M1AFS250-1FG256 vs M1AFS250-1FG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS250-1FG256 disebabkan oleh Microchip Technology dan M1AFS250-1FG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS250-1FG256 ✓ AktifMicrochip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ AktifPengandingan Spesifikasi
| Parametr | M1AFS250-1FG256 | M1AFS250-1FG256I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Fusion (M1 series, mixed-signal FPGA) | — |
| System Gates | 250000 gates | 250000 gates |
| Processor Core | ARM Cortex-M1 | — |
| User I/O | 114 | — |
| User Flash Memory | 36864 bits | — |
| Core Supply Voltage | 1.5 V | 1.5 V (1.425 V to 1.575 V) |
| Technology | 130 nm flash-based | — |
| Maximum Performance | 1282.05 MHz (per FindIC spec summary) | — |
| Configuration | Flash-based, live at power-up | — |
| Security | 128-bit flash lock, AES decryption | — |
| Kemasan | 256-LBGA (FG256) | 256-LBGA (FBGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Analog Blocks | Integrated configurable analog (Fusion) | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial, suffix I) |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Series | — | Fusion (M1 - with ARM Cortex-M1) |
| D Flip-Flops (DFF) | — | 36864 |
| Total I/O | — | 114 |
| Configuration Type | — | Flash-based (live at power-up) |
| Embedded Processor | — | ARM Cortex-M1 soft core |
| Analog Features | — | Configurable analog blocks, clock generation and management |
| On-chip Memory | — | Flash memory blocks |
| Speed Grade | — | -1 |
| Package Dimensions | — | 17 mm x 17 mm x 1.2 mm height |
| Supplier Device Package | — | 256-LBGA |
| Total RAM | — | [DATA_NEEDED: Total RAM bits] |
| Embedded Block RAM (eSRAM) | — | [DATA_NEEDED: eSRAM size] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |