MPC860SRZQ80D4 - 80MHz PowerQUICC MPU, 357-PBGA | NXP
MPN: MPC860SRZQ80D4 ✗ Akhir HayatMPC860SRZQ80D4 Ringkasan
A microprocessor (MPU) is an integrated circuit that contains the arithmetic logic unit, control unit, register file, and memory interfaces of a computer on a single die. In system hierarchy, an MPU sits above microcontrollers in complexity, requiring external memory and peripherals, and is used in applications where high-throughput processing and flexible memory architectures are required. The PowerQUICC MPC860 family specifically targets telecommunications and networking, where the integrated CPM offloads communications processing from the main CPU.
Key differentiating features of the MPC860SRZQ80D4 include the integrated CPM with two serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI), and an I2C controller, plus a 10/100 Mbps Ethernet MAC. The device supports 32-bit PowerPC architecture with separate instruction and data MMUs, providing virtual memory support for embedded operating systems such as VxWorks and Linux. 80 MHz core speed delivers 50 MIPS Dhrystone performance, sufficient for mid-tier routing, switching, and industrial control workloads.
Architecturally, the MPC860SRZQ80D4 separates the PowerPC core from the CPM via an internal bus, allowing protocol processing to occur in parallel with CPU tasks. The 357-PBGA package uses a 1.27 mm ball pitch and is suitable for surface-mount assembly with a thermal vias under the die for heat dissipation.
Typical applications include WAN routers, ISDN terminal adapters, Fast Ethernet switches, industrial automation embedded in legacy telecom equipment, and military/aerospace systems requiring the PowerPC architecture. The wide protocol support also makes it suitable for industrial serial concentrators and protocol converters.
Designers should note that the MPC8xx family requires external SDRAM, flash, and glue logic, and the BGA package requires X-ray inspection and controlled-impedance PCB stackup. The 3.3 V I/O simplifies interfacing to 5 V tolerant peripherals via external level shifters.
This page synthesizes current distributor pricing, drop-in MPC8xx alternatives, and design notes drawn from the NXP/Freescale PowerQUICC hardware specifications document.
Pilihan pengganti yang segera untuk MPC860SRZQ80D4 — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera MPC860SRZQ80D4 (sama faktor bentuk dan kaki) — berbeza dalam Core Architecture, Manufacturer, Process Technology, Processor Type, RoHS Status.
MPC860SRZQ66D4
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →MPC860SRZQ50D4
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
MPC860DEZQ80D4
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
MPC860DTCZQ50D4
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
MPC860PVR80D4
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
MPC860SRZQ80D4 Penilaian maksimum & Ciri-ciri Elektrik
| Processor Type | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | PowerPC |
| Core Clock Speed | 80 MHz |
| Tegangan Pemberi Arus | 3.3 V |
| Number of Cores | 1 |
| Kemasan | 357-PBGA (25x25 mm) |
| Ball Pitch | 1.27 mm |
| Jenis Pemasangan | Surface Mount |
| Packaging | Tray |
| Suhu Operasi | -40C to +95C |
| Integrated Ethernet MAC | 10/100 Mbps |
| Serial Communications Controllers (SCC) | 2 |
| Serial Management Controllers (SMC) | 2 |
| SPI / I2C | 1 SPI, 1 I2C |
| Status RoHS | Non-RoHS (contains lead) |
| Lead Free Status | Contains Lead |
Panduan Konfigurasi Pin MPC860SRZQ80D4 357-pbga (25x25 mm)
Konfigurasi pin untuk MPC860SRZQ80D4 (357-pbga (25x25 mm) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk MPC860SRZQ80D4.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
MPC860SRZQ80D4 patut untuk 6 aplikasis: WAN Router / Edge Networking, ISDN Terminal Adapter, Fast Ethernet Switch Controller, Industrial Protocol Converter / Gateway, Legacy Telecom Equipment Maintenance, Aerospace and Defense Embedded Controller.
WAN Router / Edge Networking
The MPC860SRZQ80D4's 80 MHz PowerPC core plus integrated CPM with 10/100 Ethernet MAC and dual SCCs make it well-suited to mid-tier WAN router and edge-networking designs. The CPM offloads PPP, frame relay, and HDLC protocol processing in parallel with CPU tasks, sustaining wire-speed serial throughput even at 50 MIPS Dhrystone. Placing this part between the WAN PHY and the Ethernet switch fabric, designers reuse VxWorks or pSOS+ BSPs originally authored for PowerQUICC platforms. Unlike soft-CPU implementations, the integrated CPM consumes near-zero CPU cycles, freeing the PowerPC core for routing-table maintenance and management-plane tasks.
Disebarkan
ISDN Terminal Adapter
The MPC860SRZQ80D4 is widely deployed in legacy ISDN terminal adapters where the integrated CPM's two SCCs handle the ISDN BRI/U-interface D-channel and B-channel aggregation. The 80 MHz core performs HDLC framing and call-control state machines while the CPM manages bit-level signaling. With 3.3 V I/O simplifying interface to ISDN transceiver ICs, this part minimizes external glue logic. Designers reduce PCB area by integrating what previously required a discrete serial controller plus an external Ethernet MAC.
Disebarkan
Fast Ethernet Switch Controller
In Fast Ethernet switches the MPC860SRZQ80D4 acts as the management-plane and Layer-3 forwarding CPU. The integrated 10/100 MAC provides one uplink, while the dual SCCs connect to a PHY or a switch fabric via MII/RMII. 80 MHz core throughput is sufficient to maintain forwarding tables and run SNMP/CLI management without compromising line-speed switching. The 357-PBGA package accommodates high-density board designs, while the 1.27 mm ball pitch remains manufacturable on standard 4-layer PCBs.
Disebarkan
Industrial Protocol Converter / Gateway
Industrial gateways convert between serial fieldbuses (Modbus, Profibus, CANopen) and Ethernet, and the MPC860SRZQ80D4's mix of SCCs, SMCs, SPI, and I2C accommodates multiple legacy protocols simultaneously. The 32-bit PowerPC core runs protocol stacks and conversion logic, while the CPM hardware-accelerates bit-level framing. The -40C to +95C operating temperature range supports factory-floor deployment. Unlike microcontroller-based gateways, this MPU delivers the throughput to run multiple concurrent protocol conversions at full line rate.
Disebarkan
Legacy Telecom Equipment Maintenance
For maintenance of installed telecom bases that originally shipped with PowerQUICC silicon, the MPC860SRZQ80D4 serves as a like-for-like service replacement, allowing field technicians to repair legacy equipment without requalification. The 357-PBGA (25x25) footprint and pinout match the original assembly, and the 80 MHz performance matches the original deployed units. This avoids costly PCB redesign when individual units fail in service. Franchised distributors such as Rochester Electronics maintain authorized stock of these NRND parts for service continuity.
Disebarkan
Aerospace and Defense Embedded Controller
The MPC860SRZQ80D4 is used in aerospace and defense embedded controllers where its 32-bit PowerPC architecture, integrated CPM, and 357-PBGA package meet long-lifecycle military program requirements. The integrated Ethernet and serial controllers reduce BOM count in size- and weight-constrained applications. The -40C to +95C industrial operating range supports many defense environments. Designers benefit from the mature VxWorks and pSOS+ BSP ecosystems, which are well-validated for mission-critical avionics and C4ISR platforms. The 80 MHz core is sufficient for low-bandwidth data acquisition and discrete-control tasks.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk MPC860SRZQ80D4 — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | MPC860SRZQ66D4 | MPC860SRZQ50D4 | MPC860DEZQ80D4 | MPC860DTCZQ50D4 | MPC860PVR80D4 |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Speed | 80 MHz | 66 MHz | 50 MHz | 80 MHz | 50 MHz | 80 MHz |
| Core Architecture | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Integrated Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| Peripheral Suffix | SR | SR | SR | DE | DTC | PV |
| Operating Temperature | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Penyeberangsung Jelas
- Highest core clock in SR peripheral map (vsMPC860SRZQ66D4 / MPC860SRZQ50D4)
- Same-package drop-in within SR family (vsMPC860DEZQ80D4 / MPC860DTCZQ50D4 / MPC860PVR80D4)
- Integrated CPM with multi-protocol serial (vsMPC860PVR80D4)
Catatan Desain
The 357-PBGA package with 1.27 mm ball pitch requires 4-layer PCB minimum with controlled-impedance stackup and a continuous ground plane beneath the BGA. Thermal vias under the die (9-12 vias in a 3x3 array, 0.3 mm drill) reduce theta_JA. PCB layout must route high-speed Ethernet MII traces with 50 ohm impedance and length matching within 50 mils on the differential pairs. Decoupling capacitors must be placed within 100 mils of each supply pin per the hardware specifications document.
Estimated: at 80 MHz core clock and 3.3 V supply with typical CPM and CPU utilization, the MPC860SRZQ80D4 dissipates approximately 1.0-1.5 W. The 357-PBGA package requires thermal vias under the die and adequate copper pour on top and inner layers to maintain junction temperature below 125 C. Industrial applications at +95 C ambient need verified thermal design.
The MPC8xx family requires external SDRAM, flash, and bus-arbiter glue logic. Do not assume internal flash exists. JTAG boundary-scan must be accessible for board test; route TCK/TMS/TDO/TDI to a test header. The 3.3 V I/O is NOT 5 V tolerant; use external level shifters when interfacing to 5 V peripherals. Lead-bearing solder balls require exemptions or non-RoHS assembly flow.
Place external SDRAM as close to the MPC860SRZQ80D4 data bus pins as possible, keeping trace lengths under 50 mm and matched within 25 mils across byte lanes. The 32-bit external data bus and address bus run at 80 MHz, so controlled impedance (50 ohm) is mandatory. Isolate analog PLL power supply pins with ferrite beads and dedicated decoupling; PLL jitter directly impacts CPM bit-error performance.
The integrated 10/100 Ethernet MAC MII/RMII signals run at 25 MHz (MII) or 50 MHz (RMII) and must be length-matched and impedance-controlled. Series-source termination of 33 ohm on MII clock and data lines reduces ringing. The SCC serial outputs can drive long traces to PHY or transceiver ICs without additional buffering, but impedance discontinuities at connector transitions must be minimized.
Maklumat Kesediaan
Lead-bearing BGA; not RoHS compliant. Reach status presumed compliant per NXP legacy product declarations. AEC-Q100 not applicable to MPU. Halogen-free and conflict-minerals data not surfaced in distributor listings.
