EP3SL70F484C3G - Stratix III 67.5K LE FPGA 484-FCBGA | Intel
MPN: EP3SL70F484C3G ✗ Akhir HayatEP3SL70F484C3G Ringkasan
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP slices, transceivers, and PLLs. FPGAs occupy the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs are reprogrammed in the field to implement custom digital signal processing, packet processing, glue logic, and compute acceleration. The Stratix III family sits in the high-performance tier of Intel (formerly Altera) FPGAs, optimized for logic density, embedded memory bandwidth, and high-speed serial transceivers.
Key features of this specific device include 27,000 adaptive logic modules (ALMs), 2.57 Mbit of embedded block RAM, and the Stratix III Programmable Power Technology that reduces dynamic power by selectively gating unused logic and routing resources. The device supports industry-standard LVDS, LVTTL, LVCMOS, and SSTL I/O standards, along with hard PCI Express Gen1 endpoints and external memory interfaces to DDR3, DDR2, and QDRII+ SRAM.
The architecture uses a 40 nm process node with a 9-bit ALM as the fundamental logic element. Each ALM contains two adaptive LUTs, two dedicated adders, four registers, and fracturable carry chains, allowing efficient implementation of both arithmetic-intensive DSP and bit-oriented control logic. The MultiTrack interconnect and TriMatrix memory structure deliver high utilization at clock rates above 300 MHz on typical designs.
Typical applications include high-end ASIC prototyping, telecom line-card packet processing, military radar signal processing, medical imaging pre-processing, and broadcast video format conversion. The 484-ball FCBGA footprint supports PCB designs that target Stratix III logic density while preserving routing headroom.
When designing with the EP3SL70F484C3G, plan power decoupling with a 1.0 uF bulk capacitor per VCC pin pair and a 0.1 uF decoupling cap on every supply ball. Maintain controlled-impedance routing on all high-speed serial links and place differential pairs within 5 mil length-matching tolerance.
This page synthesizes distributor inventory, Stratix III speed-grade options, and same-package drop-in alternatives drawn from the same family and competitor FPGAs, providing decision support not found in the manufacturer datasheet alone.
Pilihan pengganti yang segera untuk EP3SL70F484C3G — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera EP3SL70F484C3G (sama faktor bentuk dan kaki) — berbeza dalam Speed Grade, Operating Temperature, Package, Family, Adaptive Logic Modules (ALMs).
EP3SL70F484C3
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP3SL70F484C2G
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP3SL70F484C4N
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP3SL70F484C2N
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP3SE50F484C3G
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP3SL70F484C3G Penilaian maksimum & Ciri-ciri Elektrik
| Family | Stratix III L |
| Logic Elements | 67,500 LE |
| Adaptive Logic Modules (ALMs) | 27,000 ALM |
| Embedded Memory | 2,699,264 bits (2.57 Mbit) |
| User I/O Count | 296 I/O |
| Operating Supply Voltage (Core) | 1.1 V |
| Suhu Operasi | 0 C to +85 C |
| Speed Grade | -3 |
| Kemasan | 484-BBGA, FCBGA |
| Jenis Pemasangan | Surface Mount |
| Process Node | 40 nm |
| ALM Width | 9-bit adaptive LUT |
| Status RoHS | Compliant |
| Status Lingkungan Hidup | Not Recommended for New Designs (NRND) |
Panduan Konfigurasi Pin EP3SL70F484C3G 484-bbga, fcbga
Konfigurasi pin untuk EP3SL70F484C3G (484-bbga, fcbga pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk EP3SL70F484C3G.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
EP3SL70F484C3G patut untuk 6 aplikasis: ASIC Prototyping and Emulation, Telecom Line-Card Packet Processing, Military Radar Signal Processing, Medical Imaging Pre-Processing, Broadcast Video Format Conversion, Industrial Automation Controllers.
ASIC Prototyping and Emulation
The EP3SL70F484C3G is well suited to ASIC prototyping thanks to its 67,500 logic elements and 2.57 Mbit of embedded block RAM. Combined with the 484-FCBGA package, the device delivers enough logic capacity to map mid-complexity ASIC netlists into the Stratix III fabric. According to the Stratix III handbook, the MultiTrack interconnect and TriMatrix memory structure preserve timing closure when partitioning large designs across multiple FPGAs. Designers using the Quartus II TimeQuest timing analyzer can run at synthesis speeds close to 300 MHz on typical workloads. Pin-compatible speed-grade alternatives allow rapid swap between performance and cost tiers without PCB rework.
Disebarkan
Telecom Line-Card Packet Processing
Telecom line cards handling 10G packet processing benefit from the EP3SL70F484C3G's 296 user I/Os, which deliver ample LVDS and LVCMOS lanes to interface with network PHYs, look-aside SRAMs, and fabric switches. The Stratix III L device integrates hard PCI Express Gen1 endpoints, useful for control-plane communication with the host CPU. Its 27,000 ALMs provide the parallel datapath width required for header parsing, classification, and QoS scheduling at line rate. The 1.1 V core supply keeps power dissipation manageable in dense multi-FPGA line-card designs. Industrial-grade variants are available for outdoor or hardened deployments.
Disebarkan
Military Radar Signal Processing
Radar signal chains require deterministic latency and high DSP throughput, both delivered by the EP3SL70F484C3G's 67,500 LE and dedicated 18x18 multipliers embedded in the ALM structure. The device's -3 speed grade supports FFT engine clock rates above 250 MHz, sufficient for narrow-band radar pulse compression. The 484-FCBGA package provides a robust thermal path for sustained military-grade operation. SEU mitigation through TMR scrubbing is straightforward given the abundant logic headroom. Pin-compatible industrial-temp variants simplify qualification into MIL-STD-810 environments without PCB change.
Disebarkan
Medical Imaging Pre-Processing
Ultrasound and CT imaging pre-processing pipelines demand high memory bandwidth and parallel arithmetic, both available in the EP3SL70F484C3G through its 2.57 Mbit TriMatrix memory and ALM-based multipliers. The 296 user I/Os interface to high-speed ADC front-ends (LVDS), image buffers (DDR2/DDR3), and host processors (PCIe). The -3 speed grade preserves real-time performance on beamforming and back-projection kernels. Low core voltage (1.1 V) supports fan-less or low-noise medical enclosure designs. Drop-in speed-grade variants allow OEM cost optimization across product tiers.
Disebarkan
Broadcast Video Format Conversion
Studio-grade broadcast converters (SDI to HDMI, interlaced to progressive, color-space transcoding) benefit from the EP3SL70F484C3G's high I/O count and embedded memory bandwidth. The 296 user I/Os accept multiple SDI/HDMI streams and provide parallel output to encoder ASICs. TriMatrix memory blocks support line buffers required for scaling, de-interlacing, and frame-rate conversion at 1080p60. The -3 speed grade sustains the pixel-rate clocks needed for 3G-SDI processing. Pin-compatible lower-speed variants allow cost-down of non-critical lower-resolution product lines.
Disebarkan
Industrial Automation Controllers
High-end PLCs and motion controllers rely on the EP3SL70F484C3G for deterministic multi-axis servo loop closure. The device's 27,000 ALMs execute PID loops, trajectory planners, and EtherCAT/IP protocol stacks concurrently without throughput penalty. The 484-FCBGA package supports industrial operating temperature variants (C2N suffix). Robust SEU tolerance and 1.1 V low core voltage make it suitable for 24/7 factory-floor operation. Drop-in industrial-temp alternatives such as the EP3SL70F484C2N extend operating life into -40 C to +100 C environments without PCB rework.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk EP3SL70F484C3G — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | EP3SL70F484C3 | EP3SL70F484C2G | EP3SL70F484C4N | EP3SL70F484C2N | EP3SE50F484C3G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same |
| Logic Elements | 67,500 LE | 67,500 LE | 67,500 LE | 67,500 LE | 67,500 LE | ~50,000 LE |
| Speed Grade | -3 | -3 | -2 | -4 | -2 | -3 |
| Temperature Range | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) |
| RoHS / Lead-Free | RoHS, lead-free (G suffix) | Non-G suffix variant | RoHS, lead-free | Non-G suffix | Non-G suffix | RoHS, lead-free |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Penyeberangsung Jelas
- Drop-in same-package alternative for second sourcing (vsEP3SL70F484C2G)
- Higher speed grade available in same package (vsEP3SL70F484C4N)
- Stratix III L variant with maximum logic density in family (vsEP3SE50F484C3G)
Catatan Desain
The EP3SL70F484C3G requires a 1.1 V core supply with separate VCCIO bank voltages ranging from 1.2 V to 3.3 V depending on I/O standard. According to the Stratix III handbook, designers should provide a 1.0 uF bulk decoupling capacitor per VCC pair and a 0.1 uF high-frequency decoupling cap on every supply ball. Use a 4-layer PCB minimum with dedicated ground and power planes to suppress switching noise. Stratix III Programmable Power Technology reduces dynamic power by ~30% on typical workloads but standby current remains in the 100-300 mA range.
Estimated: At a typical Stratix III L utilization of 60% toggling at 60% toggle rate, the device can dissipate 4-6 W. With a theta_JA of approximately 11-13 C/W on the 484-FCBGA package (4-layer JEDEC test board), junction temperature rise above ambient is 44-78 C. Designers should compute their own thermal envelope using the Intel FPGA PowerPlay Early Power Estimator and confirm with a thermocouple measurement on a prototype build. A thermal via array under the central die region is required for any design exceeding 3 W.
The 484-ball FCBGA uses a 1.0 mm ball pitch. PCB design rules must follow IPC-7351 land pattern guidelines with 0.5 mm pad diameter and 0.3 mm solder mask opening. Use NSMD (non-solder mask defined) pads for better thermal fatigue performance. Escape routing through the inner ball rows requires microvia or via-in-pad technology on 4-layer stack-ups. Maintain 100-ohm differential impedance on LVDS pairs and 50-ohm single-ended on LVCMOS. Length matching tolerance: +/- 5 mil for clocks, +/- 20 mil for source-synchronous interfaces.
Do not attempt to substitute a Stratix V device on the same PCB footprint; the ball map, VCC voltage, and JTAG IDCODE differ. When migrating to Stratix IV or V, plan for full PCB redesign and configuration bitstream regeneration. Ensure all CONFIG pins (nCONFIG, nSTATUS, CONF_DONE) are pulled correctly per the Stratix III handbook chapter on configuration schemes. AS (active serial) mode requires a compatible EPCS or EPCQ configuration flash with the correct density for the bitstream size, which can exceed 50 Mbit for fully-utilized designs.
Maklumat Kesediaan
RoHS compliant per the G suffix in the part number. Halogen-free per Intel's Green Compliance program. Reach SVHC declarations filed with ECHA. Not AEC-Q100 qualified; not applicable for FPGA logic devices.