EP4SGX360HF35C3 - Stratix IV GX FPGA, 360K LE, 1152-FBGA | Intel
MPN: EP4SGX360HF35C3 ✓ AktifEP4SGX360HF35C3 Ringkasan
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs) and sit alongside ASICs and CPLDs in the digital IC hierarchy, offering hardware-level parallelism and post-fabrication reconfigurability.
Key features include 14,144 LABs (Logic Array Blocks), dedicated on-chip transceivers capable of multi-gigabit serial I/O, and embedded DSP blocks optimized for high-throughput signal processing. The device also supports hard memory controllers, PCI Express hard IP blocks, and variable-precision DSP architecture that allows dynamic trade-off between precision and resource utilization.
The Stratix IV GX architecture uses an adaptive logic module (ALM) approach, where each ALM contains an 8-input fracturable look-up table (LUT), two dedicated adders, and four registers. This gives the device significantly higher effective logic density compared to older 4-input LUT architectures. The 40 nm process and power-aware compiler reduce static and dynamic power.
Typical applications include high-end telecommunications infrastructure, broadcast video processing, radar and signal intelligence systems, high-speed serial protocol bridging, ASIC prototyping, and PCI Express Gen2 endpoint designs. The 1152-ball FCBGA package supports the high I/O count required for memory-rich and transceiver-rich designs.
When designing with this part, engineers should use the Quartus II design suite (13.0 or later) and verify signal integrity for the multi-gigabit transceivers with controlled-impedance PCB stack-ups. The 1152-ball package requires careful BGA fanout and at least 4-6 PCB routing layers.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix IV GX family, and practical design notes that complement the official Stratix IV Device Handbook.
Pilihan pengganti yang segera untuk EP4SGX360HF35C3 — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera EP4SGX360HF35C3 (sama faktor bentuk dan kaki) — berbeza dalam Package, Speed Grade, Transceivers, Family, Operating Temperature.
EP4SGX360HF35C2N
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Lihat Datasheet →EP4SGX360HF35C2
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Lihat Datasheet →EP4SGX360HF35I3N
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Lihat Datasheet →EP4SGX360HF35C3 Penilaian maksimum & Ciri-ciri Elektrik
| Series | Stratix IV GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 353,600 |
| Total Memory Bits | 23,105,536 (22.5 Mbit) |
| Number of LABs | 14,144 |
| User I/O Count | 564 |
| Kemasan | 1152-BBGA, FCBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount |
| Process Node | 40 nm |
| Suhu Operasi | Commercial (0C to +85C) - inferred from C3 suffix |
| Transceivers | Multi-gigabit serial transceivers integrated |
| DSP Blocks | Variable-precision DSP blocks |
| Memory Controllers | Hard memory controller blocks |
| PCI Express Hard IP | Yes (PCIe Gen2 capable per family) |
| Development Tool | Quartus II Design Software (v13.0 or later) |
Panduan Konfigurasi Pin EP4SGX360HF35C3 1152-bbga, fcbga (fineline bga)
Konfigurasi pin untuk EP4SGX360HF35C3 (1152-bbga, fcbga (fineline bga) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk EP4SGX360HF35C3.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
EP4SGX360HF35C3 patut untuk 6 aplikasis: Telecommunications Infrastructure, ASIC Prototyping, Broadcast Video Processing, Radar and Signal Intelligence, High-Speed Serial Protocol Bridging, Test and Measurement Instrumentation.
Telecommunications Infrastructure
The EP4SGX360HF35C3 is well-suited to high-end telecom infrastructure such as 40G/100G line cards, OTN framer/mapper, and packet processing engines. Its 353,600 logic elements and 22.5 Mbit embedded memory absorb deep lookup tables and packet buffers, while integrated multi-gigabit transceivers drive SFP+, QSFP+, and backplane SerDes links directly. The Stratix IV GX hard PCI Express Gen2 IP accelerates host NIC designs and ATCA backplane interfaces, and 564 user I/Os give line cards ample parallel bus margin for fabric and control-plane routing.
Disebarkan
ASIC Prototyping
For ASIC prototyping, the EP4SGX360HF35C3 delivers 353,600 logic elements - enough to map large ASIC netlists via partitioning across multiple FPGAs. Its variable-precision DSP blocks and abundant block RAM let designers emulate on-chip memory, video pipelines, and signal-processing accelerators without iteration penalties. The 1152-ball FCBGA package exposes high I/O count required for multi-FPCB interconnect, and the Quartus II incremental compile flow supports rapid bring-up of prototype revisions. Compared to smaller FPGAs the EP4SGX360 reduces the number of FPGA chips and interconnect bridges in the prototype array.
Disebarkan
Broadcast Video Processing
The EP4SGX360HF35C3 fits broadcast video processing applications such as 4K/UHD up/down/cross-conversion, multi-stream SDI routing, and HEVC/H.264 encoding assistance. Its DSP blocks accelerate motion estimation, deinterlacing, and scaling kernels, while 22.5 Mbit embedded memory holds line buffers and reference frames for real-time processing. The integrated transceivers handle SDI, HDMI, and DisplayPort serialization, and the 564 user I/Os expose parallel video buses and GPIO to companion video ADC/DAC chips. Designers benefit from mature Quartus II IP for SDI and video bridging.
Disebarkan
Radar and Signal Intelligence
Radar and signals-intelligence systems use the EP4SGX360HF35C3 to implement FFT engines, beamforming, and pulse compression at multi-hundred-MHz sample rates. The variable-precision DSP blocks run floating-point and fixed-point math in parallel, while 22.5 Mbit of memory holds windowing coefficients and overlap-save buffers. The integrated transceivers connect to ADC/DAC companion chips such as TI ADC32RF45 or Analog Devices AD9208 over JESD204B/C. The wide operating temperature grade options (-40C to +100C industrial variants) and rugged FCBGA package suit defense and avionics deployments.
Disebarkan
High-Speed Serial Protocol Bridging
The EP4SGX360HF35C3 implements bridges between PCIe Gen2, Serial RapidIO, 10GbE, and SATA/RAID storage fabrics thanks to its hard multi-gigabit transceivers and dedicated protocol IP. Designers use the device in storage controllers, protocol analyzers, and military/aerospace datalink cards. Its 564 I/Os support parallel protocol interfaces to legacy ASICs, and 22.5 Mbit of block RAM is enough for packet queuing and command buffering. Compared to soft IP on smaller FPGAs, the Stratix IV GX hard IP cores save logic and reduce latency.
Disebarkan
Test and Measurement Instrumentation
Test-and-measurement equipment such as oscilloscopes, logic analyzers, and protocol testers leverages the EP4SGX360HF35C3 for real-time acquisition and signal conditioning. The high logic density supports deep capture memory buffers, while the multi-gigabit transceivers handle high-speed serial probing lanes up to 10 Gbps. Designers implement trigger engines, pattern generators, and signal decoding in logic and DSP blocks, taking advantage of the 564 I/Os to interface with ADCs and front-end analog ASICs. The Stratix IV GX PCI Express hard IP enables streaming recorded data directly to host analysis software.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk EP4SGX360HF35C3 — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | EP4SGX360HF35C2N | EP4SGX360HF35C2 | EP4SGX360HF35I3N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 |
| Total Memory Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| Speed Grade | C3 | C2 (slower) | C2 (slower) | I3 (slower) |
| Operating Temperature | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| User I/Os | 564 | 564 | 564 | 564 |
Penyeberangsung Jelas
- Highest speed grade in the 1152-ball FCBGA Stratix IV GX line (vsEP4SGX360HF35C2N)
- Commercial temperature grade optimized for cost (vsEP4SGX360HF35I3N)
- Hard PCI Express Gen2 IP blocks integrated (vsEP4SGX230KF40C4N)
Catatan Desain
The EP4SGX360HF35C3 in a 1152-ball FCBGA package can dissipate significant power under heavy logic utilization - up to 15-20W at full clocking of DSP and transceiver blocks. Designers should use at least a 4-layer PCB with a continuous ground plane directly beneath the BGA, plus thermal vias in the land pattern to conduct heat to inner copper layers. Without a heatsink, ensure at least 1-2 square inches of copper pour and adequate airflow; for industrial deployments consider a 1-3C/W heatsink.
Route the 1152-ball FCBGA on at least a 6-layer PCB stack-up with 0.4-0.5 mm pitch escape routing and microvia-in-pad or via-on-pad if supported by your fab. Use the Quartus II pin planner to generate pin assignments that minimize routing congestion, especially across the I/O banks. Maintain 100-ohm differential impedance for transceiver lanes and 50-ohm single-ended for general-purpose I/O. Decoupling: place 0.1 uF MLCCs under each power-ball row and bulk 100 uF tantalum or polymer capacitors adjacent to the package.
Estimated: design compiles that exceed 85% logic utilization on the EP4SGX360 may fail timing closure even at C3 speed grade. Plan for at least 70% utilization as a starting point and use the Quartus II chip planner to identify critical paths. A common pitfall is ignoring I/O bank VCCIO grouping - mix-and-match VCCIO rails only within the same bank; otherwise the design will not compile. Always run power-aware synthesis (PowerPlay) and verify the design meets thermal envelope before tape-out.
Maklumat Kesediaan
Compliance information not provided in the verified distributor data; refer to Intel/Altera product documentation for full RoHS and REACH compliance details.