MPXV7007GP vs MPXV7007GC6U Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPXV7007GP disebabkan oleh STMicroelectronics dan MPXV7007GC6U disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPXV7007GC6U MPXV7007GC6U - ±7kPa Compound Pressure Sensor 5V SOP-8 | NXP

MPXV7007GC6U - ±7kPa Compound Pressure Sensor 5V SOP-8 | NXP

MPXV7007GC6U ✓ Aktif

Pengandingan Spesifikasi

Parametr MPXV7007GP MPXV7007GC6U
Merek STMicroelectronics NXP Semiconductors
Kategori Pressure Sensors Pressure Sensors
Status Lingkungan Hidup Aktif Aktif
Pressure Type Compound (Vacuum + Positive) —
Operating Pressure Range ±7 kPa (±1.02 PSI) —
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] —
Tegangan Pemberi Arus 4.5 V to 5.5 V (5 V typical) 5.0 V (typical)
Arus Pemberi Arus 10 mA typical 7 mA (typical)
Jenis Output Analog, ratiometric Analog, ratiometric
Gambaran Tegangan Output 0.5 V to 4.5 V at 5 V Vcc 0.5 V to 4.5 V
Output Impedance [DATA_NEEDED: output impedance] —
Suhu Operasi 0 °C to +85 °C -40 °C to +125 °C
Storage Temperature [DATA_NEEDED: storage temperature] —
Port Style Top-side tube, Male 0.13 in (3.17 mm) —
Kemasan 8-SMD, SOP-8, Gull Wing, Side Port 8-SMD, Gull Wing, Top Port (SOP-8)
Jenis Pemasangan Surface Mount Surface Mount
Accuracy Factory calibrated ±[DATA_NEEDED: accuracy %FS] ±1.5 %VFSS (max over compensated range)
Temperature Compensation 0 °C to +85 °C on-chip —
Ciri-ciri On-chip signal conditioned, temperature compensated, calibrated —
Port Material [DATA_NEEDED: port material] —
Product Type — Integrated silicon pressure sensor
Manufacturer — NXP Semiconductors
Pressure Range — -7 kPa to +7 kPa (compound, ±1.02 PSI)
Operating Pressure - Max — +7 kPa
Operating Pressure - Min — -7 kPa
Output Span — 4.0 V (typical, VFS - Voffset)
Compensated Temperature — 0 °C to +85 °C
Port Type — Axial, top port, accepts 3.17 mm (1/8 in) tube
Package Dimensions — 11.4 mm x 8.1 mm x 6.4 mm
Technology — MEMS piezoresistive, Wheatstone-bridge on-chip
Signal Conditioning — On-chip amplifier, temperature compensation, calibration
ESD Protection (Port) — 2 kV HBM
ESD Protection (Signal Pins) — 200 V HBM
Status RoHS — Compliant
Lead-Free — Yes

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