M2GL060-FG676 - 56.5K Logic Cell 1.2V FPGA | Microchip
MPN: M2GL060-FG676 ✓ AktifM2GL060-FG676 Ringkasan
An FPGA is a reprogrammable semiconductor in which configurable logic blocks, memory resources, and programmable I/O form a hardware system that can be modified after manufacture. Within the semiconductor hierarchy, an FPGA sits above programmable logic devices and below application-specific programmable systems. The IGLOO 2 family is specifically designed for low-density, nonvolatile flash-based programmable logic rather than fixed-function application-specific integrated circuits.
The M2GL060-FG676 provides 56,520 logic cells according to distributor records, with a separate product listing identifying 56.5K logic elements. Its 387 I/O positions provide extensive board-level connectivity, while the 1.2 V core voltage identifies the device as intended for modern low-voltage digital designs. Configuration is nonvolatile because the IGLOO 2 family uses embedded flash, allowing the programmed design to remain available after power removal without an external configuration PROM.
The 676-ball FBGA package makes the M2GL060-FG676 suitable for compact, multilayer PCB assemblies where perimeter lead counts would be restrictive. Its 0°C to 85°C commercial temperature range covers many indoor industrial, communications, medical, and consumer-adjacent systems. Unlike a mask-programmed ASIC, the FPGA allows logic, interfaces, and system-management functions to be revised through configuration changes, which can reduce prototype iteration and support product differentiation.
Typical uses include protocol bridging, parallel-to-serial interface conversion, Ethernet or USB interface support, control-plane logic, data acquisition, industrial control, and embedded security functions. The 387 I/O count is particularly useful when a design must connect multiple buses, sensors, converters, and status signals while retaining flexible programmable logic for control and protocol handling.
PCB implementation requires careful BGA layout and thermal engineering. Designers should follow Microchip's FG676 pin-information guide and the referenced board-and-layout guidelines, provide all required power and ground connections, and validate high-speed signal integrity across the multilayer stackup. Because the verified excerpt does not state the complete pin map, voltage tolerances, performance grade, or recommended high-speed capacitor values, those details must be checked against the manufacturer datasheet before release.
This product page consolidates verified distributor and manufacturer information, documented application roles, procurement status, and engineering-selection guidance. It distinguishes the target from higher-density IGLOO 2 devices and avoids presenting unsupported electrical, timing, pricing, or package details as confirmed facts.
Pilihan pengganti yang segera untuk M2GL060-FG676 — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Tiada pilihan pengganti yang segera untuk produk ini.
Minta AlternatifM2GL060-FG676 Penilaian maksimum & Ciri-ciri Elektrik
| Device Type | IGLOO 2 low-density flash FPGA |
| Logic Elements | 56.5K LE |
| Logic Cells | 56,520 cells |
| Core Supply Voltage | 1.2 V |
| I/O Count | 387 I/O |
| Package Type | 676-BGA / 676-pin FBGA |
| Ball Count | 676 balls |
| Jenis Pemasangan | Surface mount |
| Suhu Operasi | 0°C to 85°C |
| Programmable Logic Technology | Flash-configurable FPGA |
| Product Family | IGLOO 2 |
| Status Lingkungan Hidup | In Production |
| Manufacturer | Microchip Technology |
Panduan Konfigurasi Pin M2GL060-FG676 676-bga / 676-pin fbga
Konfigurasi pin untuk M2GL060-FG676 (676-bga / 676-pin fbga pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk M2GL060-FG676.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
M2GL060-FG676 patut untuk 6 aplikasis: Industrial Protocol Bridging, Gigabit Ethernet and USB Interface Support, Medical and Diagnostic Data Acquisition, Secure Connectivity and System Management, Video and Image Processing Control, Aerospace and Defense Control Logic.
Industrial Protocol Bridging
The M2GL060-FG676 fits industrial protocol-conversion designs that need programmable logic between two incompatible interfaces. Its 56,520 logic cells provide substantial capacity for state machines, packet framing, width conversion, and control logic, while 387 I/O allow numerous bus, chip-select, interrupt, and status signals to be consolidated. The 1.2 V core supports modern digital interfaces, and the 676-ball FBGA is practical on a multilayer control board where perimeter package options would be restrictive. Design validation should confirm the required I/O standards and timing directly from the manufacturer datasheet. In production, engineers should also validate industrial EMC, thermal, and operating-temperature requirements rather than treating the family's listed application markets as automatic qualification.
Disebarkan
Gigabit Ethernet and USB Interface Support
The M2GL060-FG676 is suitable for control-plane and interface-support logic around Gigabit Ethernet or USB systems because Microchip identifies bridging, I/O conversion, and secure connectivity as core IGLOO 2 uses. The 56,520 logic cells can implement protocol state machines, buffering, interrupt control, and supervisory logic, while 387 I/O provide substantial connectivity. In a USB or Ethernet design, the FPGA can complement a dedicated controller rather than replace high-speed PHY functions by itself. The 676-ball FBGA supports dense multilayer routing, but power, I/O voltage, and high-speed layout must be checked against the exact IGLOO 2 device data. Board-level signal-integrity validation is particularly important when the FPGA interfaces with external clock, differential, or high-speed digital circuitry.
Disebarkan
Medical and Diagnostic Data Acquisition
The M2GL060-FG676 can support programmable acquisition, conditioning, and supervisory logic in medical diagnostic equipment when system requirements remain inside its confirmed 0°C to 85°C commercial range. The 56,520 logic cells allow designers to implement parallel data capture, digital filtering, sensor selection, timing control, and data framing without relying on a fixed-function ASIC. Its 387 I/O positions can connect converters, sensors, isolation boundaries, and control signals in a compact 676-ball FBGA assembly. The verified information does not establish medical-device certification, which must be handled at the finished-product level. Before use, engineers should verify electrical limits, I/O compatibility, clocking requirements, and applicable medical quality and regulatory processes.
Disebarkan
Secure Connectivity and System Management
The M2GL060-FG676 fits secure-connectivity and system-management tasks because flash configuration preserves the programmed logic across power cycles and the family is explicitly positioned for these functions. Available logic capacity can implement boot monitoring, key-management control, watchdog logic, status aggregation, and communication isolation between subsystems. The 387 I/O provide ample connections for sensors, alarm signals, memory interfaces, and external controllers, while the 676-ball FBGA enables compact integration. The supplied evidence does not confirm a particular cryptographic primitive or security certification, so security functionality must be designed and validated independently. For production systems, review reset behavior, configuration access, clock architecture, and failure modes using the official datasheet and application guidance.
Disebarkan
Video and Image Processing Control
The M2GL060-FG676 can serve as a low-density control and image-processing FPGA where a design needs programmable pipeline control, timing, arbitration, and format conversion rather than a very high computational density. Its 56,520 logic cells and 387 I/O are useful for connecting image sensors, parallel data buses, memory interfaces, and displays. The 676-ball FBGA reduces board area and supports multilayer routing for compact camera or display-control assemblies. Video designs still require careful verification of supported I/O standards, clock rates, signal integrity, and pin constraints against Microchip's pin-information guide. Because no complete electrical or timing table was supplied here, engineers must not infer specific video standards or maximum pixel rates from the logic-cell count alone.
Disebarkan
Aerospace and Defense Control Logic
The M2GL060-FG676 can be evaluated for programmable control and I/O-conversion tasks in aerospace and defense systems because Microchip identifies defense and aviation among the IGLOO 2 family's markets. The 56,520 logic cells are useful for command decoding, sequencing, fault logging, and data-path control, while 387 I/O supports dense interconnects. However, the verified suffix corresponds to a 0°C to 85°C commercial-grade listing, and no AEC-Q100 or extended-temperature qualification is established in the supplied records. Engineers must therefore select the exact qualified ordering code for the mission environment and verify radiation, temperature, reliability, and certification requirements separately. The 676-ball FBGA also demands controlled assembly processes, inspection, and board-design validation.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk M2GL060-FG676 — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini |
|---|---|
| Brand | Microchip Technology |
| Package | 676-BGA / 676-pin FBGA |
| Family | IGLOO 2 |
| Logic Cells | 56,520 cells |
| Logic Elements | 56.5K LE |
| I/O Count | 387 I/O |
| Core Voltage | 1.2 V |
| Operating Temperature | 0°C to 85°C |
| Configuration Memory | Embedded flash |
| Lifecycle Status | In Production |
Penyeberangsung Jelas
- Low-density IGLOO 2 capacity with extensive I/O (vsM2GL090-FG676)
- Nonvolatile flash-based configuration (vsM2GL090-FG676)
- Commercial 0°C to 85°C ordering configuration (vsM2GL090-FG676)
Catatan Desain
Treat the 676-ball FBGA as a high-density, fine-pitch assembly and follow Microchip's FG676 pin-information guide and the referenced board-and-layout guidelines. Verify every ball assignment against the exact device suffix before schematic capture. Preserve the manufacturer-defined footprint, pad stack, solder-mask and paste geometry, and do not substitute a generic BGA footprint because ball-map, thermal, and escape-routing differences can cause assembly or electrical failures.
Use the manufacturer power-plane and decoupling recommendations for the exact IGLOO 2 device rather than values inferred from distributor summaries. The confirmed 1.2 V value identifies the core supply, but it does not establish all I/O, auxiliary, or power-sequencing limits. Check the complete pin-description guide and datasheet for supply names, voltage tolerances, current budgets, startup behavior, and required bypass capacitors before power-up testing.
Plan high-speed escape routes and layer transitions before placing the BGA, because the 676-ball package leaves little room for late routing changes. Apply the device-specific impedance and via guidance from Microchip's layout documentation, maintain continuous return paths, and account for ball-pitch escape geometry. Validate high-speed interfaces with simulation and measured eye diagrams because the logic-cell count alone does not guarantee a particular data rate or signal-integrity margin.
Do not treat the M2GL090-FG676 as a drop-in substitute merely because it uses the same FG676 package. The higher-density device can differ in resources, power, timing, and configuration behavior, requiring a formal migration assessment. Similarly, confirm the ordering suffix's temperature grade, package, and qualification because the verified target listing shows a 0°C to 85°C commercial version, not an automatically qualified extreme-temperature or automotive part.
Thermal analysis must be based on the final utilization, switching activity, core voltage, I/O loading, board stackup, and ambient temperature. The verified data establishes a 1.2 V core and 0°C to 85°C operating range but does not provide power dissipation or junction-temperature limits, so those figures must be obtained from the official datasheet. Ensure the PCB provides adequate power and ground planes and follow assembly requirements for the large FBGA to avoid package stress and localized heating.
Maklumat Kesediaan
The supplied verified data identifies the device as an in-production commercial-grade IGLOO 2 FPGA but does not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. These fields remain unknown rather than inferred.
