P1012NSE2HFB vs P1021NSE2HFB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci P1012NSE2HFB disebabkan oleh NXP Semiconductors dan P1021NSE2HFB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP
P1012NSE2HFB ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | P1012NSE2HFB | P1021NSE2HFB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Processor Series | QorIQ P1 | — |
| Processor Core | PowerPC e500v2 | Power Architecture e500v2 (dual-core) |
| Number of Cores | 1 | — |
| Core Architecture | 32-Bit Power Architecture | — |
| Maximum Core Frequency | 800 MHz | — |
| Process Technology | 45 nm CMOS | — |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet | Integrated GbE (multiple MACs) | 3x Gigabit Ethernet (eTSEC) |
| PCIe Controllers | PCIe Gen 2 (x1/x2/x4) | — |
| USB | USB 2.0 (host + device) | USB 2.0 |
| TDM Interfaces | 4 (T1/E1) | — |
| QUICC Engine (QE) | Yes (protocol offload) | — |
| SEC Security Accelerator | SEC 4.0 | — |
| Kemasan | 689-TEPBGA II (31x31 mm) with exposed thermal pad | 689-TEPBGA II (31x31 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (Tj) | 0C to +125C | — |
| Status RoHS | RoHS Compliant | — |
| Lead Free Status | Lead Free | — |
| Packaging | Tray | — |
| Processor Family | — | QorIQ P1 |
| CPU Frequency | — | 800 MHz per core |
| Core Count | — | 2 |
| Lebar Bus Data | — | 32-bit |
| Security Engine | — | SEC 4.x (IPsec/SSL offload) |
| QUICC Engine | — | Yes (TDM/HDLC/UART) |
| PCIe | — | PCIe Gen1 |
| TDM/HDLC | — | Yes (via QUICC Engine) |
| Suhu Operasi | — | 0C to +125C |
| Revision | — | R1.1 |
| Lead Free | — | Yes |
| RoHS | — | Compliant |