Intel's Core 2000HX plan brings DDR4 support back to high-end laptop CPUs
Intel is preparing a Core 2000HX mobile family on 'Raptor Lake Next' dies, reviving DDR4 compatibility for laptops while Nova Lake-HX takes the Core Ultra 4000HX name.
Component sourcing news
What changed today, why it matters for your BOM, and what to watch. Every factual claim is traceable to the source it came from; our own analysis is labelled and kept separate.
EN · single language Editorial policy
Source sanity (S1)
Fetched in last 24 h78
Clean prose6625
Rejected before any model call804
Bad-source rate11%
Gate (spec v2.9)
Pass113
Hold (human review)522
Reject147
Release rate14%
Publishing volume
Today / daily limit24 / 10
Sensitive-topic escalations4
Auto-publishOff (shadow period)
What MediaTek's Wi-Fi 8 Filogic 8800 demo at Network X 2026 means for router BOMs and Wi-Fi 5/6/7 coexistence
MediaTek and Airoha are showing Filogic 8800, an enterprise-grade tri-band Wi-Fi 8 router platform, claiming near-100% throughput gain and 50% lower system power across mixed Wi-Fi 5/6/7/8 fleets.
Renesas brings 100V E-mode GaN FETs to 48V AI data center and robotics power stages
Renesas adds four 100V E-mode GaN FETs (RDS(on) 1.2 to 5 milliohm) claiming up to 63 percent lower soft-switching FOM than comparable GaN devices, targeting 800 VDC / 48V power stages for AI servers, humanoid robotics and motor drives.
Rohm Expands India OSAT Ties for Power MOSFETs: What It Means for TOLL and TO-252 Sourcing
Rohm is outsourcing TOLL packaging to Tata Electronics and TO-252 packaging to Suchi Semicon, starting with legacy power MOSFETs while keeping wafer fab in-house.
SK hynix HBM hybrid bonding setbacks put Samsung in pole position for next-gen stacks
SK hynix has not started HBM hybrid bonding samples while Samsung has shipped them, raising design-in and supply questions for advanced AI memory.
Samsung HBM4E Clears NVIDIA Rubin Ultra Validation: What It Means for AI Accelerator Sourcing
Samsung's HBM4E reportedly passed NVIDIA Rubin Ultra testing at up to 16 Gbps/pin and 4 TB/s per stack, signaling a rebound after the HBM3E rejection.
Samsung Electro-Mechanics books $216M AI server MLCC deal: what it means for 2027 server BOMs
Samsung Electro-Mechanics signs a 290 bln-won MLCC supply deal for AI servers running Jan-Dec 2027, lifting its 2026 long-term contract tally to 3.9 trillion won.
What Innodisk's DDR5-8000 RDIMM launch means for edge AI and server memory design
Innodisk adds an 8000 MT/s industrial DDR5 RDIMM in 16-64 GB densities for edge AI and HPC workloads.
AMD EPYC 9006 Venice: $700 8-core to $14,904 256-core - what SP7/SP8 buyers need
AMD publishes 1Ku pricing for all 31 Zen 6 EPYC 9006 SKUs. SP7 ships Q4 2026, SP8 follows H1 2027, with Default CPU Power replacing TDP.
What Cervoz T449 and T459 MIL-STD-810H NVMe SSDs Mean for Rugged-Embedded Storage Sourcing
Cervoz adds M.2 2280 NVMe SSDs qualified to MIL-STD-810H vibration, shock, and temperature-altitude tests, aimed at defense and industrial-automation designs.
NVIDIA's $279B Supply Commitments and 2027 HBM Lock-Up: What Buyers Should Know
NVIDIA's supply commitments jumped to $279 billion, mostly for memory, and Morgan Stanley estimates it has reserved 37.3% of 2027 HBM supply - tightening the market for everyone else.
Raspberry Pi lifts 2 GB Pi 4 and Pi 5 by $12.50; 1 GB SKUs hold for now
Raspberry Pi raised 2 GB Pi 4 to $67.50 and 2 GB Pi 5 to $77.50 effective October 1, 2026. 1 GB boards and 2 GB Compute Modules are unchanged. Memory tightness is cited as the driver.
About the data on this page. Charts on this site are native SVG data visualisations built from verified data held on this site; there are no decorative illustrations and no hot-linked third-party images.
Get the daily brief
One email per publishing day. You can also add XAIPART as a preferred source in Google.