AD9500WAFER - Programmable Delay Generator Die | Analog Devices
MPN: AD9500WAFER ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.75 | $427.50 |
| 100 | $36.2 | $3,620.00 |
| 500 | $30.5 | $15,250.00 |
| 1,000 | $26.8 | $26,800.00 |
AD9500WAFER Overview
A digitally programmable delay generator (DPG) is a category of timing IC that takes a trigger event (rising edge of an input pulse) and produces a single output pulse delayed by a precisely controlled interval that is set digitally through a parallel or serial interface. In the broader component taxonomy, the AD9500 sits under timing ICs -> clock & timing -> clock generators, with strong affinity to phase-locked loops (PLLs), time-to-digital converters (TDCs), and voltage-controlled delay lines (VCDLs). It functions as a "time-to-pulse" converter in pulse-position modulation, time-of-flight measurement, and radar ranging applications.
Key features of the AD9500 include 8-bit delay programming resolution, an analog fine-adjust input for analog sweep or vernier trimming, a stable trigger-to-output delay versus supply and temperature, and CMOS/TTL-compatible trigger and output levels. The device operates from a single +5 V supply and provides low-jitter, low-temperature-coefficient timing suitable for high-resolution pulse generation. The wafer form factor makes it attractive for OEM integrators building custom timing modules, multi-chip modules (MCMs), or systems-on-chip hybrid stacks where space is critical.
In a typical radar or lidar ranging system, the AD9500WAFER serves as the precision time-reference element that produces the transmit pulse and a precisely delayed reference for the receive path. Its 8-bit programmable delay, combined with analog fine-adjust, gives a total of approximately 10 bits of effective time resolution in many configurations. In automated test equipment (ATE), the AD9500 generates clock delays used for timing-margin testing of high-speed digital ICs, with the analog fine-adjust providing the sub-LSB timing vernier needed to characterize edge placement accuracy.
When using the AD9500WAFER in a die form factor, designers must consider die-handling, ESD protection, wire-bond or flip-chip attach, plus substrate/die-attach thermal management, as these are not handled by a standard package. Bare die also typically lacks the burn-in and temperature-screening benefit of packaged grades, so reliability must be evaluated in the integrator's MCM process. This page synthesizes distributor pricing, parametric context, and drop-in alternatives not present in the manufacturer datasheet itself.
Drop-in alternatives for AD9500WAFER — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
AD9500BP
✅ Drop-In📋 Reference alternative (not in catalog)
AD9500/883B
✅ Drop-In📋 Reference alternative (not in catalog)
AD9500
✅ Drop-In📋 Reference alternative (not in catalog)
AD9500BN
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
AD9500CHIPS
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
AD9500WAFER Specifications
| Manufacturer | Analog Devices |
| Part Number | AD9500WAFER |
| Part Type | Digitally Programmable Delay Generator |
| Package / Form Factor | IC Die (bare silicon wafer form) |
| Programming Resolution | 8 bits digital delay programming |
| Analog Fine Adjust | Yes (external analog sweep / vernier input) |
| Trigger Input Level | CMOS / TTL compatible |
| Output Level | CMOS / TTL compatible |
| Supply Voltage | +5 V single supply |
| Package Reference (Packaged Sibling) | 24-pin ceramic Skinny DIP, 28-pin surface mount (per packaged AD9500 datasheet) |
| Packaged Sibling | AD9500 (ceramic DIP and SOIC packaged parts available) |
| Mounting Type | Die attach / wire bond / flip-chip (integrator-dependent) |
| Military / 883B Sibling | AD9500/883B available per MIL-STD-883 |
AD9500WAFER ad9500 (ceramic dip and soic packaged parts available) Pin Configuration Guide
Pin configuration for AD9500WAFER (ad9500 (ceramic dip and soic packaged parts available) package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for AD9500WAFER.
Refer to the datasheet for full pin configuration.
Typical Applications
AD9500WAFER is suitable for 6 applications: Pulsed Radar Range Timing, Lidar Time-of-Flight Generation, Automated Test Equipment (ATE) Timing Margins, Sonar Beamforming Delay Network, High-Resolution Pulse Generation, Medical Imaging Timing.
Pulsed Radar Range Timing
The AD9500WAFER serves as a digitally programmable delay generator that produces precisely delayed trigger pulses between the radar transmitter and the receiver gate in pulsed radar systems. Its 8-bit digital delay programming plus analog fine-adjust input yields roughly 10 bits of effective timing resolution, which is critical for sub-meter range-bin discrimination in short-range surveillance and perimeter radar. The bare-die form factor integrates directly into radar front-end MCMs, eliminating the parasitic inductance of an external packaged delay line and enabling tighter timing alignment between transmit/receive paths.
Recommended
Lidar Time-of-Flight Generation
In lidar ranging modules, the AD9500WAFER generates the precisely timed transmit pulse and the matched delay reference for the return-pulse sampling window, directly determining the achievable distance resolution. With its CMOS/TTL-compatible trigger and output levels, it interfaces cleanly to FPGA-based timing controllers and pulsed laser drivers. The 8-bit digital delay programming enables coarse delay selection over the full ranging interval, while the analog fine-adjust input trims the sub-nanosecond timing offset that establishes the system's minimum resolvable distance bin.
Recommended
Automated Test Equipment (ATE) Timing Margins
The AD9500WAFER provides ATE pin-electronics timing paths with digitally programmable edge placement and analog vernier trim, allowing characterization of timing-margin behavior in high-speed digital ICs. The 8-bit digital delay sets the coarse edge step, while the analog fine-adjust delivers sub-LSB edge-placement resolution needed to validate setup/hold margins on sub-nanosecond interfaces. Bare-die integration permits placing the delay generator adjacent to the DUT socket driver, minimizing trace-induced timing skew and improving measurement repeatability compared to a packaged part on a remote timing board.
Recommended
Sonar Beamforming Delay Network
In active sonar arrays, the AD9500WAFER functions as a per-channel programmable delay element that time-aligns transmit or receive pulses across hydrophone elements, enabling beam-steering and synthetic-aperture imaging. Its 8-bit digital programming plus analog fine-adjust gives system designers roughly 10 bits of effective delay resolution per channel, sufficient for narrow-beam steering at typical sonar wavelengths. The bare-die form factor allows integration directly onto the sonar-array substrate, reducing inter-channel timing skew caused by long PCB traces between packaged delay lines and transducer elements.
Recommended
High-Resolution Pulse Generation
The AD9500WAFER generates single, precisely timed pulses with 8-bit digital delay programming and analog fine-adjust, supporting pulse-position modulation (PPM) communication, laser ranging, and time-domain reflectometry. The CMOS/TTL output level drives downstream laser-diode drivers, fast comparators, or FPGA event-capture inputs directly without additional level translation. Bare-die integration allows the delay generator and the downstream pulse-driver circuit to be co-located on the same MCM substrate, which is critical when the pulse width is comparable to the propagation delay of a conventional PCB trace.
Recommended
Medical Imaging Timing
The AD9500WAFER supplies precisely timed trigger pulses for ultrasound transducer excitation, gamma-camera coincidence timing, and PET time-of-flight front-ends where deterministic, sub-nanosecond pulse placement is required. Its 8-bit digital delay programming combined with analog fine-adjust provides the timing resolution needed to align transmit bursts and receive-window gates across transducer array elements. The bare-die form factor supports integration into compact probe-head modules or bedside imaging cartridges, reducing the interconnect delay that would otherwise be introduced by an external packaged delay generator.
Recommended
Recommended Products Summary
Engineering reference data for AD9500WAFER — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AD9500BP | AD9500/883B | AD9500 |
|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package / Form Factor | IC Die (bare wafer) | 24-pin ceramic Skinny DIP (packaged) | 24-pin ceramic Skinny DIP (MIL-STD-883 packaged) | 28-pin surface mount (packaged) |
| Die Source / Same Silicon | Bare die | Same die, packaged | Same die, MIL-STD-883 packaged | Same die, SOIC packaged |
| Programming Resolution | 8-bit digital + analog fine-adjust | 8-bit digital + analog fine-adjust | 8-bit digital + analog fine-adjust | 8-bit digital + analog fine-adjust |
| Trigger / Output Level | CMOS / TTL | CMOS / TTL | CMOS / TTL | CMOS / TTL |
| Supply Voltage | +5 V | +5 V | +5 V | +5 V |
| Military / 883B Screening | Not standard on wafer form (lot dependent) | No (standard grade) | Yes (MIL-STD-883) | No (standard grade) |
| Integration Method | Die attach / wire bond / flip-chip (MCM) | PCB through-hole | PCB through-hole | PCB surface mount |
Key Differentiators
- Bare-die form factor enables direct MCM/hybrid integration (vs AD9500BP (24-pin ceramic DIP))
- Same silicon as the AD9500/883B military grade (vs AD9500/883B (MIL-STD-883 packaged))
- 8-bit digital plus analog fine-adjust for ~10-bit effective resolution (vs AD9500 (28-pin SOIC packaged))
Design Notes
The AD9500WAFER is supplied as IC Die, not a packaged part. Bare die requires controlled ESD handling (typically HBM Class 1C or better per the wafer-pack specification) and a die-attach/wire-bond process qualified for hybrid/MCM production. Do not attempt to substitute a packaged AD9500 onto a die-attach substrate without redesign; the package adds parasitic inductance that defeats the purpose of bare-die integration in high-resolution timing paths.
When integrating the AD9500WAFER into an MCM, place the trigger input and output traces with controlled-impedance (typically 50 ohm microstrip or stripline) and matched electrical lengths to preserve timing fidelity. Keep analog fine-adjust traces short and isolated from digital programming lines to minimize crosstalk into the timing-critical edges. Provide local decoupling (typically 100 nF ceramic plus 10 uF tantalum) within 2 mm of the supply bond pad to suppress switching-induced jitter.
The CMOS/TTL-compatible trigger and output levels are fast edges capable of generating radiated EMI in the MCM substrate. Maintain solid ground-return stitching vias along the trigger and output paths, and consider a guard trace tied to ground around the analog fine-adjust input to reject substrate-noise pickup. Trigger-to-output jitter performance depends strongly on supply-rail cleanliness; use a low-noise LDO (e.g., a TPS7A30-series or an ADP151-class part) rather than a switching regulator directly upstream of the AD9500WAFER supply bond.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status for the AD9500WAFER bare-die product was not present in the verified web data and is marked 'unknown'. AEC-Q100 is not applicable because this is a timing IC, not an automotive-grade part. Military/aerospace applications should use the MIL-STD-883 screened AD9500/883B packaged sibling. Conflict-minerals status assumed compliant per standard Analog Devices policy; confirm via the manufacturer product page for production procurement.
