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Rohm is outsourcing TOLL packaging to Tata Electronics and TO-252 packaging to Suchi Semicon, starting with legacy power MOSFETs while keeping wafer fab in-house.
Samsung Electro-Mechanics signs a 290 bln-won MLCC supply deal for AI servers running Jan-Dec 2027, lifting its 2026 long-term contract tally to 3.9 trillion won.
Cervoz adds M.2 2280 NVMe SSDs qualified to MIL-STD-810H vibration, shock, and temperature-altitude tests, aimed at defense and industrial-automation designs.
NVIDIA's supply commitments jumped to $279 billion, mostly for memory, and Morgan Stanley estimates it has reserved 37.3% of 2027 HBM supply - tightening the market for everyone else.
Raspberry Pi raised 2 GB Pi 4 to $67.50 and 2 GB Pi 5 to $77.50 effective October 1, 2026. 1 GB boards and 2 GB Compute Modules are unchanged. Memory tightness is cited as the driver.
Samsung Foundry is reportedly set to fabricate Anthropic's custom AI accelerator on its 2 nm SF2 node, with Broadcom handling design. The deal could shift AI ASIC sourcing away from TSMC.
Micron reports record fiscal Q4 2026 revenue of $54.2B and warns that DRAM and NAND tightness will deepen in 2027-2028 as AI demand absorbs new clean-room capacity.
TrendForce sees conventional DRAM up 10-15% QoQ and NAND Flash up 15-20% QoQ in 4Q26, as suppliers keep feeding AI-server lines while consumer demand stays soft.
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