EPM9560RI208-15N vs EPM9560RI208-20N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM9560RI208-15N disebabkan oleh Altera dan EPM9560RI208-20N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM9560RI208-15N | EPM9560RI208-20N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Manufacturer | Altera (Intel Programmable Solutions Group) | — |
| Device Family | MAX 9000 | MAX 9000 |
| Device Type | EPLD (Erasable Programmable Logic Device) | — |
| Architecture | Multiple Array MatriX (MAX), 3rd generation | — |
| Configuration Memory | CMOS EEPROM, in-system programmable | — |
| Kemasan | 208-pin RQFP (Ruggedized Quad Flat Pack) | 208-pin RQFP |
| Total Pins | 356 (per third-party catalog; see _validation_note) | — |
| Package Pin Count | 208 | — |
| Terminal Form | Gull Wing | — |
| Package Code | HFQFP | — |
| User I/Os | 216 (per DigiChip specification; see _validation_note) | — |
| Maximum Internal Frequency | 145 MHz | — |
| Propagation Delay (tPD) | 11.4 ns (15 ns speed grade) | — |
| Speed Grade | -15 | — |
| Tegangan Pemberi Arus | 5.0 V | 5.0 V |
| Suhu Operasi | 0C to 70C (Commercial) | Industrial (-40C to +85C) |
| Temperature Grade | Industrial (per Vyrian/Partstack listings) | — |
| Logic Family | CMOS | — |
| Programming Interface | IEEE 1149.1 JTAG, 5.0-V in-system | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Usable Gates | — | 12,000 |
| Macrocells | — | 560 |
| Pin-to-Pin Delay | — | 20 ns (-20 speed grade) |
| Counter Speed | — | 100 MHz |
| Configuration Technology | — | EEPROM (non-volatile) |
| In-System Programmability | — | Yes, via IEEE Std. 1149.1 JTAG |
| Jenis Pemasangan | — | Surface Mount |
| Development Tool | — | MAX+PLUS II |
| Design Entry | — | Schematic, VHDL, Verilog HDL, AHDL |
| Packaging | — | Tray |
| Logic Architecture | — | Third-generation MAX (Multiple Array MatriX) |
| Fabrication Process | — | Advanced CMOS |