MC9S12XDP512VAL vs MC9S12XDT512MAL Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12XDP512VAL disebabkan oleh NXP Semiconductors dan MC9S12XDT512MAL disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12XDP512VAL MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP

MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP

MC9S12XDP512VAL ✓ Aktif

Pengandingan Spesifikasi

Parametr MC9S12XDP512VAL MC9S12XDT512MAL
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif NRND
Core Processor HCS12X HCS12X
Core Architecture 16-bit CISC CISC
Maximum CPU Frequency 80 MHz —
Program Memory Size 512 KB (512K x 8) Flash —
RAM Size [DATA_NEEDED: RAM size in KB] —
EEPROM Size [DATA_NEEDED: EEPROM emulation size] —
Tegangan Pemberi Arus 2.35 V to 2.75 V 2.5 V / 5 V
I/O Pins 119 —
Package Type 112-pin LQFP (20 x 20 mm) 112-LQFP (20x20 mm)
Jenis Pemasangan Surface Mount Surface Mount
Suhu Operasi [DATA_NEEDED: automotive -40C to +105C or -40C to +125C grade] -40C to +125C
CAN Modules Multiple MSCAN (CAN 2.0A/B) —
ADC 8/10-bit ATD (S12ATD10B8CV3) 8/10-bit (channels [DATA_NEEDED])
Co-processor XGATE —
Instruction Set Compatibility Upward-compatible with HCS12 —
ROM Type Flash —
Status Lingkungan Hidup Active —
Status RoHS [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: rohs status]
Core Size — 16-bit
Maximum CPU Speed — 80 MHz
Program Memory — 512 KB Flash
RAM — 20 KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — [DATA_NEEDED: number of I/O pins]
Series — MC9S12 / S12XD
Process Technology — TSMC3 (automotive qualified)
Boundary-Scan Debug — BDM + JTAG/Nexus
Lifecycle — NRND (Not Recommended for New Designs)

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