EPM3128AFC256-7N - 128-Macro 7.5ns MAX 3000A CPLD | Altera
MPN: EPM3128AFC256-7N ✗ Akhir HayatEPM3128AFC256-7N Ringkasan
A Complex Programmable Logic Device (CPLD) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macro-cell arrays on a single chip, interconnected via a programmable switch matrix. CPLDs are part of the broader Programmable Logic Device (PLD) hierarchy (CPLD -> PLD -> programmable logic -> digital IC -> semiconductor) and are commonly positioned alongside FPGAs as deterministic, low-latency, instant-on glue-logic solutions. Unlike SRAM-based FPGAs, MAX 3000A CPLDs store their configuration in on-chip EEPROM, enabling instant operation at power-up with no external boot device.
Key features include 3.3 V in-system programmability compliant with IEEE Std. 1532 (multi-vendor concurrent ISP), Joint Test Action Group (JTAG) boundary-scan test support per IEEE Std. 1149.1, and four input pins per macro cell. The 7.5 ns propagation delay makes the device suitable for high-speed decoder, encoder, and bus-interface logic, while the 98 user I/Os accommodate wide parallel buses and memory interfaces.
The EPM3128AFC256-7N employs a MAX (Multiple Array matriX) architecture that pairs 16 logic array blocks (LABs) with a global interconnect matrix. Each LAB contains 16 macro cells fed by a shared programmable-AND/fixed-OR array, and the EEPROM cell provides non-volatile, reprogrammable configuration storage rated for at least 100 erase/program cycles per the datasheet. The device is designed for 3.3 V core operation and supports 5.0 V tolerant inputs via over-voltage tolerance circuitry on user I/O pins.
Typical applications include high-speed bus bridging, address decoding, peripheral glue logic in microcontroller and microprocessor systems, DSP glue logic, and interface translation between 3.3 V and 2.5 V logic domains. The 256-pin FineLine BGA (FBGA) package offers compact placement with a 1.0 mm ball pitch, well suited to space-constrained designs on multi-layer PCBs.
When designing with this device, ensure the VCCINT (3.3 V) and VCCIO (3.3 V or 2.5 V) rails are properly decoupled near the BGA. Confirm that JTAG chain order is consistent with the board test strategy and that the EPM3128AFC256-7N device-ID is mapped correctly in the ByteBlaster or USB-Blaster programmer software. Industrial-temperature variants should be selected for -40C to +85C environments.
This page synthesizes distributor pricing, parametric comparisons, and drop-in alternatives drawn from the EPM3128AFC256 family plus MAX 3000A cross-references - information not collected in any single manufacturer datasheet.
Pilihan pengganti yang segera untuk EPM3128AFC256-7N — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera EPM3128AFC256-7N (sama faktor bentuk dan kaki) — berbeza dalam Package, Operating Temperature, Usable Gates, Programmability, User I/Os.
EPM3128AFC256-10N
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
EPM3128AFC256-5N
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
EPM3128AFC256-15N
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EPM7128AEFC256-5
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
EPM7128SFC84-10
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EPM3128AFC256-7N Penilaian maksimum & Ciri-ciri Elektrik
| Family | MAX 3000A |
| Device Type | CPLD - Complex Programmable Logic Device |
| Architecture | CMOS EEPROM-based MAX |
| Macro Cells | 128 |
| Usable Gates | 2,500 |
| User I/Os | 98 |
| Propagation Delay (tPD) | 7.5 ns |
| Internal fMAX | 192.3 MHz |
| Supply Voltage - Core (VCCINT) | 3.3 V |
| Supply Voltage - I/O (VCCIO) | 3.3 V or 2.5 V |
| Logic Family | CMOS |
| Programmability | In-system (ISP), IEEE Std. 1532, JTAG (IEEE Std. 1149.1) |
| Kemasan | 256-BGA (FineLine, FBGA) |
| Suhu Operasi | 0 C to +70 C (commercial) |
| Jenis Pemasangan | Surface Mount |
Panduan Konfigurasi Pin EPM3128AFC256-7N 256-bga (fineline, fbga)
Konfigurasi pin untuk EPM3128AFC256-7N (256-bga (fineline, fbga) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk EPM3128AFC256-7N.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
EPM3128AFC256-7N patut untuk 6 aplikasis: High-Speed Address Decoding and Bus Bridging, Microcontroller and DSP Glue Logic, 3.3 V to 2.5 V Logic-Level Translation, Industrial Control and Automation Systems, Telecommunications Line-Card Interface Logic, JTAG-Based Boundary-Scan Test Infrastructure.
High-Speed Address Decoding and Bus Bridging
The EPM3128AFC256-7N's 7.5 ns pin-to-pin propagation delay and 192.3 MHz internal fMAX make it ideal for high-speed address decoding in microprocessor/microcontroller systems. With 128 macro cells and 98 user I/Os, the device can decode multiple chip-select lines, address ranges, and wait-state generators simultaneously. Place the CPLD between the processor address bus and peripheral enables; its EEPROM-backed non-volatile configuration eliminates boot delay. The 3.3 V core and selectable VCCIO (3.3 V or 2.5 V) let the same part bridge between modern 3.3 V processors and 2.5 V peripherals without external level shifters.
Disebarkan
Microcontroller and DSP Glue Logic
Use the EPM3128AFC256-7N as deterministic glue logic between microcontrollers, DSPs, and external peripherals. The 128 macro cells support 32-bit register banks and FIFO flag generators, while the 98 user I/Os comfortably accommodate parallel buses. Because the device stores configuration in on-chip EEPROM, it powers up instantly with no external boot device - a major advantage over SRAM-based FPGAs in safety-critical or fast-boot applications. The IEEE Std. 1149.1 JTAG interface supports both functional logic and boundary-scan test in production.
Disebarkan
3.3 V to 2.5 V Logic-Level Translation
The EPM3128AFC256-7N's selectable VCCIO banks (3.3 V or 2.5 V per datasheet) make it a flexible level translator between 3.3 V microprocessors and legacy 2.5 V peripherals. Each I/O bank can be independently powered, so mixed-voltage interfaces (3.3 V processor + 2.5 V memory + 3.3 V bus) coexist on a single CPLD. The 7.5 ns tPD preserves timing margins even when bridging between asynchronous clock domains, and the 98 user I/Os accommodate multi-channel LVDS-style translation with external biasing.
Disebarkan
Industrial Control and Automation Systems
In industrial control cabinets and PLCs, the EPM3128AFC256-7N handles deterministic I/O expansion, encoder quadrature decoding, and PWM generation. With 98 user I/Os and 128 macro cells, one CPLD can replace multiple discrete logic ICs, reducing board area. The commercial-temperature version (0 C to +70 C) suits indoor control panels; for -40 C to +85 C deployments, select the -7NI industrial variant. Combined with IEEE Std. 1532 ISP, the device can be reconfigured in the field through the JTAG header for firmware upgrades.
Disebarkan
Telecommunications Line-Card Interface Logic
Telecom line cards use the EPM3128AFC256-7N for clock distribution, framing/deframing, and HDLC channel aggregation. The 192.3 MHz fMAX supports E1/T1 data rates with margin, and the 98 user I/Os accommodate multi-port serial interfaces. The deterministic 7.5 ns tPD ensures that framing signals arrive within budget across temperature variation. Combined with the IEEE 1532 ISP capability, telecom OEMs can reconfigure the line card remotely across JTAG for protocol upgrades.
Disebarkan
JTAG-Based Boundary-Scan Test Infrastructure
Leverage the EPM3128AFC256-7N's IEEE Std. 1149.1 boundary-scan support for production board test. The CPLD itself is JTAG-compliant and can also be programmed to provide TAP controllers for downstream non-JTAG components, reducing the need for dedicated scan-mux ICs. The 256-BGA package places JTAG pins on accessible balls per the datasheet package diagram, simplifying bed-of-nails fixture routing. IEEE Std. 1532 ISP adds concurrent multi-vendor in-system programming in mixed-PLD boards.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk EPM3128AFC256-7N — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | EPM3128AFC256-10N | EPM3128AFC256-5N | EPM3128AFC256-15N | EPM7128AEFC256-5 | EPM7128SFC84-10 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-BGA (FineLine) | 256-BGA (FineLine) - same | 256-BGA (FineLine) - same | 256-BGA (FineLine) - same | 256-BGA (FineLine) - same | 256-BGA (FineLine) - same |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 7000A | MAX 7000S |
| Macro Cells | 128 | 128 | 128 | 128 | 128 | 128 |
| User I/Os | 98 | 98 | 98 | 98 | 100 | 100 |
| Propagation Delay (tPD) | 7.5 ns | 10.0 ns | 5.0 ns | 15.0 ns | 5.0 ns | 10.0 ns |
| Internal fMAX | 192.3 MHz | 129.9 MHz | 222.2 MHz | 100 MHz | 200 MHz | 125 MHz |
| Core Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5.0 V/3.3 V dual | 5.0 V |
| I/O Voltage (VCCIO) | 3.3 V or 2.5 V | 3.3 V or 2.5 V | 3.3 V or 2.5 V | 3.3 V or 2.5 V | 3.3 V or 2.5 V | 5.0 V/3.3 V |
| Operating Temperature | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C |
Penyeberangsung Jelas
- Balanced speed/cost position in MAX 3000A family (vsEPM3128AFC256-10N)
- Lower core voltage than MAX 7000A family (vsEPM7128AEFC256-5)
- Non-volatile EEPROM configuration (vsSRAM-based FPGAs (e.g., Cyclone family))
Catatan Desain
Decouple each VCCINT and VCCIO ball individually with a 0.1 uF ceramic capacitor placed within 50 mils of the ball via, plus a single 10 uF bulk capacitor per rail. The 256-BGA FineLine package has multiple VCCINT/VCCIO balls distributed across the array - missing even one decoupling cap can cause logic errors during simultaneous switching. Estimated: with 128 macro cells switching simultaneously at 100 MHz, transient current demand may exceed 200 mA per bank.
Use at least a 4-layer PCB with a continuous ground plane beneath the 256-BGA. Escape the BGA balls on inner layers with 0.5 mm-wide traces between vias; the 1.0 mm ball pitch permits fan-out to all four quadrants. Place the JTAG connector (TCK/TMS/TDI/TDO plus GND) within 2 inches of the device to keep TMS noise below 100 mV peak-to-peak. Keep clock inputs away from I/O banks driving high-current loads.
Do not mix 5 V signals on the EPM3128AFC256-7N user I/Os - the MAX 3000A family is not 5 V tolerant on inputs when VCCIO is 3.3 V or 2.5 V. For 5 V legacy interfaces, use the MAX 7000A family (EPM7128AEFC256-5) instead. Also note that the "N" suffix in EPM3128AFC256-7N indicates commercial temperature; industrial applications must select the "NI" variant or accept reduced operating life at temperature extremes.
Terminate clock and high-speed output signals with series 33 ohm resistors placed within 200 mils of the CPLD output pin. The 7.5 ns edge rate produces harmonics exceeding 100 MHz that can couple to adjacent traces; maintain 3W spacing between clock and asynchronous I/O traces. Use IBIS models (available from Altera legacy archives) for board-level SI simulation rather than relying on rule-of-thumb impedance control alone.
Maklumat Kesediaan
RoHS compliance confirmed via Altera/Intel product family page. REACH, halogen-free, and conflict-mineral status not explicitly stated in the retrieved datasheet excerpt; verify with the manufacturer's full material declaration (MDDS) for production builds.
