EP3C16E144C7 - Cyclone III FPGA, 84 I/O | Intel | Industrial
MPN: EP3C16E144C7 ✓ AktifEP3C16E144C7 Ringkasan
A field-programmable gate array is a digital semiconductor whose logic, interconnections, and selected I/O behavior are configured after manufacture. FPGA belongs to the programmable-logic hierarchy: FPGA → programmable-logic device → digital semiconductor. Compared with a fixed-function application-specific integrated circuit, an FPGA permits design revisions, faster prototyping, and consolidation of multiple control blocks into one configurable device. The Cyclone III family targets general industrial, communications, consumer, and embedded-control applications.
The EP3C16E144C7 provides 84 I/O in a 144-terminal surface-mount LQFP package. The exposed pad supports thermal dissipation by connecting the package thermal structure to a PCB copper plane, although the exact exposed-pad dimensions and recommended land pattern must be checked in the official device documentation. Its device marking combines the Cyclone III EP3C16 designation with package, speed, and temperature option codes, so engineers should verify the complete ordering information before substitution.
The verified distributor records identify this part as an FPGA IC with 84 I/O, 516096 bits of embedded memory, 15408, and a 144-LQFP exposed-pad package. The supplied search record does not expose the complete definition of every numeric field, so detailed logic-element, voltage, timing, and thermal figures should not be inferred from the search snippets. The listed manufacturer designation is Altera, now part of Intel's programmable-solutions portfolio.
Typical uses include industrial control logic, data-acquisition systems, embedded communications, test equipment, and general-purpose digital signal processing. The 84 available I/O make the device suitable for designs connecting external sensors, converters, memories, transceivers, and human-interface logic while keeping timing and behavior programmable. Designers should establish timing closure and resource utilization with the appropriate Intel Quartus or equivalent FPGA development environment.
The main design consideration is package-level thermal management. The 144-LQFP exposed pad requires the PCB footprint and copper area to follow the official package drawing, including thermal-via recommendations where specified. Signal integrity also depends on assigning pins according to the device's bank rules, supply requirements, and supported I/O standards rather than treating all 84 I/O as electrically interchangeable.
This page consolidates distributor availability, package information, verified pricing, same-family drop-in options, and practical selection guidance. It also distinguishes confirmed facts from parameters that still require confirmation in the official Cyclone III device handbook or datasheet, helping engineers avoid unsupported assumptions when planning a prototype or production transition.
Pilihan pengganti yang segera untuk EP3C16E144C7 — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera EP3C16E144C7 (sama faktor bentuk dan kaki) — berbeza dalam Package.
EP3C16E144C7N
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
EP3C16E144C8N
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak DisahkanHubungi untuk harga
Lihat Datasheet →EP3C16E144C8N
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak DisahkanHubungi untuk harga
Lihat Datasheet →EP3C16E144C6
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EP3C16E144C6N
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EP3C16E144C7 Penilaian maksimum & Ciri-ciri Elektrik
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| User I/O Count | 84 I/O |
| Reported Embedded Memory | 516096 bit |
| Kemasan | 144-LQFP Exposed Pad |
| Number of Terminals | 144 terminals |
| Package Code | LFQFP |
| Package Shape | Square |
| Terminal Form | Gull wing |
| Jenis Pemasangan | Surface mount |
Panduan Konfigurasi Pin EP3C16E144C7 square
Konfigurasi pin untuk EP3C16E144C7 (square pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk EP3C16E144C7.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
EP3C16E144C7 patut untuk 6 aplikasis: Industrial Control Logic, Industrial Data Acquisition, Embedded Communications Gateway, Programmable Test and Measurement, LED and Display Control, General-Purpose Digital Signal Processing.
Industrial Control Logic
The EP3C16E144C7 fits programmable industrial-control logic because it combines a Cyclone III FPGA architecture with 84 user I/O in a 144-LQFP exposed-pad package. Those I/O can support digital inputs, machine outputs, interlocks, status indicators, and external control interfaces while programmable logic handles sequencing and fault handling. The exposed pad provides the thermal path needed for an industrial board, but copper-area and thermal-via implementation must follow the official package drawing. Because the verified record does not state the exact temperature grade or I/O voltage, those requirements must be checked against the selected ordering option before production release.
Disebarkan
Industrial Data Acquisition
The EP3C16E144C7 is suitable for parallel data-acquisition front ends where multiple sensors, counters, or converters must feed programmable processing logic. Its 84 user I/O provide external connections for digital channels, timing signals, and acquisition control, while FPGA logic can implement counters, state machines, filtering, and data packing. The 144-LQFP exposed-pad package supports a compact surface-mount implementation, although signal-integrity work is required for high-speed inputs. Engineers must use the official bank and I/O-standard tables to assign voltage-sensitive pins and confirm timing closure rather than assuming all 84 I/O support the same interface.
Disebarkan
Embedded Communications Gateway
The EP3C16E144C7 can implement protocol conversion, framing, buffering, and command-routing functions in embedded communication equipment. Its 84 I/O provide parallel connectivity for transceivers, status registers, and host interfaces, while programmable logic allows interface behavior to be updated without a PCB revision. The Cyclone III device is particularly useful when several fixed protocol blocks need a common timing and state-control framework. Designers should confirm supported I/O standards, clock resources, and configuration requirements in the official Cyclone III documentation. The LQFP exposed pad should be connected to the prescribed PCB thermal structure rather than treated as an optional copper feature.
Disebarkan
Programmable Test and Measurement
The EP3C16E144C7 applies to test and measurement systems requiring adaptable sequencing, pattern generation, capture logic, and instrument-control functions. The 84 user I/O can connect programmable stimulus, trigger, status, and acquisition circuits, while FPGA logic executes deterministic control sequences. Using the same device for several logic blocks can reduce external component count and simplify timing coordination compared with separate fixed-function controllers. The 144-LQFP exposed-pad package requires careful layout to maintain thermal margin. Validation must include timing analysis for every I/O standard and confirmation that the selected EP3C16E144 option meets the instrument's environmental requirements.
Disebarkan
LED and Display Control
The EP3C16E144C7 can implement display refresh, pixel sequencing, brightness timing, and keypad-scanning logic in programmable LED or display systems. The 84 user I/O are useful for parallel row, column, control, and synchronization signals, while programmable state machines coordinate scanning and fault handling. Because an FPGA permits timing and panel behavior to be revised after hardware fabrication, it can shorten product-development cycles for varied display configurations. The exposed pad must be connected to an adequate thermal-via and copper pattern. Engineers should verify each assigned pin against the official I/O-standard table and ensure timing margins remain valid across the selected speed grade.
Disebarkan
General-Purpose Digital Signal Processing
The EP3C16E144C7 can support digital filtering, correlation, waveform generation, or custom accelerator logic when the required arithmetic fits the device's confirmed resources. Programmable parallelism makes an FPGA suitable for deterministic control blocks that need multiple simultaneous operations, while its 84 I/O accommodate external converters, memory, and synchronization signals. The supplied distributor record reports 516096 bits of embedded memory, but the complete logic-element and memory architecture must be checked in the official handbook before estimating throughput. Timing closure, clocking, I/O standards, and exposed-pad thermal design should be completed before committing a specific board revision.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk EP3C16E144C7 — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | EP3C16E144C7N | EP3C16E144C8 | EP3C16E144C8N | EP3C16E144C6 | EP3C16E144C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Device Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Speed Grade | C7 option | C7 with N option | C8 option | C8 with N option | C6 option | C6 with N option |
Penyeberangsung Jelas
- Confirmed 84-I/O integration in the Cyclone III EP3C16 device (vsEP3C16E144C7N)
- Verified 516096-bit reported embedded-memory specification (vsEP3C16E144C7N)
- Directly documented distributor sourcing for the selected MPN (vsEP3C16E144C8N)
Catatan Desain
Maklumat Kesediaan
The supplied distributor and search records do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than being inferred from the manufacturer or package.
