EP1M350F780C7N - 350K Gate Mercury FPGA 1.25Gbps CDR 780-FBGA
MPN: EP1M350F780C7N ✗ Akhir HayatEP1M350F780C7N Ringkasan
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit within the programmable logic hierarchy (PLD > CPLD > FPGA) and are commonly used to prototype ASIC functionality, accelerate parallel processing, and bridge high-speed serial protocols. The Mercury device family specifically targets applications that need high-speed serial transceivers integrated with logic fabric, allowing engineers to reduce board area and BOM by eliminating external PHY devices.
Key features include 14,400 logic cells backed by a LUT-based architecture optimized for register-rich designs, embedded SRAM, dedicated phase-locked loops (PLLs), and up to eight channels of 1.25 Gbps CDR-capable serial transceivers. The remaining transceiver channels support data rates up to 1.0 Gbps. The 780-pin FC-FBGA package provides 486 user I/Os at a 1.0 mm terminal pitch, supporting robust signal routing for high-pin-count memory buses and parallel interfaces.
Architecturally, the EP1M350 uses a CMOS process with embedded transceiver macros and lookup-table (LUT) logic elements. The transceivers integrate serializer/deserializer (SERDES) blocks, clock-data recovery loops, and word-align logic, enabling protocols such as Gigabit Ethernet, PCI Express, RapidIO, and SONET/SDH. Internal PLLs generate the high-frequency clocks required by the transceivers, and on-chip termination simplifies PCB routing by reducing external component count.
Typical applications include high-speed serial backplane prototyping, telecommunications line cards, industrial imaging and video processing, embedded DSP co-processing, and ASIC prototyping for networking ASICs. The combination of integrated 1.25 Gbps transceivers and ample logic density makes the EP1M350F780C7N a common choice for designers transitioning from discrete SERDES implementations to a single-chip solution.
When designing with the EP1M350F780C7N, pay close attention to PCB layout for the 1.0 mm-pitch BGA - the FC-FBGA package requires via-in-pad or microvia technology for reliable assembly. Decoupling for the transceiver supply rails must follow the Mercury device reference design to meet jitter and noise budgets. Designers should verify signal integrity with IBIS models and constrain high-speed serial channels appropriately.
This page synthesizes distributor stock and pricing data, drop-in Mercury-family alternatives that share the 780-FBGA footprint, and practical design guidance not collated in the original Altera Mercury datasheet, providing a single reference for sourcing and substitution.
Pilihan pengganti yang segera untuk EP1M350F780C7N — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera EP1M350F780C7N (sama faktor bentuk dan kaki) — berbeza dalam Package, Operating Temperature, Family, Speed Grade, Package Type.
EP1M350F780C7
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP1M350F780C7ES
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP1M350F780C6N
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP1M350F780C5N
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP1M350F780C6
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP1M350F780C7N Penilaian maksimum & Ciri-ciri Elektrik
| Family | Mercury (EP1M350) |
| Device Type | FPGA / Loadable PLD |
| Logic Cells | 14,400 |
| Gate Count | 350,000 |
| Core Supply Voltage | 1.8 V |
| User I/Os | 486 |
| Total Pins | 780 |
| Package Type | FC-FBGA / FINE LINE BGA-780 |
| Terminal Pitch | 1.0 mm |
| Speed Grade | C7 (-7 commercial) |
| Suhu Operasi | 0 C to 85 C (commercial) |
| Logic Family | CMOS |
| Transceivers | Up to 18 channels, 1.25 Gbps CDR |
| Architecture | LUT-based, register-rich |
Panduan Konfigurasi Pin EP1M350F780C7N fc-fbga / fine line bga-780
Konfigurasi pin untuk EP1M350F780C7N (fc-fbga / fine line bga-780 pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk EP1M350F780C7N.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
EP1M350F780C7N patut untuk 6 aplikasis: High-Speed Serial Backplane Prototyping, Telecommunications Line Cards, ASIC Prototyping for Networking ASICs, Industrial Imaging and Video Processing, Embedded DSP Co-Processing, Test and Measurement Instrumentation.
High-Speed Serial Backplane Prototyping
The EP1M350F780C7N's integrated 1.25 Gbps CDR-capable transceivers make it ideal for serial backplane prototyping in telecom and datacom systems. With 18 SERDES channels and built-in clock data recovery, designers can implement multi-gigabit interconnect across a backplane without external PHY chips, reducing BOM and PCB complexity. The 14,400 logic cells provide sufficient fabric for PCS, framer, and link-layer state machines, while the 486 user I/Os handle parallel sideband signals and management interfaces.
Disebarkan
Telecommunications Line Cards
The EP1M350F780C7N is well suited for telecom line cards requiring aggregation of multiple serial links with protocol processing. Its 1.25 Gbps SERDES supports SONET OC-24, Gigabit Ethernet, and RapidIO; the abundant logic fabric implements MAC/PHY bridging, traffic shaping, and QoS functions. Operating from a 1.8V core at 0-85 C, it meets central-office environmental requirements, while the 780-FBGA package provides the high I/O count needed for backplane connector and tributary interfaces.
Disebarkan
ASIC Prototyping for Networking ASICs
The EP1M350F780C7N serves as a fast-turnaround prototype vehicle for networking ASICs, with 14,400 logic cells reproducing medium-complexity ASIC functions at FPGA speed. Integrated 1.25 Gbps transceivers emulate serial ASIC I/O, allowing pre-silicon firmware development and validation of multi-port Ethernet switches, routers, or security co-processors. Engineers map ASIC RTL to FPGA logic and leverage the same SERDES to verify PHY behavior before ASIC tape-out.
Disebarkan
Industrial Imaging and Video Processing
Industrial imaging and machine vision systems leverage the EP1M350F780C7N's logic density and parallel I/O count to process high-resolution video streams in real time. The 486 user I/Os interface to camera sensors, SDRAM buffers, and display panels, while 14,400 logic cells implement image pipelines, color conversion, and feature-extraction algorithms. Integrated SERDES enables transfer of processed frames over GigE Vision or CoaXPress links.
Disebarkan
Embedded DSP Co-Processing
The EP1M350F780C7N functions as a DSP co-processor alongside microcontrollers or DSPs in radar, sonar, and signal-intelligence applications. The LUT-based fabric delivers parallel multiply-accumulate capability for FFT, FIR, and correlator operations, while integrated transceivers stream ADC data at 1.0-1.25 Gbps to FPGA-internal DSP pipelines. The 780-FBGA exposes the high I/O bandwidth needed for memory expansion and host CPU handshaking.
Disebarkan
Test and Measurement Instrumentation
Test-equipment manufacturers use the EP1M350F780C7N as the control and pattern-generation engine in protocol analyzers and bit-error-rate testers. The 1.25 Gbps SERDES generates and analyzes PRBS patterns at gigabit rates, while abundant logic cells implement protocol-aware decoding. High pin count accommodates front-panel connectors and high-speed probes, and the 1.8V core simplifies thermal design in bench-top chassis.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk EP1M350F780C7N — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | EP1M350F780C7 | EP1M350F780C7ES | EP1M350F780C6N | EP1M350F780C5N | EP1M350F780C6 |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-780 | FC-FBGA-780 | FC-FBGA-780 | FC-FBGA-780 | FC-FBGA-780 | FC-FBGA-780 |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | -7 (C7) | -7 (C7) | -7 (C7 ES) | -6 (C6) | -5 (C5) | -6 (C6) |
| Lead-Free (N) Suffix | Yes | No | No | Yes | Yes | No |
| Logic Cells | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 |
| Gate Count | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 |
| User I/Os | 486 | 486 | 486 | 486 | 486 | |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Transceivers (max) | 18 ch, 1.25 Gbps | 18 ch, 1.25 Gbps | 18 ch, 1.25 Gbps | 18 ch, 1.25 Gbps | 18 ch, 1.25 Gbps | 18 ch, 1.25 Gbps |
Penyeberangsung Jelas
- Same die, lower speed grade enables cost reduction when -7 is over-spec (vsEP1M350F780C6N)
- Engineering-sample option for early prototyping (vsEP1M350F780C7ES)
- Lead-free terminal finish aligns with RoHS reflow (vsEP1M350F780C7)
Catatan Desain
The 780-ball FC-FBGA package at 1.0 mm terminal pitch requires via-in-pad or microvia PCB technology for reliable assembly. Per the Mercury device package guidelines, designers should allocate at least four inner routing layers for signal escape and use 0.5 mm-pitch dog-bone fanouts. The center of the BGA is a thermal pad that must be soldered to a thermal copper pour with thermal vias (0.3 mm drill, 1.0 mm pitch) for heat dissipation.
High-speed 1.25 Gbps SERDES channels demand controlled-impedance routing (100 ohm differential) with intra-pair skew under 1 ps per inch. Per the Mercury datasheet, transceiver channels should be routed on the top or bottom layers with continuous ground reference, and length-matched within a tolerance of approximately 50 mil across all differential pairs in the same channel. Keep AC-coupling capacitors close to the FPGA receiver pins.
Do not assume lead-free (N-suffix) and non-lead-free parts share identical reflow profiles; verify peak temperature and soak times against the JEDEC J-STD-020 profile for the specific terminal finish. Mixed-finish BGA balls can cause head-in-pillow defects during lead-free reflow. Also, ensure the configuration mode pins (MSEL) are tied to the correct logic levels to select the desired configuration scheme.
Maklumat Kesediaan
N-suffix designates lead-free terminal finish. RoHS, REACH, halogen-free, and conflict-minerals declarations were not present in the Verified Web Data and are marked unknown. AEC-Q100 is not applicable since this is a commercial-grade FPGA. Operating temperature 0-85 C places it in the commercial (not automotive) grade.
