MMG3007NT1 vs MMG3011NT1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MMG3007NT1 disebabkan oleh NXP Semiconductors dan MMG3011NT1 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MMG3007NT1 | MMG3011NT1 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | RF Amplifiers | RF Amplifiers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Description | RF Amplifier IC, General Purpose Amplifier (GPA), InGaP HBT | — |
| Frequency Range | 0 Hz to 6000 MHz (DC to 6 GHz) | 0 Hz to 6000 MHz (0-6 GHz) |
| Small-Signal Gain | 19 dB @ 900 MHz (typical) | 15 dB (typical) |
| P1dB Output Power | 16 dBm @ 900 MHz | — |
| Third-Order Output Intercept Point (OIP3) | 30 dBm @ 900 MHz | — |
| Tegangan Pemberi Arus | 5 V (typical, single supply) | — |
| Kemasan | SOT-89-4 (4-pin, plastic, surface mount) | SOT-89-4 |
| Technology | InGaP Heterojunction Bipolar Transistor (HBT) | InGaP HBT (Heterojunction Bipolar Transistor) |
| Input Matching | Internally matched to 50 ohms | Internally matched to 50 ohms |
| Output Matching | Internally matched to 50 ohms | Internally matched to 50 ohms |
| Operating Class | Class A, small-signal, general purpose | Class A |
| Storage Temperature Range | [DATA_NEEDED: storage temperature range] | — |
| RF Input Power (max) | [DATA_NEEDED: maximum RF input power rating] | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant (per NXP product page) | [DATA_NEEDED: RoHS status not confirmed in retrieved snippets] |
| Tape and Reel Quantity | 1,000 units per reel, 12 mm tape width, 7-inch reel (T1 = 1k) | — |
| Fungsi | — | General-purpose amplifier (GPA) |
| Output Power (P1dB) | — | 15 dBm (typical) |
| Number of Terminals | — | 4 |
| Package Body Material | — | Plastic/Epoxy |
| Construction | — | Component |
| Lead-Free | — | [DATA_NEEDED: lead-free status not confirmed in retrieved snippets] |