EPM570ZF256C7N vs EPM570F256C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570ZF256C7N disebabkan oleh Intel dan EPM570F256C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570ZF256C7N | EPM570F256C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | MAX II |
| Programmable Type | In System Programmable | — |
| Macro Cells | 440 | — |
| Logic Elements (LE) | 440 | — |
| Embedded Flash Memory | 8 Kbit | — |
| Pin-to-Pin Logic Delay (tPD) | 9 ns | — |
| Maximum Operating Frequency | 201 MHz (internal) | — |
| Maximum User I/O Pins | 160 | — |
| Supply Voltage - Internal (VCCINT) | 1.71 V to 1.89 V | — |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Supplier Device Package | 256-MBGA (11x11 mm) | — |
| Package Type Code | 256-FBGA / 256-TFBGA | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 0.18 µm flash-based CMOS | 0.18 µm 6-layer-metal flash |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Gambaran Suhu Operasi | 0 °C to +85 °C (commercial, suffix 'C') | 0 °C to +70 °C (commercial) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Lead-Free Status | Lead free | — |
| Logic Elements | — | 570 LE |
| Macrocells | — | 440 |
| Logic Array Blocks (LABs) | — | 57 |
| User I/O Count | — | 160 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Kemasan | — | 256-ball FineLine BGA (FBGA) |
| Package Size | — | 17 mm × 17 mm |
| Maximum Internal Frequency | — | 304 MHz |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| In-System Programmability (ISP) | — | Yes (JTAG) |