XC3S1500-5FG676C - 1.5M Gate Spartan-3 FPGA | AMD
MPN: XC3S1500-5FG676C ✓ AktifXC3S1500-5FG676C Ringkasan
A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic, routing, input/output, and memory resources. FPGA design flow combines hardware description languages, synthesis, place-and-route tools, timing analysis, and device programming. The Spartan-3 family occupies the FPGA category within programmable logic devices and is positioned for designs requiring substantial parallel processing in a single package.
The XC3S1500 device provides 29,952 logic cells, 589,824 RAM bits, and 487 I/O positions according to its product listing. Its 676-ball surface-mount package supports dense connections among the configurable fabric, dedicated memory, and external circuitry. The -5 designation identifies the performance grade, while the C suffix identifies the commercial temperature class.
Spartan-3 devices use a configurable architecture rather than a fixed logic function, allowing designers to implement parallel datapaths, state machines, interfaces, and control systems in one device. The 90 nm fabrication process and 1.2 V core supply place the component within the technology and power characteristics of the Spartan-3 generation. Performance also depends on the selected design, package speed characteristics, memory interface, and external circuitry.
Typical applications include industrial automation, communications infrastructure, instrumentation, embedded control, video processing, and general-purpose digital signal processing. The large logic-cell count and 487 I/O positions are useful when a design must combine parallel computation with numerous external interfaces, while the integrated RAM resources support buffers, lookup tables, and moderate data-storage functions.
A critical design step is power planning because FPGA configuration and dynamic switching activity can create substantial board-level power demand. Decoupling, supply sequencing, clock integrity, and thermal management should be reviewed against the Spartan-3 design guidance. Because the -5 part is a -5 speed-grade device, timing closure should use the appropriate device speed file and the worst applicable operating conditions.
This product record combines the exact ordering code with package, logic-resource, process, and speed information, alongside drop-in same-family options, application guidance, and engineering-focused comparison data that help shorten component identification and design-review work.
Pilihan pengganti yang segera untuk XC3S1500-5FG676C — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera XC3S1500-5FG676C (sama faktor bentuk dan kaki) — berbeza dalam Speed Grade, Temperature Grade, Package, Product Type, Terminal Count.
XC3S1500-5FGG676C
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
XC3S1500-4FG676C
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak DisahkanHubungi untuk harga
Lihat Datasheet →XC3S1500-4FG676I
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →XC3S1500-5FG676I
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
XC3S1500-4FGG676C
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
XC3S1500-5FG676C Penilaian maksimum & Ciri-ciri Elektrik
| Product Type | Spartan-3 field-programmable gate array (FPGA) |
| Series | Spartan-3 |
| System Gates | 1,500,000 gates |
| Configurable Logic Cells | 29,952 cells |
| RAM Capacity | 589,824 bits |
| I/O Count | 487 I/O |
| Core Voltage | 1.2 V |
| Performance Level | 725 MHz |
| Speed Grade | -5 |
| Temperature Grade | Commercial (C suffix) |
| Process Technology | 90 nm |
| Package Type | 676-ball FBGA |
| Terminal Count | 676 balls |
| Package Family | BGA surface-mount package |
| Jenis Pemasangan | Surface mount |
Panduan Konfigurasi Pin XC3S1500-5FG676C bga surface-mount package
Konfigurasi pin untuk XC3S1500-5FG676C (bga surface-mount package pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk XC3S1500-5FG676C.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
XC3S1500-5FG676C patut untuk 6 aplikasis: Industrial Automation and Control, Communications and Network Interface Equipment, Industrial and Test Instrumentation, Video and Image Processing Pipelines, Embedded Parallel Control Systems, Data Acquisition and Signal Processing.
Industrial Automation and Control
The XC3S1500-5FG676C fits industrial automation controllers that combine parallel logic, multiple interfaces, and deterministic control functions in one FPGA. Its 29,952 configurable logic cells can support state machines, sequencing, protocol handling, and supervisory logic, while 487 I/O positions provide substantial board-level connectivity. The 676-ball FBGA also supports dense routing among logic, embedded RAM, and external peripherals. Designers should partition real-time work into separate clock domains, constrain all interfaces precisely, and rerun timing analysis for the -5 grade. Industrial products also require careful review of supply regulation, thermal rise, configuration control, and the temperature limits of the commercial C-suffix ordering code.
Disebarkan
Communications and Network Interface Equipment
The XC3S1500-5FG676C is appropriate for communications equipment requiring parallel packet processing, stream conversion, and flexible interface logic. The 29,952 logic cells and 589,824 RAM bits provide resources for parallel lanes, buffer management, and protocol conversion, while 487 I/O positions allow numerous high-speed and control signals to reach the FPGA. Using the -5 performance grade can provide useful timing margin in demanding pipelines after place-and-route. A practical design must constrain source-synchronous interfaces, control clock skew, and validate external memory timing. Power and termination schemes should be designed with the exact board topology and selected I/O standards rather than copied from a generic reference circuit.
Disebarkan
Industrial and Test Instrumentation
The XC3S1500-5FG676C can serve as the programmable core of instrumentation that requires coordinated acquisition logic, timing generation, data processing, and a high pin count. Its 29,952 logic cells allow multiple measurement channels to be processed concurrently, and 487 I/O positions support sensors, trigger lines, displays, and communications. The listed 725 MHz performance level provides a useful basis for high-rate datapaths, but realized timing depends on routing and design structure. Engineers should use separate clock regions for acquisition, triggering, and communication, and should reserve logic for calibration, status, and fault handling. Thermal analysis is particularly important when high utilization and sustained switching activity occur simultaneously.
Disebarkan
Video and Image Processing Pipelines
The XC3S1500-5FG676C suits parallel video or image-processing pipelines that benefit from deterministic programmable logic and abundant I/O. The FPGA can divide into horizontal and vertical pixel processing, color conversion, filtering, and control stages, with 29,952 logic cells available for parallel datapaths and 487 I/O positions supporting sensor and display interfaces. The -5 grade supports timing-focused implementations, provided the design tool closes timing with realistic constraints. Video designs should use registered interfaces, dedicated clocking, and deterministic pipeline boundaries to prevent timing violations from accumulating across many stages. External memory interface layout and PCB signal integrity also require careful planning because wide buses can consume package resources and create simultaneous-switching noise.
Disebarkan
Embedded Parallel Control Systems
The XC3S1500-5FG676C is useful when a control system needs deterministic hardware timing alongside programmable decision logic. The 29,952 configurable logic cells can implement motion sequences, fault detection, timing generators, and multi-axis coordination, while 487 I/O positions support encoders, actuators, interlocks, and human-machine interfaces. The commercial -5 grade is appropriate where the completed design meets the required operating environment. Engineers should partition safety-critical functions from general-purpose logic where appropriate, add formal or hardware checks for interlocks, and verify every timing constraint against the exact device speed grade. Configuration storage, startup behavior, and recovery after power loss must also be included in the system-level verification plan.
Disebarkan
Data Acquisition and Signal Processing
The XC3S1500-5FG676C can implement high-throughput digital signal processing when parallel arithmetic, flexible filtering, and interface density are more important than using a fixed-function processor. Its 29,952 logic cells can support parallel filter sections, correlation, digital down-conversion, or data-format conversion, while 589,824 RAM bits assist with buffering and coefficient storage. The -5 grade and listed 725 MHz performance level provide a useful starting point for pipeline design, but final timing must be established through synthesis and place-and-route. Keep DSP stages registered and analyze the critical paths created by adders, multipliers, and memory interfaces. Clock and power distribution should be isolated appropriately from sensitive analog front ends to preserve measurement integrity.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk XC3S1500-5FG676C — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | XC3S1500-5FGG676C | XC3S1500-4FG676C | XC3S1500-4FG676I | XC3S1500-5FG676I | XC3S1500-4FGG676C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BGA FBGA | 676-BGA FBGA | 676-BGA FBGA | 676-BGA FBGA | 676-BGA FBGA | 676-BGA FBGA |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| System Gates | 1,500,000 gates | 1,500,000 gates | 1,500,000 gates | 1,500,000 gates | 1,500,000 gates | 1,500,000 gates |
| Configurable Logic Cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells |
| RAM Capacity | 589,824 bits | 589,824 bits | 589,824 bits | 589,824 bits | 589,824 bits | 589,824 bits |
| I/O Count | 487 I/O | 487 I/O | 487 I/O | 487 I/O | 487 I/O | 487 I/O |
| Speed Grade | -5 | -5 | -4 | -4 | -5 | -4 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Temperature Class | Commercial | Commercial | Commercial | Industrial | Industrial | Commercial |
Penyeberangsung Jelas
- Retains the -5 performance grade (vsXC3S1500-4FG676C)
- Preserves the large Spartan-3 logic resource base (vsXC3S1500-4FG676I)
- Commercial temperature ordering for standard deployments (vsXC3S1500-5FG676I)
Catatan Desain
Plan the 1.2 V core rail and associated I/O supplies against the actual Spartan-3 power-estimation results for the selected design. Utilization, clocking, I/O activity, and speed grade can materially change total demand. Follow the manufacturer guidance for bulk and bypass capacitance, regulator tolerance, transient response, and supply sequencing. Place decoupling components directly across the relevant supply and ground balls rather than concentrating them at connector or regulator locations.
Evaluate junction temperature using the board thermal model and the power report from the completed implementation. The 676-ball FBGA offers many thermal and signal connections, but package performance still depends on effective PCB copper area, via density, airflow, and neighboring heat sources. Apply the manufacturer junction-temperature limit and rerun analysis for the maximum expected operating condition. Do not rely on a 725 MHz performance level as a substitute for power and thermal analysis.
Use the manufacturer pinout and package drawing to assign all 676 balls before routing. Keep configuration pins, clock inputs, and decoupling connections short, preserve the recommended ball assignments for power and ground, and avoid routing fast signals through poorly decoupled supply paths. The 487 I/O positions require careful grouping by voltage standards and interface type so incompatible signals do not share the same printed circuit board routing region.
Create timing constraints for clocks, source-synchronous interfaces, chip-to-chip buses, and external memory before implementation. Pay particular attention to clock skew, bus skew, and I/O timing when the design approaches the device’s stated 725 MHz performance level. Use registered interfaces where appropriate and validate external memory and transceiver timing through board-level signal-integrity analysis. Changes between -5 and -4 alternatives require complete timing reruns.
Do not substitute a -4 device for XC3S1500-5FG676C solely because both use the 676-BGA package. The speed-grade change can alter timing closure, dynamic power, and the bitstream timing model. Likewise, do not treat a C-to-I suffix change as a transparent change because the environmental qualification changes. Generate the bitstream for the exact selected ordering code, verify configuration behavior, and complete schematic, package, timing, and lifecycle checks before production release.
Maklumat Kesediaan
The exact XC3S1500-5FG676C listing does not explicitly state RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification status. The C suffix identifies the commercial temperature class and should not be interpreted as an automotive qualification.