6 ns |
| Package Type | — | 240-pin PQFP (Plastic Quad Flat Pack) |
| Package Code | — | FQFP-240 |
| Configuration Method | — | SRAM-based, requires external EPC device or MCU |
| Speed Grade | — | -3 (mid-tier) |