MC9S12GC32MFAE vs MC9S12GC32MFUE Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12GC32MFAE disebabkan oleh NXP Semiconductors dan MC9S12GC32MFUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12GC32MFAE MC9S12GC32MFAE - 16-bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12GC32MFAE - 16-bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12GC32MFAE Nrnd
NXP Semiconductors
MC9S12GC32MFUE MC9S12GC32MFUE - HCS12 16-Bit MCU 32KB Flash | NXP | 80-QFP

MC9S12GC32MFUE - HCS12 16-Bit MCU 32KB Flash | NXP | 80-QFP

MC9S12GC32MFUE ✓ Aktif

Pengandingan Spesifikasi

Parametr MC9S12GC32MFAE MC9S12GC32MFUE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Core HCS12 (16-bit) HCS12 (CPU12)
CPU Family S12GC —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 2 KB —
EEPROM 1 KB —
Maximum Bus Clock 25 MHz (50 MHz core via PLL) —
Tegangan Pemberi Arus 2.97 V to 5.5 V —
Internal Voltage Regulator On-chip bandgap Vreg (2.5 V core) —
ADC 10-bit —
PWM / Timer Channels 8 channels —
SCI (UART) Up to 2 —
SPI 1 —
GPIO Up to 60 —
Debug Interface BDM (single-wire background debug) —
Kemasan 48-LQFP (7x7 mm) 80-QFP (PQFP, 14x14 mm)
Suhu Operasi [DATA_NEEDED: operating temperature grade] [DATA_NEEDED: operating temperature range]
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Jenis Pemasangan Surface Mount Surface Mount
Core Size — 16-Bit
Core Architecture — CISC
Program Memory Size — 32 KB (32K x 8) Flash
RAM Size — 2 KB (2K x 8)
EEPROM Size — [DATA_NEEDED: EEPROM size]
Maximum Bus Frequency — 25 MHz (PLL up to 50 MHz)
Supply Voltage Range — 2.5 V / 5 V (2.97 V to 5.5 V external supply)
Number of I/O — 60
Connectivity — EBI/EMI, SCI, SPI
Peripherals — POR, PWM, WDT
Aras MSL — [DATA_NEEDED: MSL level]
Series — S12GC

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