EPF8820ATC144-3N vs EPF8820ATC144-1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF8820ATC144-3N disebabkan oleh Intel dan EPF8820ATC144-1 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Altera
EPF8820ATC144-1 - FLEX 8000 FPGA, 672 Cells, 112 I/O, 144-TQFP | Altera
EPF8820ATC144-1 ObsoletePengandingan Spesifikasi
| Parametr | EPF8820ATC144-3N | EPF8820ATC144-1 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Cells | 672 | 672 |
| Usable Gates | 8,000 (typical) | — |
| Logic Array Blocks (LABs) | 84 | 84 |
| User I/Os | 112 to 152 (per package) | 112 |
| Process Technology | 0.42 µm CMOS SRAM | CMOS SRAM |
| Tegangan Pemberi Arus | 4.75 V to 5.25 V (5 V nominal) | 5.0 V (MultiVolt I/O supports 3.3 V or 5.0 V) |
| Speed Grade | -3 | -1 (slowest) |
| Suhu Operasi | 0 °C to +70 °C (Commercial) | 0C to 70C (commercial) |
| Kemasan | 144-pin TQFP / LFQFP (20 x 20 mm) | 144-pin TQFP |
| Configuration Method | SRAM, external EPROM or EPC-series device | SRAM, loaded via EPC1 / EPC1064 / EPC1213 / EPC1441 or parallel EPROM |
| In-Circuit Reconfigurable | Yes | — |
| Jenis Pemasangan | Surface Mount (Gull-Wing) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Aras MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Device | — | EPF8820A |
| Equivalent Gates | — | ~8,000 usable gates |
| Flip-Flops (max) | — | 1,500 |
| In-Circuit Reconfigurability | — | Yes (ICR) |
| JTAG Boundary Scan | — | Yes (IEEE 1149.1) |