XC6SLX16-2FTG256C vs XC6SLX16-2FTG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci XC6SLX16-2FTG256C disebabkan oleh AMD dan XC6SLX16-2FTG256I disebabkan oleh AMD. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
AMD
XC6SLX16-2FTG256I - 14,579-Cell Spartan-6 LX FPGA | AMD
XC6SLX16-2FTG256I ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | XC6SLX16-2FTG256C | XC6SLX16-2FTG256I |
|---|---|---|
| Merek | AMD | AMD |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Status Stok | In Stock | — |
| Harga Unit (USD) | $16.41 | — |
| Family | Spartan-6 LX | — |
| Logic Cells | 14,579 | 14,579 cells |
| Configurable Logic Blocks (CLBs) | 1,139 | — |
| Slices | 2,278 | — |
| Block RAM Bits | 589,824 bits | — |
| Block RAM Blocks (18 Kb) | 32 | — |
| DSP Slices (18×18 multipliers) | 32 | — |
| Maximum User I/Os | 186 | — |
| Maximum Single-Ended I/O Banks | 4 | — |
| Process Node | 45 nm CMOS, 9-metal layer | — |
| Speed Grade | -2 | -2 |
| Supply Voltage (Core) | 1.2 V nominal | — |
| Kemasan | 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch | FTGBGA-256 |
| Jenis Pemasangan | Surface Mount | — |
| Suhu Operasi | 0 °C to +85 °C (Commercial) | 0°C to 85°C |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration Modes | JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel | — |
| Clock Management Tiles (CMTs) | 2 (each with PLL + MMCM) | — |
| PCIe Support | Soft IP only (no integrated PCIe hard cores) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Spartan-6 LX |
| Configurable Logic Blocks | — | 1,139 CLBs |
| Adaptive Logic Modules | — | 2,278 ALMs |
| User I/Os | — | 186 I/Os |
| Internal Frequency | — | 667 MHz |
| Additional Stated Frequency | — | 375 MHz |
| Core Supply Voltage | — | 1.14 V to 1.26 V |
| Process Technology | — | CMOS |
| Package Body Size | — | 17 mm x 17 mm |
| Package Ball Pitch | — | 1.00 mm |
| Lead-Free Status | — | Lead free |
| Embedded Resources | — | DCM, PLL, block RAM, and DSP |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance] |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |