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SEMI projects 300 mm front-end fab equipment spend rising to $149B in 2026 (+31% YoY) and $227B in 2029, with 20 new fabs/lines starting construction in 2026.
ERS electronic has delivered a fully automated 310x310mm PLP system that runs bonding, debonding and detaping in a single platform at 13 panels per hour, removing inter-tool transfers between three thermally critical steps.
GlobalFoundries re-enters the advanced-node conversation with FDX Fusion, a 7 nm-class FD-SOI platform. Engineers get a low-power option, buyers get a second source angle.
Barbara Mazzolai of IIT outlines a manifesto calling for robots designed from the start for reuse, recycling, or biodegradation, with implications for hardware material choices.
Rhizomatica's HERMES digital HF radio and Mercury modem push shortwave beyond voice, supporting encrypted file transfers for telemedicine and distress signaling 100-200 km offshore.
IEEE's 166-expert report flags AI as general-purpose infrastructure and names personalized medicine, energy storage and physical AI as the highest-impact bets through 2030, with design and sourcing ripple effects for engineers.
INNO3D launches the 6U AGS-6220V2 rack server with eight PCIe Gen 5 RTX PRO 6000 Blackwell Server Edition GPUs, aimed at AI training and inference fleets.
ASUS launches a 64 GB variant of the Ascent GX10 compact AI supercomputer built on NVIDIA DGX Spark, targeting more developers running 30-35B class models.
Akasa launches a fully passive aluminium Mini-ITX chassis with an integrated 220 W DC-DC board and dual 2.5" bays, aimed at POS, kiosks and edge boxes running Intel LGA1851 through LGA115X CPUs up to 35 W TDP.
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