K3KL3L30CM-BGCU vs K3KL3L30CM-BGCT Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K3KL3L30CM-BGCU disebabkan oleh Samsung Electronics dan K3KL3L30CM-BGCT disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K3KL3L30CM-BGCU | K3KL3L30CM-BGCT |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | LPDDR5X SDRAM (Volatile DRAM) | LPDDR5X SDRAM |
| Saiz Ingatan | 64 Gb (8 GB) | — |
| Kadar Data | 8533 Mbps | — |
| Memory Organization | x64 | — |
| Technology | LPDDR5X (JEDEC LPDDR5X-class low-power DRAM) | Stacked DRAM die, mobile BGA |
| Kemasan | FBGA-496 (BGCU) | [DATA_NEEDED: exact package code and ball count] |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Die Configuration | Stacked multi-die DRAM | — |
| Antaramuka | LPDDR5X (standard LPDDR ball interface) | — |
| Application Segment | AI devices and automotive | — |
| Power Efficiency | Approx. 25% better than previous LPDDR5 generation (per Samsung) | — |
| Speed Improvement | Up to 1.25x faster than previous generation (per Samsung) | — |
| Supply Voltage Class | [DATA_NEEDED: VDD/VDDQ voltage] | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Place of Origin (per distributor listing) | Johor, Malaysia | — |
| Density | — | 64 Gbit |
| Organisasi | — | x64 |
| Speed Grade | — | LPDDR5X-7500 (7500 MT/s) |
| Core Voltage | — | [DATA_NEEDED: VDD core voltage] |
| I/O Voltage (VDDQ) | — | [DATA_NEEDED: VDDQ voltage] |
| Refresh | — | [DATA_NEEDED: refresh scheme] |
| Standards Compliance | — | JEDEC LPDDR5X specification |
| Application Class | — | Mobile / embedded main memory |