CY8C5568LTI-114 - 67MHz 256KB Flash PSoC 5 MCU | Infineon
MPN: CY8C5568LTI-114 ✓ AktifCY8C5568LTI-114 Ringkasan
A programmable system-on-chip, or PSoC, combines a microcontroller core with programmable analog and digital blocks on one integrated circuit. This device belongs to the PSoC 5 family and provides ARM Cortex-M3 processing with 256KB of embedded flash. The architecture allows engineers to configure peripheral functions for sensing, control, communications, and signal conditioning while reducing the number of discrete components required in a design.
The CY8C5568LTI-114 supports operation from DC to 67 MHz and is specified as a single-core 32-bit microcontroller. Its 68-QFN package includes an exposed pad according to the product description, providing a thermal and electrical connection from the device to the PCB. The package is intended for surface-mount assembly and uses an 8 mm by 8 mm land pattern. The integrated programmable architecture is useful where analog sensing, digital control, and communication functions must share one microcontroller platform.
The PSoC 5 architecture is designed for embedded control systems that need both deterministic digital processing and configurable peripheral behavior. A 256KB flash memory capacity supports application firmware, configuration data, and control routines in a single package. The ARM Cortex-M3 core provides a familiar 32-bit instruction set, while the PSoC programmable blocks can consolidate functions such as timers, serial interfaces, analog conversions, and digital signal processing. Exact peripheral assignments depend on the device configuration and firmware.
Typical applications include industrial sensing and factory automation, building control systems, medical monitoring equipment, consumer energy-management products, communications equipment, and compact embedded control modules. In each case, the device can combine application firmware with configurable peripheral resources rather than relying on a large collection of dedicated support chips. The 67 MHz operating capability provides useful performance margin for control loops, protocol handling, and supervisory logic.
When designing a PCB around the CY8C5568LTI-114, follow the manufacturer package drawing and land-pattern guidance, including the exposed-pad connection and thermal via arrangement. Keep sensitive analog routes away from high-current switching paths, provide the required bypass capacitors close to the power pins, and confirm the selected voltage conditions against the complete device datasheet. The exposed pad should be connected according to the recommended land pattern rather than treated as an optional mechanical feature.
This product page combines the manufacturer part identity, package information, technical specifications, application guidance, and comparison considerations into a practical design reference. Review the exact pin assignment, electrical limits, programming procedure, and exposed-pad requirements in the manufacturer documentation before finalizing a production design.
Pilihan pengganti yang segera untuk CY8C5568LTI-114 — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
CY8C5568LTI-114
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak DisahkanHubungi untuk harga
Lihat Datasheet →CY8C5568LTI-113
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
CY8C5567LTI-114
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
CY8C5467LTI-007
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →CY8C5868LTI-LP038
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
CY8C5568LTI-114 Penilaian maksimum & Ciri-ciri Elektrik
| Core Processor | ARM Cortex-M3, 32-bit |
| Maximum Operating Frequency | 67 MHz |
| Operating Frequency Range | DC to 67 MHz |
| Flash Memory | 256KB (256K x 8) |
| Architecture | PSoC 5 CY8C55 |
| Programmable System-on-Chip | Yes |
| Core Count | Single-core |
| Tegangan Pemberi Arus | 1.8 V, 3.3 V, or 5 V |
| Kemasan | 68-pin QFN (8 mm x 8 mm) |
| Package Type | 68-VFQFN with exposed pad |
| Jenis Pemasangan | Surface mount |
| Programmable Analog and Digital Resources | Configurable PSoC peripheral blocks |
Panduan Konfigurasi Pin CY8C5568LTI-114 68-vfqfn with exposed pad
Konfigurasi pin untuk CY8C5568LTI-114 (68-vfqfn with exposed pad pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk CY8C5568LTI-114.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
CY8C5568LTI-114 patut untuk 6 aplikasis: Industrial Sensor and Control Node, Building Automation Controller, Medical Monitoring Equipment, Energy Management Device, Communications Interface Module, Robotics and Motor Control.
Industrial Sensor and Control Node
The CY8C5568LTI-114 fits industrial sensing nodes that combine analog measurement, digital filtering, and control logic in one compact microcontroller. Its ARM Cortex-M3 core can operate up to 67 MHz for protocol handling and supervisory routines, while the PSoC architecture provides configurable peripheral blocks that can reduce the need for separate analog and timing components. The 256KB flash capacity supports application firmware, configuration data, calibration tables, and communication stacks. The 68-QFN 8 mm by 8 mm package is useful in compact controller boards where board area is limited. Use the manufacturer land pattern with proper exposed-pad and via treatment, and confirm the industrial temperature, isolation, and regulatory requirements before deployment.
Disebarkan
Building Automation Controller
For building controls, the CY8C5568LTI-114 can consolidate sensor input processing, timer functions, communication handling, and actuator control. The 67 MHz Cortex-M3 performance provides margin for control-loop tasks and communication overhead, while configurable PSoC blocks allow the peripheral arrangement to follow the product architecture rather than a fixed discrete-function layout. Its 256KB flash provides room for application code and field configuration. The 68-QFN package supports compact DIN-module and distributed-controller designs. Confirm low-power behavior during idle periods, ensure robust I/O protection at the board interface, and validate the exact package and exposed-pad construction against the manufacturer drawing.
Disebarkan
Medical Monitoring Equipment
The CY8C5568LTI-114 can serve as the control processor in compact medical monitoring equipment that combines sensor acquisition, signal processing, status reporting, and user-interface support. The PSoC architecture is valuable when a design needs configurable analog and digital functions without relying on a large discrete support circuit. A 67 MHz Cortex-M3 core and 256KB flash support real-time acquisition routines and application firmware. Medical designs must additionally establish electrical isolation, patient protection, electromagnetic compatibility, and applicable quality requirements outside the microcontroller datasheet. Verify the operating temperature range, leakage-sensitive I/O behavior, and exposed-pad thermal design for the final enclosure.
Disebarkan
Energy Management Device
The CY8C5568LTI-114 is appropriate for compact energy-management devices that monitor multiple inputs, apply control algorithms, and report operating information over a communications interface. Configurable PSoC resources can support timing, signal conditioning, and serial functions, while the 32-bit Cortex-M3 core running up to 67 MHz provides capacity for metering algorithms and supervisory logic. The 256KB flash can hold firmware, calibration parameters, and communication configuration. In metering products, maintain separation between sensing and power paths, validate accuracy at every relevant input level, and account for regulator heat dissipation. The small 68-QFN footprint also supports compact energy-management modules.
Disebarkan
Communications Interface Module
The CY8C5568LTI-114 can support communications-oriented embedded modules that coordinate serial protocols, configuration, logging, and application-specific control. Its 67 MHz ARM Cortex-M3 performance is suitable for protocol servicing and event processing, while PSoC programmable blocks provide flexible timing and signal-path resources. The 256KB flash capacity accommodates firmware, protocol tables, and upgrade handling. Designers should use the appropriate transceiver or network companion component for physical-layer requirements, then verify timing, logic levels, isolation, and impedance constraints at the board level. The 8 mm by 8 mm QFN footprint supports dense module designs but requires a thermal path through the exposed pad.
Disebarkan
Robotics and Motor Control
The CY8C5568LTI-114 can act as a supervisory controller in robotics and compact motor-control systems, processing sensor inputs, coordinating motion sequences, and managing communication between modules. The 67 MHz Cortex-M3 core supports control software and diagnostic logic, while programmable PSoC peripherals can support timing and mixed-signal functions around the MCU. The 256KB flash provides sufficient room for motion routines, parameter storage, and network handlers. High-current motor paths must remain separate from sensitive sensing and logic sections, and protective components must be selected for the required bus voltages and fault energies. Confirm real-time timing, thermal limits, and exposed-pad performance at the highest expected ambient temperature.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk CY8C5568LTI-114 — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | CY8C5568LTI-114 | CY8C5568LTI-113 | CY8C5567LTI-114 | CY8C5467LTI-007 | CY8C5868LTI-LP038 |
|---|---|---|---|---|---|---|
| Package | 68-QFN (8 mm x 8 mm) | 68-QFN (8 mm x 8 mm) | 68-QFN (8 mm x 8 mm) | 68-QFN (8 mm x 8 mm) | 68-pin surface-mount package | 68-pin surface-mount package |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Architecture | PSoC 5 CY8C55 | PSoC 5 CY8C55 | PSoC 5 family | PSoC 5 family | PSoC 5 | PSoC 5 |
| Mounting Type | Surface mount | Surface mount | Surface mount | Surface mount | Surface mount | Surface mount |
| Price Tier | Request a Quote | Request a Quote | Request a Quote | Request a Quote | Request a Quote | Request a Quote |
Penyeberangsung Jelas
- Identified 67 MHz operating capability (vsCY8C5868LTI-LP038)
- Established 256KB flash configuration (vsCY8C5467LTI-007)
- Single-core Cortex-M3 PSoC 5 architecture (vsCY8C5868LTI-LP038)
Catatan Desain
Use the manufacturer land pattern for the 68-pin 8 mm by 8 mm QFN, including the exposed-pad dimensions, solder-mask clearance, and paste pattern. Do not substitute a generic 68-pin QFN footprint without checking mechanical drawings. Place input and output decoupling capacitors close to the relevant supply pins and route high-current or switching-node connections away from sensitive signal paths.
The exposed pad is an important thermal path. Fill or connect the pad as directed by the package documentation and use a controlled via pattern that balances electrical and thermal requirements. Estimate junction temperature from actual processing load, supply voltage, ambient temperature, and board copper area; the device datasheet and the actual PCB stack-up are required for a defensible thermal estimate.
Do not treat a family comparison as proof of drop-in compatibility. Confirm pin names, power pins, ground connections, boot or programming signals, exposed-pad construction, flash capacity, peripheral resources, and operating limits for each candidate. In particular, CY8C5467LTI-007 and CY8C5868LTI-LP038 require direct comparison with the target before schematic substitution.
Maklumat Kesediaan
Compliance status is not stated in the available component information. Confirm the current declarations and material declarations with the manufacturer before production release.
