Marvell ships 3.2T retimer and 3nm 1.6T AEC DSP for 224G AI scale-up fabrics
Marvell Alaska E 3.2T retimer and second-gen Alaska A 1.6T AEC DSP are sampling, targeting 224G PAM4 links for AI rack-scale fabrics.
·5 min read
Component sourcing news
What changed today, why it matters for your BOM, and what to watch. Every factual claim is traceable to the source it came from; our own analysis is labelled and kept separate.
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What Micron's $54.2B quarter and 2027 HBM pre-pricing mean for DRAM BOM lines
Micron's FY26 Q4 revenue hit $54.2B with 87% gross margin, 2027 HBM largely priced, and $32B in customer prepayments. Supply stays tight through 2028.
·5 min read
Schneider Electric raises 2026 targets again as data center energy management grows 18.8% organically
Schneider Electric posted triple-digit data center order growth and lifted its 2026 guidance a second time, with energy management revenue up 18.8% organically to €9.62 billion.
·4 min read
Applied Materials widens Besi hybrid bonding tie-up: what it means for AMAT, LRCX, and KLAC BOM and lead times
Applied Materials expanded its Besi partnership for hybrid bonding on October 1, while KLA and Lam Research posted divergent FY26 segment growth under tightening export rules.
·5 min read
Counterfeit power semiconductors: what buyers should add to incoming-inspection checks
Good-Ark outlines a five-step defense against fake power diodes, from document and marking checks to X-ray, electrical, and decapsulation verification across the lot.
·5 min read
KLA packaging process control lines target $1.1B in 2026 as tool lead times stretch to 24 months
KLA's advanced-packaging inspection segment is guided to $1.1B in 2026, up over 70% YoY, even as memory component costs pressure margins and tool lead times lengthen.
·4 min read
GlobalFoundries tapped to run two Malta, NY fabs backed by up to $21B from Japan
GF selected as operator for two new 300mm fabs in Malta, NY under a U.S.-Japan initiative. Initial $10B funds a 2029 fab; ~900,000 wafers/year capacity each.
·4 min read
What the Volvo-NVIDIA door-to-door driving expansion means for next-gen ADAS silicon
Volvo pairs NVIDIA Hyperion, Halos OS, and the Alpamayo stack for eyes-off driving, but no chip model, launch date, or regulatory path has been disclosed yet.
·5 min read
GE Vernova hits $45B electrification backlog: what grid transformer and switchgear buyers should watch
GE Vernova's Electrification backlog has ballooned to $45B from $6B in 2021, with new Venture Global reservations covering transformers and GIS for up to 21 power islands.
·6 min read
PTFE CCL becomes the high-speed baseline as ABF substrate lead times stretch to 48–52 weeks
Q4 2026 buyer guide: PTFE resin systems anchor next-generation AI boards while ABF substrate capacity flips from oversupply to a 48–52 week backlog.
·4 min read
CXMT's 4F2 DDR5 RDIMM push for end-2026: a two-year jump on Samsung's 2028 target
CXMT outlines a 4F2 cell DDR5 RDIMM launch by end-2026, pre-dating Samsung's reported 2028 mass production window. Yield, EUV access and server qualification remain open questions.
·5 min read
Power Integrations and Ideal Power demo self-powered 800 VDC solid-state breaker for AI racks
Power Integrations and Ideal Power combine 1700 V InnoMux-2 ICs with B-TRAN bidirectional switches into a self-powered solid-state circuit breaker for 800 VDC AI data center racks.
·5 min read
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