MC9S08SV16CLC vs MC9S08SV16CBM Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08SV16CLC disebabkan oleh NXP Semiconductors dan MC9S08SV16CBM disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S08SV16CLC - 8-Bit S08 MCU, 16KB Flash, 40MHz, 32-LQFP | NXP
MC9S08SV16CLC ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | MC9S08SV16CLC | MC9S08SV16CBM |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Core Architecture | HCS08 (8-bit) | — |
| CPU Core | S08SV family | — |
| Maximum CPU Frequency | 40 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 16 KB (16K x 8) | — |
| RAM Size | 1 KB (1K x 8) | — |
| Number of I/O Pins | 30 | 30 |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Oscillator Type | Internal | Internal (with FLL); external reference supported |
| Kemasan | 32-LQFP (7x7 mm) | 32-SDIP (0.400", 10.16 mm) through-hole |
| Jenis Pemasangan | Surface Mount | Through-Hole |
| Gambaran Suhu Operasi | -40C to +85C (industrial) | — |
| Data Converters | [DATA_NEEDED: ADC channels/resolution] | [DATA_NEEDED: ADC resolution and channel count] |
| Communication Interfaces | SCI (UART), SPI, I2C | — |
| Packaging | Tray | Tube |
| Status RoHS | Compliant | Compliant |
| Peripheral Highlights | Interrupt priority controller with nested interrupt capability | — |
| Core | — | HCS08 (8-bit CISC, HC08 instruction set) |
| CPU Speed | — | 40 MHz |
| Program Memory | — | 16 KB flash (16K x 8) |
| RAM | — | 1 KB (1K x 8) |
| Tegangan Pemberi Arus | — | 2.7 V to 5.5 V |
| Suhu Operasi | — | -40 C to +85 C (industrial) |
| Peripherals | — | [DATA_NEEDED: full peripheral list - timer/PWM/ADC channel counts] |
| Connectivity | — | [DATA_NEEDED: SCI/SPI/I2C module count] |
| Aras MSL | — | 1 (unsealed through-hole, not applicable in JEDEC SMD sense) |
| Lead Time | — | To be confirmed by distributor (as of 2026-10-18) |