AD9500WAFER - Programmable Delay Generator Die | Analog Devices
Teilenummer: AD9500WAFER ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $42.75 | $427,50 |
| 100 | $36.2 | $3.620,00 |
| 500 | $30.5 | $15.250,00 |
| 1.000 | $26.8 | $26.800,00 |
AD9500WAFER Übersicht
A digitally programmable delay generator (DPG) is a category of timing IC that takes a trigger event (rising edge of an input pulse) and produces a single output pulse delayed by a precisely controlled interval that is set digitally through a parallel or serial interface. In the broader component taxonomy, the AD9500 sits under timing ICs -> clock & timing -> clock generators, with strong affinity to phase-locked loops (PLLs), time-to-digital converters (TDCs), and voltage-controlled delay lines (VCDLs). It functions as a "time-to-pulse" converter in pulse-position modulation, time-of-flight measurement, and radar ranging applications.
Key features of the AD9500 include 8-bit delay programming resolution, an analog fine-adjust input for analog sweep or vernier trimming, a stable trigger-to-output delay versus supply and temperature, and CMOS/TTL-compatible trigger and output levels. The device operates from a single +5 V supply and provides low-jitter, low-temperature-coefficient timing suitable for high-resolution pulse generation. The wafer form factor makes it attractive for OEM integrators building custom timing modules, multi-chip modules (MCMs), or systems-on-chip hybrid stacks where space is critical.
In a typical radar or lidar ranging system, the AD9500WAFER serves as the precision time-reference element that produces the transmit pulse and a precisely delayed reference for the receive path. Its 8-bit programmable delay, combined with analog fine-adjust, gives a total of approximately 10 bits of effective time resolution in many configurations. In automated test equipment (ATE), the AD9500 generates clock delays used for timing-margin testing of high-speed digital ICs, with the analog fine-adjust providing the sub-LSB timing vernier needed to characterize edge placement accuracy.
When using the AD9500WAFER in a die form factor, designers must consider die-handling, ESD protection, wire-bond or flip-chip attach, plus substrate/die-attach thermal management, as these are not handled by a standard package. Bare die also typically lacks the burn-in and temperature-screening benefit of packaged grades, so reliability must be evaluated in the integrator's MCM process. This page synthesizes distributor pricing, parametric context, and drop-in alternatives not present in the manufacturer datasheet itself.
Drop-in-Alternativen für AD9500WAFER – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
AD9500BP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AD9500/883B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AD9500
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AD9500BN
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
AD9500CHIPS
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
AD9500WAFER Technische Daten
| Manufacturer | Analog Devices |
| Part Number | AD9500WAFER |
| Part Type | Digitally Programmable Delay Generator |
| Package / Form Factor | IC Die (bare silicon wafer form) |
| Programming Resolution | 8 bits digital delay programming |
| Analog Fine Adjust | Yes (external analog sweep / vernier input) |
| Trigger Input Level | CMOS / TTL compatible |
| Output Level | CMOS / TTL compatible |
| Versorgungsspannung | +5 V single supply |
| Package Reference (Packaged Sibling) | 24-pin ceramic Skinny DIP, 28-pin surface mount (per packaged AD9500 datasheet) |
| Packaged Sibling | AD9500 (ceramic DIP and SOIC packaged parts available) |
| Montageart | Die attach / wire bond / flip-chip (integrator-dependent) |
| Military / 883B Sibling | AD9500/883B available per MIL-STD-883 |
AD9500WAFER ad9500 (ceramic dip and soic packaged parts available) Pinbelegungsleitfaden
Pinbelegung für AD9500WAFER (ad9500 (ceramic dip and soic packaged parts available)-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für AD9500WAFER.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
AD9500WAFER ist geeignet für 6 Anwendungs: Pulsed Radar Range Timing, Lidar Time-of-Flight Generation, Automated Test Equipment (ATE) Timing Margins, Sonar Beamforming Delay Network, High-Resolution Pulse Generation, Medical Imaging Timing.
Pulsed Radar Range Timing
The AD9500WAFER serves as a digitally programmable delay generator that produces precisely delayed trigger pulses between the radar transmitter and the receiver gate in pulsed radar systems. Its 8-bit digital delay programming plus analog fine-adjust input yields roughly 10 bits of effective timing resolution, which is critical for sub-meter range-bin discrimination in short-range surveillance and perimeter radar. The bare-die form factor integrates directly into radar front-end MCMs, eliminating the parasitic inductance of an external packaged delay line and enabling tighter timing alignment between transmit/receive paths.
Empfohlen
Lidar Time-of-Flight Generation
In lidar ranging modules, the AD9500WAFER generates the precisely timed transmit pulse and the matched delay reference for the return-pulse sampling window, directly determining the achievable distance resolution. With its CMOS/TTL-compatible trigger and output levels, it interfaces cleanly to FPGA-based timing controllers and pulsed laser drivers. The 8-bit digital delay programming enables coarse delay selection over the full ranging interval, while the analog fine-adjust input trims the sub-nanosecond timing offset that establishes the system's minimum resolvable distance bin.
Empfohlen
Automated Test Equipment (ATE) Timing Margins
The AD9500WAFER provides ATE pin-electronics timing paths with digitally programmable edge placement and analog vernier trim, allowing characterization of timing-margin behavior in high-speed digital ICs. The 8-bit digital delay sets the coarse edge step, while the analog fine-adjust delivers sub-LSB edge-placement resolution needed to validate setup/hold margins on sub-nanosecond interfaces. Bare-die integration permits placing the delay generator adjacent to the DUT socket driver, minimizing trace-induced timing skew and improving measurement repeatability compared to a packaged part on a remote timing board.
Empfohlen
Sonar Beamforming Delay Network
In active sonar arrays, the AD9500WAFER functions as a per-channel programmable delay element that time-aligns transmit or receive pulses across hydrophone elements, enabling beam-steering and synthetic-aperture imaging. Its 8-bit digital programming plus analog fine-adjust gives system designers roughly 10 bits of effective delay resolution per channel, sufficient for narrow-beam steering at typical sonar wavelengths. The bare-die form factor allows integration directly onto the sonar-array substrate, reducing inter-channel timing skew caused by long PCB traces between packaged delay lines and transducer elements.
Empfohlen
High-Resolution Pulse Generation
The AD9500WAFER generates single, precisely timed pulses with 8-bit digital delay programming and analog fine-adjust, supporting pulse-position modulation (PPM) communication, laser ranging, and time-domain reflectometry. The CMOS/TTL output level drives downstream laser-diode drivers, fast comparators, or FPGA event-capture inputs directly without additional level translation. Bare-die integration allows the delay generator and the downstream pulse-driver circuit to be co-located on the same MCM substrate, which is critical when the pulse width is comparable to the propagation delay of a conventional PCB trace.
Empfohlen
Medical Imaging Timing
The AD9500WAFER supplies precisely timed trigger pulses for ultrasound transducer excitation, gamma-camera coincidence timing, and PET time-of-flight front-ends where deterministic, sub-nanosecond pulse placement is required. Its 8-bit digital delay programming combined with analog fine-adjust provides the timing resolution needed to align transmit bursts and receive-window gates across transducer array elements. The bare-die form factor supports integration into compact probe-head modules or bedside imaging cartridges, reducing the interconnect delay that would otherwise be introduced by an external packaged delay generator.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für AD9500WAFER – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | AD9500BP | AD9500/883B | AD9500 |
|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package / Form Factor | IC Die (bare wafer) | 24-pin ceramic Skinny DIP (packaged) | 24-pin ceramic Skinny DIP (MIL-STD-883 packaged) | 28-pin surface mount (packaged) |
| Die Source / Same Silicon | Bare die | Same die, packaged | Same die, MIL-STD-883 packaged | Same die, SOIC packaged |
| Programming Resolution | 8-bit digital + analog fine-adjust | 8-bit digital + analog fine-adjust | 8-bit digital + analog fine-adjust | 8-bit digital + analog fine-adjust |
| Trigger / Output Level | CMOS / TTL | CMOS / TTL | CMOS / TTL | CMOS / TTL |
| Supply Voltage | +5 V | +5 V | +5 V | +5 V |
| Military / 883B Screening | Not standard on wafer form (lot dependent) | No (standard grade) | Yes (MIL-STD-883) | No (standard grade) |
| Integration Method | Die attach / wire bond / flip-chip (MCM) | PCB through-hole | PCB through-hole | PCB surface mount |
Wichtigste Unterscheidungsmerkmale
- Bare-die form factor enables direct MCM/hybrid integration (vs. AD9500BP (24-pin ceramic DIP))
- Same silicon as the AD9500/883B military grade (vs. AD9500/883B (MIL-STD-883 packaged))
- 8-bit digital plus analog fine-adjust for ~10-bit effective resolution (vs. AD9500 (28-pin SOIC packaged))
Designhinweise
The AD9500WAFER is supplied as IC Die, not a packaged part. Bare die requires controlled ESD handling (typically HBM Class 1C or better per the wafer-pack specification) and a die-attach/wire-bond process qualified for hybrid/MCM production. Do not attempt to substitute a packaged AD9500 onto a die-attach substrate without redesign; the package adds parasitic inductance that defeats the purpose of bare-die integration in high-resolution timing paths.
When integrating the AD9500WAFER into an MCM, place the trigger input and output traces with controlled-impedance (typically 50 ohm microstrip or stripline) and matched electrical lengths to preserve timing fidelity. Keep analog fine-adjust traces short and isolated from digital programming lines to minimize crosstalk into the timing-critical edges. Provide local decoupling (typically 100 nF ceramic plus 10 uF tantalum) within 2 mm of the supply bond pad to suppress switching-induced jitter.
The CMOS/TTL-compatible trigger and output levels are fast edges capable of generating radiated EMI in the MCM substrate. Maintain solid ground-return stitching vias along the trigger and output paths, and consider a guard trace tied to ground around the analog fine-adjust input to reject substrate-noise pickup. Trigger-to-output jitter performance depends strongly on supply-rail cleanliness; use a low-noise LDO (e.g., a TPS7A30-series or an ADP151-class part) rather than a switching regulator directly upstream of the AD9500WAFER supply bond.
Compliance-Informationen
RoHS, REACH, lead-free, and halogen-free status for the AD9500WAFER bare-die product was not present in the verified web data and is marked 'unknown'. AEC-Q100 is not applicable because this is a timing IC, not an automotive-grade part. Military/aerospace applications should use the MIL-STD-883 screened AD9500/883B packaged sibling. Conflict-minerals status assumed compliant per standard Analog Devices policy; confirm via the manufacturer product page for production procurement.
