EP3C16U484I7 - 15,408 LEs, 484-UBGA Cyclone III FPGA | Altera
MPN: EP3C16U484I7 ✓ AktifEP3C16U484I7 Ringkasan
A field-programmable gate array is a semiconductor whose configurable logic blocks, programmable interconnect, and I/O resources implement digital functions after manufacture. Within the product hierarchy, an FPGA is a programmable logic device, an integrated circuit, and ultimately a semiconductor. Unlike a fixed application-specific integrated circuit, the Cyclone III architecture allows designers to implement parallel processing, control logic, interfaces, and protocol functions in one device while retaining the flexibility to revise the configuration during development.
The EP3C16U484I7 provides 15,408 logic elements and 346 I/O in a 484-UBGA package. Its listed 437.5 MHz speed identifies the maximum device performance grade, while the 1.2 V value describes the core supply. The large I/O count supports board-level integration that would otherwise require multiple programmable devices. The industrial temperature range also provides a clear distinction from commercial-temperature catalog variants.
Cyclone III devices use programmable logic elements to build combinational and sequential functions, with dedicated resources for memory, digital signal processing, clock management, connectivity, and configuration. The combination of 15,408 logic elements and 346 I/O permits parallel datapaths and control systems to be consolidated, but the available memory, DSP resources, pin assignments, bank voltages, and configuration limits must be checked against the design before selecting the device.
Typical applications include industrial control and factory automation, communications infrastructure, embedded instrumentation, data acquisition, and mixed signal processing. The device is also appropriate for general-purpose prototyping because programmable logic can shorten development cycles when requirements evolve. Its 484-UBGA package provides high I/O density but requires careful ball-grid escape routing, multilayer PCB construction, adequate thermal management, and assembly-process control.
Designers should verify the exact power architecture, I/O standards, configuration scheme, clock inputs, and pin constraints in the manufacturer documentation before layout. Because the available verified data does not include a complete public ball map, pin-level assignment should be taken directly from the manufacturer device support files rather than inferred from the 484-ball package outline. Differential pairs and high-speed interfaces also require manufacturer-recommended PCB constraints.
This page combines verified distributor specifications, current pricing and stock observations, practical FPGA design guidance, and same-family replacement candidates. Unlike a basic distributor listing, it also identifies which replacement details require engineering verification and highlights the package, temperature, speed-grade, and resource constraints that determine whether a candidate is a genuine drop-in choice.
Pilihan pengganti yang segera untuk EP3C16U484I7 — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
EP3C16U484C6N
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EP3C16U484C7N
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EP3C16U484C8N
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EP3C16U484I6N
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EP3C16U484I8N
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EP3C16U484I7 Penilaian maksimum & Ciri-ciri Elektrik
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Elements | 15,408 |
| Number of I/O | 346 |
| Maximum Device Speed | 437.5 MHz |
| Core Supply Voltage | 1.2 V |
| Kemasan | 484-UBGA |
| Package Type | UBGA |
| Total Terminals | 484 |
| Temperature Grade | Industrial |
| Suhu Operasi | -40°C to +125°C |
| Terminal Form | Ball |
| Package Shape | Rectangular |
| Lead-Free Status | Lead free |
Panduan Konfigurasi Pin EP3C16U484I7 rectangular
Konfigurasi pin untuk EP3C16U484I7 (rectangular pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk EP3C16U484I7.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
EP3C16U484I7 patut untuk 6 aplikasis: Industrial Factory Automation, Communications and Network Control, Data Acquisition and Signal Processing, Embedded Control and Instrumentation, Automotive and Transportation Electronics, Programmable Logic Prototyping.
Industrial Factory Automation
The EP3C16U484I7 fits factory-control systems that combine machine sequencing, digital logic, communication, and multiple external interfaces. Its verified 15,408 logic elements can host parallel control paths, while 346 I/O provides dense connectivity for sensors, actuators, counters, interlocks, and field-bus transceivers. The industrial temperature range of -40°C to +125°C supports use in temperature-variable factory equipment. In a controller design, the FPGA can acquire parallel inputs, apply state-machine or filtering logic, and drive outputs deterministically. The main tradeoff is PCB complexity: the 484-UBGA package requires fine-pitch routing and multilayer construction, while timing closure and power planning must use the official Cyclone III design resources.
Disebarkan
Communications and Network Control
The EP3C16U484I7 is suitable for protocol handling, packet control, and network-interface supervision where parallel programmable logic provides useful throughput and flexible timing. The verified 346 I/O can support parallel data buses, status signals, control lines, and multiple clock domains, while 15,408 logic elements allow framing, filtering, buffering, and state management to be consolidated. For an industrial networking subsystem, the FPGA could sit between a transceiver and host processor, validate frames, and manage flow control. The 437.5 MHz listed device speed provides a clear timing-class reference, but actual interface rates depend on the selected I/O standards, PLL configuration, routing, and timing closure. The 484-UBGA footprint is appropriate for high I/O-density equipment but demands disciplined signal-integrity and power-layout work.
Disebarkan
Data Acquisition and Signal Processing
The EP3C16U484I7 can support parallel data acquisition, digital filtering, preprocessing, and control in instrument and industrial-measurement systems. Its 15,408 logic elements provide capacity for parallel sample handling, while 346 I/O allows direct connection to ADC output buses, capture-control signals, memory interfaces, and status indicators. A typical signal chain could use the FPGA to latch ADC data, apply digital correction, detect thresholds, and transfer processed results to a processor. The listed 437.5 MHz device speed is relevant to timing design, although converter resolution, sampling rate, clock-jitter limits, and system timing determine achievable throughput. Designers should also verify the device's exact memory and DSP resources before committing to this architecture, because those figures were not included in the supplied verified data.
Disebarkan
Embedded Control and Instrumentation
The EP3C16U484I7 is useful for embedded instrumentation that requires flexible timing, parallel control, and numerous I/O rather than a fixed instruction sequence. The Cyclone III FPGA can implement timers, counters, state machines, custom bus interfaces, event capture, and supervisory logic within its 15,408 logic elements. With 346 I/O, a designer can combine sensor conditioning interfaces, display-control signals, memory devices, and communication ports on one programmable platform. Its -40°C to +125°C industrial range supports instrumentation intended for controlled industrial environments. The implementation trade-off is development complexity: configuration, clock planning, pin assignment, and timing constraints should be established in the FPGA toolchain before schematic capture. The 484-UBGA package also limits hand assembly and makes component availability and PCB assembly capability important procurement considerations.
Disebarkan
Automotive and Transportation Electronics
The EP3C16U484I7 can be evaluated for transportation electronics that need programmable logic, substantial I/O, and operation over an industrial temperature range. Potential functions include dashboard logic, diagnostics, interface translation, actuator supervision, and central control between sensors and communication modules. The verified -40°C to +125°C rating and 346 I/O are useful starting points, but the device itself is not identified as an AEC-Q100-qualified automotive part. Automotive deployment therefore requires separate qualification of the assembled product, voltage tolerances, transient protection, electromagnetic compatibility, and functional-safety processes. The 484-UBGA package can support dense vehicle electronics, although its fine-pitch assembly and thermal requirements make PCB and process validation especially important.
Disebarkan
Programmable Logic Prototyping
The EP3C16U484I7 is well suited to prototype and validate parallel-logic architectures before committing to an ASIC or another programmable device. Its 15,408 logic elements and 346 I/O allow designers to combine multiple counters, state machines, memory buffers, test algorithms, and external interfaces in one laboratory board. The industrial grade supports prototypes that will move from controlled development environments into less temperature-stable test systems. Because the Cyclone III architecture is mature, engineers should use the official design libraries, JTAG configuration flow, and timing constraints rather than relying solely on generic simulator assumptions. The principal drawback is package-level assembly: the 484-UBGA device is less convenient for simple breadboards and requires a multilayer board with controlled impedance and fine-pitch assembly.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk EP3C16U484I7 — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | EP3C16U484C6N | EP3C16U484C7N | EP3C16U484C8N | EP3C16U484I6N | EP3C16U484I8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA | 484-UBGA | 484-UBGA | 484-UBGA | 484-UBGA | 484-UBGA |
| Device Type | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 |
| Number of I/O | 346 | 346 | 346 | 346 | 346 | 346 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Penyeberangsung Jelas
- Combines 15,408 logic elements with 346 I/O in one Cyclone III device (vsEP3C16M164I7N)
- Industrial temperature coverage (vsEP3C16U484C8N)
- Documented 437.5 MHz device speed (vsEP3C16U484I6N)
Catatan Desain
Treat the 484-UBGA footprint as a fine-pitch, multilayer-board design rather than a conventional leaded package. Use the manufacturer's ball pattern, pad dimensions, via rules, and escape-routing recommendations without alteration. Keep power, ground, clock, and high-speed nets on appropriately planned layers, and provide a continuous reference plane where return paths can remain controlled. Because the verified data did not include the official ball map, PCB entry must begin from the released Cyclone III package drawing and Quartus pin file rather than from distributor package images.
Do not infer the complete power budget from the verified 1.2 V core value alone. Confirm core, auxiliary, and I/O supply requirements, tolerance, sequencing, current, and startup behavior in the manufacturer documentation. Place local bypass capacitors at the appropriate supply and ground balls, use low-ESL packages, and keep high-current paths short and wide. Estimated: if the design later calculates 1.0 W of total dissipation, validate that estimate against the selected PCB thermal model and maximum junction temperature rather than assuming the 484-UBGA package can dissipate it without copper and airflow.
Assign clocks, high-speed buses, and sensitive interfaces only after checking the official speed-grade timing tables and applicable I/O standards. Use source-synchronous or device-referred constraints where appropriate, control skew through matched routing, and avoid routing memory or high-speed nets across plane splits. Differential pairs and length-sensitive interfaces require the package-specific ball ordering and PCB rules supplied by the manufacturer. Validate the final board with eye diagrams or compliance measurements because logical pin compatibility alone does not establish channel-level margin.
The most common substitution mistake is assuming that every EP3C16 device has the same package. The verified comparison identifies EP3C16M164I7N as a 164-MBGA device, so it is not a drop-in replacement for the 484-UBGA EP3C16U484I7 despite sharing 15,408 logic elements. Likewise, EP3C40U484I7 has a different resource class. Any alternative must match the 484-ball footprint, configuration requirements, resource demand, I/O standards, speed grade, temperature range, and exact Quartus-compatible pin file.
Maklumat Kesediaan
The verified DigChip snippet describes the device as lead free. RoHS, REACH, halogen-free, and conflict-minerals declarations were not explicitly provided in the supplied verified data. AEC-Q100 is not applicable because the product is not identified as an AEC-Q100-qualified automotive device.
