MCF5280CVM80J vs MCF5280CVF80 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MCF5280CVM80J disebabkan oleh NXP Semiconductors dan MCF5280CVF80 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MCF5280CVM80J MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J Obsolete
NXP Semiconductors
MCF5280CVF80 MCF5280CVF80 - Coldfire V2 32-bit MCU 80MHz 256-MAPBGA | NXP

MCF5280CVF80 - Coldfire V2 32-bit MCU 80MHz 256-MAPBGA | NXP

MCF5280CVF80 Obsolete

Pengandingan Spesifikasi

Parametr MCF5280CVM80J MCF5280CVF80
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Obsolete Obsolete
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series MCF528x (ColdFire V2) MCF528x
Core Processor ColdFire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit
Maximum CPU Clock 80 MHz —
Program Memory Type ROMless (external flash required) ROMless
Kemasan 256-MAPBGA (17x17 mm) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Temperature Grade Industrial —
Suhu Operasi -40C to +105C (TJ, industrial grade) —
Connectivity CANbus, Ethernet (10/100 MAC), I2C, SPI, UART CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals DMA, PWM, WDT, 16-bit timers, external memory controller DMA, LVD, POR, PWM, WDT
Program Memory Size ROMless (0 KB internal flash, code via external bus) Not populated (external memory interface required)
Number of I/O [DATA_NEEDED: GPIO count from datasheet] 142
Ethernet 10/100 MAC integrated (MII/RMII interface to external PHY) —
CAN CAN 2.0 controller integrated —
Debug Interface JTAG / BDM (Background Debug Mode) —
Aras MSL 3 (per JEDEC J-STD-020, typical for MAPBGA) [DATA_NEEDED: MSL level]
Status RoHS Compliant (Pb-free reflow profile) [DATA_NEEDED: RoHS status]
Lead-Free Finish Yes (Matte Tin, SAC solder compatible) —
Core Speed — 80 MHz
Package Type — 256-MAPBGA
Package Dimensions — 17 x 17 mm
Operating Voltage — 3.3 V typical (ROMless ColdFire core)

Laporan Datasheet & Sumber

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