EP3C10U256C7N - 10,320-Cell 437.5MHz FPGA | Altera
MPN: EP3C10U256C7N ✓ AktifEP3C10U256C7N Ringkasan
A field-programmable gate array, or FPGA, is a reconfigurable semiconductor categorized within programmable logic devices, digital logic ICs, and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic elements, memory resources, and I/O blocks in one device. Designers can implement control logic, signal processing, protocol handling, and hardware acceleration, then update the configuration to support design revisions or field adaptation.
The Cyclone III architecture provides 10,320 logic cells organized into 645 logic array blocks. With 182 available I/Os, the EP3C10U256C7N can support substantial external connectivity while retaining the low power consumption associated with a 1.15 V to 1.25 V supply range. The stated 437.5 MHz maximum frequency establishes the device's speed class, although achievable system clock rates depend on the selected logic, routing requirements, memory interface, I/O standards, and timing constraints.
This 256-LFBGA version is identified with the N suffix and uses a 256-ball surface-mount package. The package is intended for compact embedded boards where a large leaded package would be impractical. Because the density of programmable interconnect and power connections makes PCB layout and thermal design important, engineers should follow the manufacturer's pin-connection, decoupling, configuration, and PCB-layout guidance when creating a new carrier board.
Typical uses include industrial automation, data acquisition, communications infrastructure, test and measurement equipment, and embedded control systems. The combination of 10,320 logic cells and 182 I/Os suits parallel interface logic, state machines, protocol bridges, and custom signal-processing pipelines. The 1.2 V-class supply also helps reduce power requirements compared with higher-voltage programmable logic families.
The primary design consideration is configuration and power integrity. Follow the Cyclone III power-supply recommendations, place decoupling capacitors according to the manufacturer pin table, and route configuration signals away from sensitive high-speed inputs. Verify every BGA escape route, voltage level, and I/O standard before fabrication because package-level changes can invalidate an otherwise compatible design.
This product page combines the core device specifications, package constraints, application guidance, and verified same-footprint alternatives. It also highlights replacement decisions that require review of package construction, logic resources, I/O count, temperature grade, and configuration compatibility rather than relying on the family name alone.
Pilihan pengganti yang segera untuk EP3C10U256C7N — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera EP3C10U256C7N (sama faktor bentuk dan kaki) — berbeza dalam Core Supply Voltage, Device Type, Logic Elements, Package Shape.
EP3C10U256C7
✅ Masuk Drop-InHubungi untuk harga
EP3C10U256I7N
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
EP3C10U256C6N
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP3C10U256C7N Penilaian maksimum & Ciri-ciri Elektrik
| Device Type | FPGA |
| FPGA Family | Cyclone III |
| Logic Elements | 10,320 cells |
| Logic Array Blocks | 645 LABs |
| Maximum Frequency | 437.5 MHz |
| I/O Count | 182 I/Os |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Process Technology | 65 nm |
| Kemasan | 256-LFBGA |
| Terminal Count | 256 balls |
| Package Shape | Rectangular |
| Jenis Pemasangan | Surface mount |
| Suhu Operasi | 0°C to 85°C junction temperature |
| Part Status | Active |
| Programmable Status | Not verified |
Panduan Konfigurasi Pin EP3C10U256C7N rectangular
Konfigurasi pin untuk EP3C10U256C7N (rectangular pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk EP3C10U256C7N.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
EP3C10U256C7N patut untuk 6 aplikasis: Industrial Data Acquisition, Programmable Logic Control, Communications Protocol Bridging, Test and Measurement Equipment, Embedded Signal Processing, Security and Access Control.
Industrial Data Acquisition
The EP3C10U256C7N fits multi-channel data-acquisition systems that require simultaneous digital control, buffering, and interface management. Its 182 I/Os provide substantial board-level connectivity, while 10,320 logic cells and 645 LABs can implement counters, acquisition state machines, trigger logic, data formatting, and communication engines. The 1.15 V to 1.25 V core range supports efficient power distribution in embedded systems. For implementation, assign I/O standards according to the external analog and digital interfaces, use the manufacturer’s configuration and power connections, and reserve board resources for the device’s full 256-LFBGA footprint.
Disebarkan
Programmable Logic Control
The Cyclone III EP3C10U256C7N is appropriate for industrial control logic that combines sequencing, conditional branching, counters, and peripheral control. A 437.5 MHz device speed class provides substantial timing margin for parallel control paths, while 645 LABs and 10,320 logic cells can host several cooperating state machines. The 182 I/Os allow connection to sensors, actuators, counters, and field buses without external programmable logic. Designers should partition critical timing paths, constrain the clock domains, and verify each external interface's voltage and standard against the manufacturer pin table.
Disebarkan
Communications Protocol Bridging
The EP3C10U256C7N can implement parallel-to-serial conversion, packet framing, state management, and buffer control for communications equipment. Its 10,320 logic cells allow multiple protocol engines and control blocks to operate concurrently, while 182 I/Os support parallel processors, transceivers, and memory interfaces. The 1.15 V to 1.25 V core supply helps limit system power in space-constrained equipment. Clock-domain crossings, I/O timing, and signal-integrity constraints must be reviewed carefully, while the 256-LFBGA layout should include clean power and ground distribution around the device.
Disebarkan
Test and Measurement Equipment
The EP3C10U256C7N supports programmable counters, timing engines, stimulus sequencing, result processing, and display or communications control in test and measurement instruments. A 437.5 MHz speed class is useful for parallel timing logic, while 182 I/Os allow dense connection to converters, memories, relay drivers, and front-panel controllers. Its 256-LFBGA format also supports compact instrument designs, although assembly and rework processes must accommodate BGA inspection requirements. Validate timing margins, external voltage standards, and thermal performance at the highest operating frequency and I/O activity anticipated in the finished instrument.
Disebarkan
Embedded Signal Processing
The EP3C10U256C7N can implement fixed-point filters, correlation functions, digital conversions, and custom data pipelines when static resources meet the design's requirements. Its 10,320 logic cells and 645 LABs provide parallel arithmetic and control blocks, while 182 I/Os support streaming data and accelerator peripherals. The 437.5 MHz device class permits pipelined implementations, although real throughput depends on logic depth, routing congestion, memory inference, and timing closure. Establish arithmetic throughput and latency targets before implementation, then confirm DSP, memory, and clock resources in the device compilation results.
Disebarkan
Security and Access Control
The EP3C10U256C7N is suitable for access-control and industrial security controllers that require parallel I/O, protocol handling, event logging, and configurable logic. The 182 I/Os can connect card readers, sensors, displays, lock drivers, and network-interface components, while 10,320 logic cells support protocol state machines and control functions. The compact 256-LFBGA helps reduce board area, but security-critical designs require separate attention to access protection, configuration storage, fault handling, and lifecycle security. Validate these controls against the product's applicable system requirements rather than treating FPGA configuration alone as a security guarantee.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk EP3C10U256C7N — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | EP3C10U256C7 | EP3C10U256I7N | EP3C10U256C6N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
Penyeberangsung Jelas
- Matches the closest same-family ordering code across the principal core parameters (vsEP3C10U256C7)
- Retains the same logic capacity and speed class with a different temperature-grade code (vsEP3C10U256I7N)
- Provides a compact high-density implementation for parallel programmable logic (vsEP3C10U256C6N)
Catatan Desain
Design the board against the manufacturer’s 256-LFBGA footprint and verify every ball assignment against the EP3C10U256C7N pin-connection table. Pay particular attention to configuration pins, clock inputs, supply rails, and ground balls. Route each supply and ground connection directly to the corresponding plane or decoupling network with minimal loop area. Because a BGA footprint can look mechanically interchangeable while differing in ball-map details, do not approve the PCB until a net-by-net comparison is complete.
Follow the Cyclone III power-supply and decoupling guidance for the 1.15 V to 1.25 V core range and any auxiliary I/O rails. Place the required decoupling capacitance close to the device’s power balls and use a low-impedance distribution structure that separates noisy loads from sensitive core connections. Account for startup current, configuration-state demand, and the difference between quiescent and active power rather than sizing the supply only from average consumption.
Keep configuration, clock, and high-speed interface routes away from noisy switching nodes and maintain continuous ground references beneath signal paths. Apply the manufacturer’s recommended fanout and via rules for the 256-LFBGA, and check assembly clearances around the package. Differential or source-synchronous interfaces require length and impedance control based on the selected I/O standard. After PCB completion, compare the fabrication stack-up and BGA lands with the released package drawing to prevent footprint drift.
Do not treat a matching package name as proof that two FPGA ordering codes are interchangeable. Verify the logic-element total, LAB count, memory resources, multiplier resources, supported I/O standards, configuration method, pin definitions, timing specifications, and temperature grade. A replacement may require recompilation even when the PCB footprint is unchanged. For EP3C10U256C7N alternatives, document every suffix difference and approve the substitution before releasing the design for production.
Maklumat Kesediaan
No definitive RoHS, REACH, lead-free, halogen-free, or conflict-minerals declaration was identified for the exact ordering code. The N suffix alone was not treated as proof of lead-free status. AEC-Q100 is not applicable to this commercial Cyclone III FPGA ordering code.
