RTAX250SL-1CG624E vs RTAX250SL-1LG624E Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci RTAX250SL-1CG624E disebabkan oleh Microchip Technology dan RTAX250SL-1LG624E disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
RTAX250SL-1CG624E - 250K Gate Rad-Tolerant FPGA, CCGA-624 | Microchip
RTAX250SL-1CG624E ✓ AktifMicrochip Technology
RTAX250SL-1LG624E - 250K Gate Rad-Tolerant FPGA | Microchip
RTAX250SL-1LG624E ✓ AktifPengandingan Spesifikasi
| Parametr | RTAX250SL-1CG624E | RTAX250SL-1LG624E |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Equivalent System Gates | 250,000 gates | 250000 |
| Configurable Logic Blocks (CLBs) | 2816 | 2816 |
| Logic Cells | 4224 | 4224 |
| User I/O | 248 inputs / 248 outputs | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Maximum Combinatorial Delay (CLB) | 0.93 ns | — |
| Maximum System Frequency | 649 MHz | — |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS |
| Logic Family | CMOS | — |
| Kemasan | 624-ball Ceramic Column Grid Array (CCGA-624) | 624-Pin LGA (LG624), ceramic |
| Suhu Operasi | -55C to +125C | -55C to +125C |
| Radiation Tolerance | SEU-immune to specified LET threshold; SEU rate < 10-10 errors/bit-day | — |
| SEU Mitigation | SEU-hardened registers (no external TMR required) | — |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | Embedded SRAM with built-in FIFO control logic |
| Configuration | Live-at-power-up, true single-chip operation | — |
| Jenis Pemasangan | Surface Mount (ceramic column grid array) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O bank voltage] | — |
| Family | — | RTAX-SL Radiation-Tolerant FPGA |
| Maximum Frequency | — | 649 MHz |
| Speed Grade | — | -1 (fastest) |
| Configuration Type | — | One-time programmable, live at power-up |
| Clocking | — | Segmentable clocks, chip-wide routable reset |
| Packaging Option | — | Box |
| Target Market | — | Space flight systems |