STM32H7A3VIT6 vs STM32F767IGK6 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci STM32H7A3VIT6 disebabkan oleh STMicroelectronics dan STM32F767IGK6 disebabkan oleh STMicroelectronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

STMicroelectronics
STM32F767IGK6 STM32F767IGK6 - 216MHz Cortex-M7 MCU 1MB Flash 176+25UFBGA

STM32F767IGK6 - 216MHz Cortex-M7 MCU 1MB Flash 176+25UFBGA

STM32F767IGK6 ✓ Aktif

Pengandingan Spesifikasi

Parametr STM32H7A3VIT6 STM32F767IGK6
Merek STMicroelectronics STMicroelectronics
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Aktif
Core ARM Cortex-M7 (32-bit) —
Maximum CPU Clock 280 MHz —
Flash Memory 2 MB (2M x 8) —
SRAM 1.4 MB total (SRAM1/SRAM2/SRAM3/SRAM4 + DTCM + AXI SRAM) 512 KB (including 16 KB I-cache + 16 KB D-cache)
Supply Voltage (VDD) 1.62 V to 3.6 V —
Kemasan 100-pin LQFP (14x14 mm) 176+25 UFBGA (10 x 10 mm, ball grid)
Suhu Operasi -40 C to +85 C (industrial grade) -40 C to +85 C (Grade 6 suffix)
I/O Count (approx.) [DATA_NEEDED: I/O count] —
ADC 3 x 16-bit, up to 3.6 MSPS —
DAC 2 x 12-bit —
Timers [DATA_NEEDED: timer count details] Up to 18 (including 32-bit and motor-control timers)
Communication USB 2.0 FS+HS OTG, CAN FD, USART/UART, SPI, I2C, SAI, SDMMC, FMC —
Graphics Chrom-ART (DMA2D) accelerator, TFT-LCD controller (LTDC) —
Math Accelerators FMAC, CORDIC, single-precision hardware MAC —
Security Cryptographic accelerators, TRNG, secure boot support —
FPU Double-precision IEEE 754 —
Cache 16 KB I-cache + 16 KB D-cache —
Jenis Pemasangan Surface Mount —
Status RoHS Compliant Compliant
Aras MSL [DATA_NEEDED: MSL level] —
Core Architecture — ARM Cortex-M7 with FPU + DSP
Maximum CPU Frequency — 216 MHz
DMIPS / CoreMark — 462 DMIPS / 1082 CoreMark (per ST datasheet DM00273119 family docs)
Program Flash — 1 MB (1M x 8)
Operating Voltage — 1.7 V to 3.6 V
I/O Pins — 140 (in 176-pin package variant)
Package Pin Count — 176 functional + 25 ancillary balls = 201 balls total
Communication Interfaces — USB OTG FS/HS, CAN 2.0B x2, Ethernet MAC 10/100, SDMMC x2, USART/UART x8, SPI x6, I2C x4, SAI x2
Analog — 3x 12-bit ADC (2.4 MSPS each), 2x 12-bit DAC, temperature sensor, Vrefint
Graphics Acceleration — LTDC + DMA2D (Chrom-ART Accelerator)
Cryptography — AES-256, SHA-256, HMAC, TRNG (RNG)
Datasheet Family Document — STM32F765xx/F767xx/F768Ax/F769xx datasheet (document covers 176-pin LQFP/BGA variants of STM32F767IG)
Ordering Code Top Mark — STM32F767IGK6 - plastic UFBGA 10x10 mm, 176 pins, Grade 6 temperature, tape & reel

Laporan Datasheet & Sumber

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