Texas Instruments

MSP430F6638CY - 20MHz 16-Bit Mixed-Signal MCU | Texas Instruments

MPN: MSP430F6638CY ✓ Aktif
20 MHz Speed 256KB (256K x 8) Memory
MOQ: 1 |

MSP430F6638CY Ringkasan

The Texas Instruments MSP430F6638CY is a 20 MHz, 16-bit mixed-signal microcontroller with 256KB of Flash memory, 16KB of SRAM, a 12-bit ADC, a 12-bit DAC, a comparator, DMA, USB connectivity, and support for a 160-segment LCD. The device is identified as a die-sale product, so the MSP430F6638CY ordering code is not associated with a standard finished package in the manufacturer product information shown here.

A mixed-signal microcontroller combines a digital processor with analog conversion and other peripheral functions on one integrated circuit. The MSP430F6638 belongs to the MSP430F6xx family, whose 16-bit RISC CPUXV2 architecture uses a reduced instruction set designed for efficient embedded control. USB, serial interfaces, DMA, and high-resolution analog peripherals make this device suitable for industrial instrumentation, data acquisition, communications, and control systems where integration can reduce external component count.

The MSP430F6638 operates with a 20 MHz maximum clock and provides 256KB of program Flash plus 16KB of SRAM. Its analog resources include a 12-bit ADC and 12-bit DAC, while the integrated comparator supports thresholding and signal monitoring. Additional peripherals include DMA, brown-out detection and reset, power-on reset, PWM, a watchdog timer, and a 160-segment LCD driver. These features support real-time acquisition, local control loops, human-machine interfaces, and firmware-managed peripheral movement.

The device provides I2C, IrDA, LINbus, SCI, SPI, UART/USART, and USB connectivity. USB can support a direct host or device-oriented peripheral role, while the serial interfaces allow connection to sensors, transceivers, displays, and external converters. The 74 I/O positions indicated for the MSP430F6638 family provide a broad hardware interface for a platform assembled from bare die or a qualified module.

Because MSP430F6638CY is offered as die sale rather than a conventional packaged ordering option, assembly into a finished electronic assembly requires die attach, wire bonding, electrical verification, and a package or substrate designed for the device. The die-sale designation also means that exposed-pad, lead, pinout, and standard package drawings cannot be assigned safely without the bonding map or assembly documentation.

For new production designs, engineers should use the MSP430F6638 family documentation, confirm the available memory and peripheral configuration, and plan the analog input conditioning around the ADC resolution. USB signal routing requires controlled impedance and careful placement of protection and bypass components, while firmware should verify reset behavior and watchdog behavior during startup.

This product summary consolidates the manufacturer specifications, ordering information, interface capabilities, die-sale constraints, and application guidance needed to evaluate the MSP430F6638CY before beginning an embedded mixed-signal design.

Pilihan pengganti yang segera untuk MSP430F6638CY — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.

Tiada pilihan pengganti yang segera untuk produk ini.

Minta Alternatif

MSP430F6638CY Penilaian maksimum & Ciri-ciri Elektrik

Product Type 16-bit mixed-signal microcontroller
Manufacturer Texas Instruments
Series MSP430F6xx
Core Processor CPUXV2
Core Size 16-bit
Frekuensi Klock Maksimum 20 MHz
Program Memory Size 256KB (256K x 8)
Program Memory Type Flash
RAM Size 16KB
ADC Resolution 12-bit
DAC Resolution 12-bit
Number of I/O 74
LCD Segment Support 160 segments
Connectivity I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, comparator, DMA, POR, PWM, WDT
Orderable Form Die sale

Panduan Konfigurasi Pin MSP430F6638CY standard

Konfigurasi pin untuk MSP430F6638CY (standard pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.

Garis bentuk pengecah pakai standard untuk MSP430F6638CY

Tiada data garisan pin yang diperoleh untuk MSP430F6638CY.

Rujuk kepada lembaran data untuk konfigurasi pin penuh.

Aplikasi Biasa

MSP430F6638CY patut untuk 6 aplikasis: Industrial Data Acquisition, USB-Connected Control Panel, Precision Signal Generator, HMI with Local Display, Battery-Powered Field Sensor Node, Motor and Power-System Controller.

🏭

Industrial Data Acquisition

The MSP430F6638CY is appropriate for compact industrial measurement systems that must acquire analog signals and move data through a local controller. Its 12-bit ADC supports process monitoring, while 16KB of SRAM can hold acquisition buffers and the 20 MHz CPU can perform filtering, scaling, and alarm calculations. USB, UART/USART, SPI, and I2C provide several paths to a host, data logger, or sensor network. The 256KB of Flash is useful for application firmware and calibration tables. Design the analog front end for the required input range, bandwidth, reference accuracy, and protection, and validate the channel performance against the MSP430F663x datasheet.

🖥️

USB-Connected Control Panel

The MSP430F6638CY can serve as the control and communications hub in a USB-connected instrument that also manages local operator inputs or displays. Its USB interface allows a direct computer connection, while the 160-segment LCD capability can support status indication and the 74 I/O positions can accommodate buttons, indicators, and control signals. The 20 MHz CPU handles control logic, the 16KB SRAM supports working state, and the 256KB of Flash stores firmware and interface descriptors. USB layout, power supervision, firmware updates, and connector protection require careful design review before production.

⚡

Precision Signal Generator

The MSP430F6638CY is useful in a programmable signal source or test fixture where the 12-bit DAC creates an analog output under firmware control. The controller can calculate waveform values, apply configuration, record operating state, and expose commands through USB or a serial interface. Its 256KB of Flash supports substantial firmware and lookup data, while DMA can assist with time-based data movement when configured appropriately. Application accuracy depends on the DAC reference, analog reconstruction, output buffering, and calibration. Use the manufacturer electrical characteristics and reference practices to establish output range, settling behavior, and noise expectations.

📺

HMI with Local Display

The MSP430F6638CY fits human-machine interfaces that need a segment LCD, local control logic, and network connectivity in one low-power design. The integrated 160-segment LCD driver reduces the need for external display-control hardware, and the CPU can manage menus, alarms, keypad input, and process-state updates. I2C or SPI can connect sensors and configuration devices, while UART/USART or USB supports service access. With 16KB of SRAM, application code should use efficient display and input structures, and firmware should avoid blocking delays that would delay operator response or peripheral servicing.

🧩

Battery-Powered Field Sensor Node

The MSP430F6638CY can form the core of a field sensor node that measures local analog conditions and reports results through a wired interface. Its 16-bit CPU architecture, Flash memory, SRAM, and collection of serial peripherals support efficient embedded firmware, while brown-out detection, power-on reset, and the watchdog improve recovery behavior in unattended equipment. USB may be used for configuration or service rather than continuous operation. A battery design must budget energy for acquisition, radio or bus activity, and the display if fitted, then verify low-power behavior and operating limits against the device documentation.

🔧

Motor and Power-System Controller

The MSP430F6638CY is applicable to supervisory control in power conversion, actuator, and motor-monitoring systems where local computation is needed. PWM outputs support control functions, the comparator can monitor thresholds, and the 12-bit ADC can supervise analog quantities. The 20 MHz CPU executes control and fault logic, 16KB of SRAM holds current operating state, and DMA can reduce processor involvement in selected transfers. USB or serial links enable configuration and diagnostics. Safety-critical implementations require appropriate isolation, watchdogs, fault states, thermal analysis, and verification beyond the device's normal mixed-signal control role.

What is the Texas Instruments MSP430F6638CY?
The MSP430F6638CY is a Texas Instruments 20 MHz, 16-bit mixed-signal microcontroller offered as die sale. It combines 256KB of Flash, 16KB of SRAM, a 12-bit ADC, a 12-bit DAC, a comparator, DMA, USB, and a 160-segment LCD driver. According to the manufacturer MSP430F6638 product page, the device belongs to the MSP430F6xx family and uses the CPUXV2 core. Its integrated analog and communications resources are intended to reduce the component count of embedded acquisition, control, and instrumentation systems.
What are the key specifications of MSP430F6638CY that engineers should know?
The principal MSP430F6638CY specifications are a 20 MHz maximum clock, 16-bit CPUXV2 core, 256KB of Flash, 16KB of SRAM, 12-bit ADC, 12-bit DAC, 74 I/O positions, and support for a 160-segment LCD. The manufacturer product page also identifies I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB, DMA, comparator, brown-out reset, PWM, power-on reset, and watchdog functions. Because the ordering code denotes die sale, package dimensions, lead assignments, and exposed-pad details require assembly-specific documentation rather than a standard package outline.
Where can I download the MSP430F6638 datasheet PDF?
The MSP430F6638 datasheet and supporting documents are available through the official Texas Instruments product page at https://www.ti.com/product/MSP430F6638. Use the datasheet, user guide, errata, and device-specific ordering information associated with that page during firmware and hardware development. The manufacturer document describes the MSP430F663x mixed-signal microcontroller family, including CPU, memory, analog peripherals, communications interfaces, LCD capability, and electrical characteristics. Review the latest revision and errata before freezing a production design.
Does MSP430F6638CY have USB connectivity?
Yes, the MSP430F6638CY includes USB connectivity. The Texas Instruments product page lists USB together with I2C, IrDA, LINbus, SCI, SPI, and UART/USART interfaces. This makes the device suitable for systems that need a standards-based host or device connection in addition to real-time control. USB implementation still requires the electrical layout, firmware, and validation steps defined by the MSP430F663x documentation. Protection components, routing geometry, and connector requirements should be reviewed against the applicable USB implementation guidance.
What analog peripherals are built into MSP430F6638CY?
The MSP430F6638CY includes a 12-bit ADC, a 12-bit DAC, and a comparator. According to the Texas Instruments MSP430F6638 product page, these resources are integrated with the CPUXV2 controller and communications peripherals. The ADC supports measured analog inputs, while the DAC provides an analog output and the comparator supports threshold or signal-monitoring functions. Practical performance depends on the reference voltage, analog front end, source impedance, sampling strategy, layout, and firmware configuration described in the MSP430F663x documentation.
How much memory does the MSP430F6638CY have?
The MSP430F6638CY provides 256KB of Flash program memory and 16KB of SRAM. The manufacturer describes the Flash as 256K x 8 and identifies the product as a 16-bit CPUXV2 mixed-signal microcontroller. The 256KB region accommodates firmware, constants, and application data, while the 16KB SRAM supports working memory, buffers, stacks, and acquisition data. Firmware architecture should account for the comparatively small SRAM by using efficient buffering, avoiding unnecessary duplication, and moving large tables into Flash when appropriate.
Where can I find the MSP430F6638CY pinout?
The MSP430F6638CY is a die-sale ordering code, so it does not have a conventional purchased-part pinout that can be applied to a PCB footprint. Use the pin-description information, die pad coordinates, and bonding requirements associated with the MSP430F6638 family documentation, then confirm them against the package or substrate design used by the assembler. The official manufacturer product page is the appropriate starting point for device documents. Do not infer a lead map from a packaged MSP430F6638 variant when the physical assembly and bonding scheme differ.
Is MSP430F6638CY suitable for data acquisition systems?
The MSP430F6638CY is suitable for data acquisition systems that need local 12-bit conversion, control, memory, and communications in one device. Its 256KB of Flash supports embedded firmware, 16KB of SRAM supports acquisition buffers, and USB or serial interfaces can transfer data to a host or other equipment. The 12-bit DAC can provide stimulus or reference output when the application requires it. Analog front-end design, reference conditioning, input protection, calibration, and signal bandwidth must be developed around the electrical limits in the MSP430F663x datasheet.
Can MSP430F6638CY be used in industrial control and instrumentation?
Yes, the MSP430F6638CY fits embedded industrial control and instrumentation designs that combine acquisition, local processing, display support, and wired connectivity. Its 20 MHz CPU, 256KB of Flash, 16KB of SRAM, 12-bit ADC, 12-bit DAC, comparator, DMA, watchdog, brown-out reset, PWM, and 160-segment LCD capability support responsive controller roles. The integrated I2C, SPI, SCI, UART/USART, LINbus, IrDA, and USB interfaces allow connection to sensors, transducers, storage, and service equipment. Production suitability still depends on assembly qualification and the required operating-temperature grade.
MSP430F6638CY vs MSP430F6638IPZ - which is better for a new design?
MSP430F6638IPZ is generally more convenient for a new PCB design because it is a packaged ordering option, while MSP430F6638CY is explicitly sold as die sale. The manufacturer product information describes the underlying MSP430F6638 family at 20 MHz with 256KB of Flash, 16KB of SRAM, 12-bit ADC, 12-bit DAC, USB, DMA, and LCD support. IPZ should be chosen when its package, temperature grade, pinout, and ordering conditions satisfy the product; CY is appropriate when die-level integration or supply arrangement is required.
What is the difference between MSP430F6638CY and MSP430F6638IPZR?
The principal documented difference is orderable form: MSP430F6638CY is a die-sale product, whereas MSP430F6638IPZR is a packaged ordering option associated with the MSP430F6638 family. The manufacturer describes the family with a 20 MHz CPU, 256KB of Flash, 16KB of SRAM, 12-bit ADC and DAC, USB, DMA, and a 160-segment LCD driver. They are not automatically interchangeable because package attachment, bonding, exposed-pad requirements, and environmental ordering conditions differ.
When should I choose MSP430F6638CY instead of a packaged MSP430F6638 device?
Choose MSP430F6638CY when die-level integration is an explicit requirement and the assembler can qualify a suitable die-attach and interconnect process. A packaged MSP430F6638 ordering option is generally simpler when the manufacturer package, pinout, and assembly capacity already meet the product requirements. The die-sale route offers integration flexibility but adds bonding-map, substrate, thermal, inspection, and production-test considerations. Confirm that the selected assembly process supports the die geometry and that the complete product requirements are met before committing the design.
What can replace MSP430F6638CY?
No confirmed pin-to-pin drop-in replacement for MSP430F6638CY is established by the available manufacturer and cross-reference information. A suitable replacement must preserve the CPU, memory configuration, analog resources, peripheral mapping, clock behavior, memory organization, and physical implementation requirements. Packaged MSP430F6638 variants are not automatically drop-in equivalents because the CY ordering code denotes die sale and the assembly method differs. A functional MSP430 alternative may still require firmware, board, and pinout changes, so it should not be described as a drop-in substitute without project-specific verification.
Is MSP430F6638CY the same as MSP430F6638IPZR?
No, MSP430F6638CY and MSP430F6638IPZR are not the same orderable form. MSP430F6638CY is explicitly a die-sale product, while MSP430F6638IPZR is a packaged MSP430F6638 ordering option. The manufacturer identifies the family features as a 20 MHz 16-bit CPU, 256KB of Flash, 16KB of SRAM, 12-bit ADC and DAC, USB, DMA, and 160-segment LCD support. The different assembly forms require different PCB, bonding, and manufacturing treatment and therefore should not be treated as pin-identical substitutions.
Where can I buy MSP430F6638CY and what is its lead time?
Use the Request a Quote form on this XAIPART page to request MSP430F6638CY availability, lead time, minimum order quantity, and assembly requirements. The manufacturer product page identifies the device as active and distributor listings include MSP430F6638CY, but the exact die-sale assembly package and current procurement quantity must be agreed before a delivery date is meaningful. Quote requests should specify the required die orientation, bonding map, substrate, production quantity, inspection level, and target schedule so the supplier can confirm a feasible build plan.
What is the price of MSP430F6638CY?
The current MSP430F6638CY quotation is handled through the Request a Quote form on this XAIPART page. Because MSP430F6638CY is sold as die sale, the commercial outcome can depend on die orientation, assembly package, bonding, substrate, test requirements, production volume, and delivery schedule. Use the form to request a binding quote for the exact production configuration rather than treating a packaged-part price as representative. Include forecast quantities and annual usage so the quote can reflect the appropriate supply arrangement.
Is MSP430F6638CY in stock?
Stock for MSP430F6638CY should be confirmed through the Request a Quote form on this XAIPART page because the ordering code represents die sale rather than a conventional stocked package. The manufacturer product page lists the MSP430F6638 family as active, and distributor records show MSP430F6638CY, but availability can vary with the required assembly method and production allocation. Include the requested package, bonding configuration, test level, target date, and forecast quantity when requesting current stock and lead-time confirmation.

Data referensi kejuruteraan untuk MSP430F6638CY — perbandingan, panduan rancangan, dan maklumat kesediaan

Panduan Pilihan

Choose MSP430F6638CY when die-level integration is required and the manufacturing process can support die attach, bonding, substrate design, inspection, and production test. Its 20 MHz CPU, 256KB of Flash, 16KB of SRAM, 12-bit ADC and DAC, USB, serial interfaces, DMA, and 160-segment LCD support make it suitable for embedded acquisition, industrial control, test equipment, and connected instrumentation. Choose a packaged MSP430F6638 ordering option when a standard footprint, assembly flow, and environmental ordering configuration better fit the project. Do not choose a generic serial-interface MCU unless its analog performance, memory map, peripheral set, and firmware requirements are a better fit. Likewise, do not treat another manufacturer's MCU as a drop-in replacement without validating pinout, clock, memory, analog accuracy, peripherals, software, and lifecycle requirements.

Perbandingan dengan Gantian

Parametr Produk Ini
Product Type 16-bit mixed-signal microcontroller
Brand Texas Instruments
Package Die sale
Core Processor CPUXV2
Core Size 16-bit
Maximum Clock Frequency 20 MHz
Program Memory 256KB Flash
RAM 16KB
ADC Resolution 12-bit
DAC Resolution 12-bit
Connectivity I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Number of I/O 74
LCD Support 160 segments
Orderable Form Die sale

Penyeberangsung Jelas

  • Combines a 12-bit ADC, 12-bit DAC, comparator, USB, and LCD control in one mixed-signal MCU (vsGeneral-purpose serial-interface MCU without the same integrated analog and LCD feature set)
  • Provides 256KB of Flash and 16KB of SRAM (vsSmall-memory 16-bit MCU)
  • Supports nine listed communication interfaces (vsMCU offering only a subset of serial and wired interfaces)
  • Offers die-level integration for specialized assembly programs (vsMSP430F6638IPZ packaged ordering option)

Catatan Desain

Treat MSP430F6638CY as a die-level design rather than a conventional PCB component. Obtain the die pad-coordinate and bonding information required by the assembly process before defining the substrate or package footprint. Confirm die orientation, pad numbering, bond-wire or flip-chip limits, keep-out areas, and substrate design rules with the assembler. Do not copy the footprint of a packaged MSP430F6638 ordering option because the physical attachment and pad geometry are different.

Provide separate, low-impedance supply paths for the MCU and analog sections, and place the required bypass capacitors close to their device-side power and ground pads. Ground-return planning is particularly important because the same device combines digital control, ADC, DAC, and communications. Use the manufacturer recommended capacitor values and voltage ratings, verify startup sequencing against brown-out and power-on reset behavior, and check the analog reference source for adequate noise and decoupling before enabling precision conversions.

Route USB as a controlled-impedance interface and keep the transceiver path away from high-current switching nodes. Plan connector protection, series impedance, branch topology, and return-path continuity according to the applicable USB implementation guidance. For analog channels, keep input traces short, use a continuous reference plane, separate digital and analog return currents where practical, and isolate ADC sources from switching-node capacitance. Validate the completed layout for crosstalk, settling, and conversion accuracy.

Do not interpret the die-sale designation as a package pinout or assume that a packaged MSP430F6638 variant can be substituted without redesign. The MSP430F6638CY orderable form changes assembly requirements, and firmware should also be reviewed for boot configuration, brown-out recovery, watchdog handling, USB initialization, and peripheral conflicts. Before production, verify the programmed image, die orientation, bonding continuity, analog calibration, temperature behavior, and each communication interface through electrical test.

Maklumat Kesediaan

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Bosong logam timbal
Unknown
Bosong halogen
Unknown
Mineral konflik
Unknown

The die-sale product information does not state the requested compliance attributes. Confirm applicable environmental, automotive, lead-free, and assembly requirements for the specific production configuration with Texas Instruments.

Data disahkan pada: 2026-11-04 — data yang disahkan dan disusun semula oleh pasukan kejuruteraan komponen XAIPART

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Komponen dan Tanda berkaitan

Texas Instruments MSP430F6638CY MSP430F6638 MSP430F6638IPZ MSP430F6638IPZR MSP430F6xx CPUXV2 mixed-signal microcontroller microcontroller embedded controller semiconductor 16-bit RISC 12-bit ADC 12-bit DAC comparator DMA USB I2C SPI UART/USART IrDA LINbus LCD driver die-sale assembly Flash memory SRAM brown-out reset watchdog timer
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