M29W800FT70ZA3SF vs M29W800FB70ZA3SF Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M29W800FT70ZA3SF disebabkan oleh Micron Technology dan M29W800FB70ZA3SF disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Micron Technology
M29W800FB70ZA3SF - 8Mb 3V Parallel NOR Flash 70ns | Micron
M29W800FB70ZA3SF ✓ AktifPengandingan Spesifikasi
| Parametr | M29W800FT70ZA3SF | M29W800FB70ZA3SF |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | NOR Flash | — |
| Density | 8 Mbit | 8 Mb (1 MB) |
| Antaramuka | Parallel | — |
| Access Time | 70 ns | 70 ns |
| Tegangan Pemberi Arus | 2.7 V to 3.6 V | — |
| Suhu Operasi | -40C to +125C | -40C to +125C |
| Kemasan | 48-TFBGA (6 x 8 mm) | 48-TFBGA (6x8) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Boot Block Configuration | Top boot block (FT) | — |
| Memory Organization | [DATA_NEEDED: memory organization x8/x16] | 1M x 8 / 512K x 16 |
| Program/Erase Cycles | [DATA_NEEDED: endurance cycles] | — |
| Data Retention | [DATA_NEEDED: data retention years] | [DATA_NEEDED: data retention] |
| Active Read Current | [DATA_NEEDED: active read current] | — |
| Standby Current | [DATA_NEEDED: standby current] | — |
| Package Body Size | 6 x 8 mm | — |
| Ball Pitch | 0.80 mm | [DATA_NEEDED: ball pitch] |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Jenis Antaramuka | — | Parallel |
| Supply Voltage (VCC) | — | 2.7 V to 3.6 V |
| Boot Block Location | — | Bottom boot (FB) |
| Byte/Word Organization Pin | — | Yes (BYTE pin selects x8/x16) |
| Programming Time | — | [DATA_NEEDED: programming time] |
| Endurance | — | [DATA_NEEDED: program/erase cycles] |
| XIP Support | — | Yes (parallel random-access, execute-in-place capable) |
| Reel Option | — | Available (M29W800FB70ZA3SF TR) |