MPC8245TVV266D vs MPC8245LZU300D Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8245TVV266D disebabkan oleh NXP Semiconductors dan MPC8245LZU300D disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8245TVV266D - PowerPC 603e 266MHz Host Processor | NXP
MPC8245TVV266D ObsoleteNXP Semiconductors
MPC8245LZU300D - PowerQUICC II 300MHz Integrated Host Processor | NXP
MPC8245LZU300D NrndPengandingan Spesifikasi
| Parametr | MPC8245TVV266D | MPC8245LZU300D |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) | — |
| Part Number | MPC8245TVV266D | — |
| Core Architecture | PowerPC 603e (32-bit Power Architecture) | PowerPC 603e (Power Architecture technology) |
| Core Frequency | 266 MHz | 300 MHz |
| Number of Cores | 1 | 1 |
| Bus Width | 32-bit (64-bit internal) | 32-bit |
| L1 Cache | 32 KB (unified) | — |
| Integrated Functions | PCI bridge, memory controller, DMA | — |
| PCI Interface | PCI 2.2 compliant, 32-bit/64-bit, 33/66 MHz | 32-bit, up to 66 MHz |
| Memory Controller | SDRAM/DDR support with ECC | SDRAM, up to 2 GB, up to 133 MHz |
| Process Technology | 0.25 um CMOS | — |
| Core Supply Voltage | 3.3 V | 1.8 V |
| I/O Voltage | 3.3 V (5 V tolerant) | — |
| Suhu Operasi | -40 C to +105 C (industrial) | 0C to +105C |
| Kemasan | 352-pin TBGA (35 mm x 35 mm) | 352-TBGA (35x35 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Non-Compliant (legacy Sn/Pb) | [DATA_NEEDED: RoHS compliance status] |
| Status | Obsolete / End of Life | — |
| Processor Type | — | MPC82xx PowerQUICC II Integrated Host Processor |
| Performance | — | 570 MIPS |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| Lead Status | — | Contains Lead |
| Packaging | — | Tray |