MCF5212LCVM80 vs MCF5212LCVM66 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MCF5212LCVM80 disebabkan oleh NXP Semiconductors dan MCF5212LCVM66 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MCF5212LCVM80 - ColdFire V2 32-bit MCU 80MHz 256KB Flash | NXP
MCF5212LCVM80 ✓ AktifPengandingan Spesifikasi
| Parametr | MCF5212LCVM80 | MCF5212LCVM66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | ColdFire V2 (32-bit RISC, 68000-derived) | — |
| Frekuensi Klock Maksimum | 80 MHz | 66 MHz |
| Program Flash Memory | 256 KB (256K x 8) | — |
| SRAM | 16 KB | 32 KB |
| Supply Voltage Range | 3.0 V to 3.6 V | — |
| Ethernet Controller | 10/100 Mbps FEC (Fast Ethernet Controller) | — |
| CAN Module | FlexCAN (CAN 2.0b) | — |
| UART Channels | 3 | — |
| I2C Channels | 2 | — |
| QSPI | Yes (1 channel) | — |
| DMA Channels | 4 x 32-bit | — |
| Suhu Operasi | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Kemasan | 81-MAPBGA (10x10 mm) | 81-MAPBGA (10x10 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Performance | Approximately 1.59 MIPS/MHz (ColdFire V2) | — |
| Debug Interface | BDM (Background Debug Mode) + JTAG | — |
| Core Processor | — | ColdFire V2 (MCF521x) |
| Core Size | — | 32-Bit |
| Flash Memory | — | 256 KB (256K x 8) |
| Tegangan Pemberi Arus | — | 3.3 V |
| Bilangan Pin | — | 81 |
| Peripherals | — | DMA, LVD, POR, PWM, WDT |
| Interfaces | — | I2C, SPI, UART, USART |
| Number of UARTs | — | 3 |
| Product Family | — | MCF521x KIRIN (MCF521X) |
| Family Flash Range | — | Up to 521 KB (MCF521X family) |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance] |
| Packaging | — | Tray |