MC9S08AW32CFGE vs S9S08AW32E5CFGE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08AW32CFGE disebabkan oleh NXP Semiconductors dan S9S08AW32E5CFGE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
S9S08AW32E5CFGE - 8-bit 40MHz 32KB Flash Automotive MCU | NXP
S9S08AW32E5CFGE ✓ AktifPengandingan Spesifikasi
| Parametr | MC9S08AW32CFGE | S9S08AW32E5CFGE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-bit | — |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 32 KB (32K x 8) | — |
| RAM | 2 KB | 2 KB |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 8-channel | — |
| General Purpose I/O | 34 | — |
| Kemasan | 44-LQFP (10x10 mm), 0.5 mm pitch | 44-LQFP (10x10 mm) |
| Package Standard | MO-220VKKD-2, 7 x 7 mm body variants per distributor listing | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Debug Interface | Single-wire background debug mode (BDM) | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Status Lingkungan Hidup | NRND (Not Recommended for New Designs) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Core | — | HCS08 (S08) 8-bit |
| Program Memory (FLASH) | — | 32 KB (32K x 8) |
| Data EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Kiraan Pin | — | 44 |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Operating Temperature Grade | — | Industrial / Automotive (AEC-Q100) |
| Bus Clock Range | — | [DATA_NEEDED: bus clock min/max] |
| ADC | — | On-chip ADC (channels [DATA_NEEDED]) |
| Timers/PWM (TPM) | — | On-chip TPM modules |
| Communication Interfaces | — | SCI (UART), SPI, IIC |
| Aras MSL | — | MSL3 (per JEDEC J-STD-020) |
| Qualification | — | AEC-Q100 (automotive, "S9" prefix) |
| Development Tools | — | CodeWarrior HC(S)08, P&E BDM/Cyclone, USBDM |