MPC8313ECZQAFFB vs MPC8313ECZQAFFC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8313ECZQAFFB disebabkan oleh NXP Semiconductors dan MPC8313ECZQAFFC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC8313ECZQAFFB | MPC8313ECZQAFFC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors | — |
| Core | PowerPC e300c3 | — |
| Processor Series | MPC83xx (PowerQUICC II Pro) | — |
| Lebar Bus Data | 32 bit | — |
| Maximum Core Frequency | 333 MHz | — |
| Number of Cores | 1 | — |
| Instruction Set Architecture | PowerPC | — |
| L1 Instruction Cache | [DATA_NEEDED: L1 I-cache size] | — |
| L1 Data Cache | [DATA_NEEDED: L1 D-cache size] | — |
| Security Engine | Yes (DES / 3DES / AES, public-key acceleration) | SEC (DES/3DES/AES/MD5/SHA-1) |
| Ethernet Interfaces | 2x 10/100/1000 (RGMII + SGMII selectable) | — |
| USB | USB 2.0 Full/Low Speed | USB 2.0 High-Speed (Host/Device) |
| Memory Controller | DDR1 / DDR2 SDRAM | DDR1/DDR2, up to 256 MB |
| Operating Voltage (Core) | 1.0 V | — |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V (selectable) | — |
| Kemasan | 516-ball TE-PBGA (27x27 mm) | 516-TEPBGA (27x27 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +105C (extended industrial, per datasheet) | -40C to +105C |
| Status RoHS | Not RoHS (per one distributor listing) | Compliant |
| Encryption Acceleration | Hardware IPsec / SSL assist | — |
| Processor Type | — | PowerPC e300c3 |
| Series | — | PowerQUICC II Pro, MPC83xx |
| Core Count | — | 1 |
| Bit Width | — | 32-Bit |
| Clock Speed | — | 333 MHz |
| Core Voltage | — | 0.95 V to 1.05 V |
| L1 Cache | — | 16 KB I-Cache, 16 KB D-Cache |
| Ethernet | — | 2x 10/100/1000 MAC (Gigabit) |
| PCI | — | PCI 2.3 |