ATPL230AG55J19-R - PRIME PLC MCU Bundle | Microchip Technology
MPN: ATPL230AG55J19-R β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ATPL230AG55J19-R Overview
A power line communications microcontroller bundle is a system-level product in the semiconductor hierarchy: it belongs to the application-specific microcontroller category, which nests under microcontrollers (MCU), embedded processors, and integrated circuits. Instead of forcing engineers to source a PLC PHY and a host MCU separately, the bundle guarantees a silicon pairing that has been validated together for PRIME (PoweRline Intelligent Metering Evolution) protocol deployments.
Key features of this part include the PL230A-AKU-R PLC front-end PHY with integrated analog AFE for coupling to the power line, the SAMG55J19A Cortex-M4 host MCU running the PRIME MAC/protocol stack, and the convenience of a single ordering code (-R indicates tape-and-reel packaging) covering both devices. This reduces BOM complexity and qualification effort for smart metering and grid automation platforms.
Architecturally, the SAMG55J19A MCU contributes ARM Cortex-M4 processing with hardware DSP instructions, while the PL230A handles OFDM modulation/demodulation and analog line driving. The split architecture offloads real-time PHY processing from the application CPU, leaving headroom for metering firmware, security, and M2M connectivity tasks.
Typical applications include smart electricity meters, streetlight control (smart lighting), solar inverter communication, and advanced metering infrastructure (AMI) data concentrators on PRIME-compliant grids such as those deployed in Europe and Latin America.
A key design consideration is that this bundle requires a PRIME protocol stack license and a line-coupling network (transformer, coupling capacitors) designed to the target grid standard; the silicon alone does not form a complete modem.
This page synthesizes distributor pricing and stock data, drop-in alternative analysis, and application-specific design notes not found on the manufacturer product page.
Drop-in alternatives for ATPL230AG55J19-R β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATPL230AG55J19-R (same form factor and footprint) β differing in Bundle Contents, Package, Product Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATPL230AG55J19
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
PL230A-AKU-R
β Drop-Inπ Reference alternative (not in catalog)
SAMG55J19A-MUT
β Drop-Inπ Reference alternative (not in catalog)
ATPL230AG55J19-R Maximum Ratings & Electrical Characteristics
| Product Type | Power Line Communications Microcontroller IC (bundle) |
| Bundle Contents | PL230A-AKU-R PLC PHY + SAMG55J19A-MUT Cortex-M4 MCU |
| Target Protocol | PRIME PLC |
| Core | ARM Cortex-M4 (SAMG55J19A) |
| Package | LQFP |
| Mounting Type | Surface Mount |
| Packaging Suffix | -R (Tape and Reel) |
| Application | PRIME PLC modules/modems, smart metering |
ATPL230AG55J19-R lqfp Pin Configuration Guide
Pin configuration for ATPL230AG55J19-R (lqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATPL230AG55J19-R.
Refer to the datasheet for full pin configuration.
Typical Applications
ATPL230AG55J19-R is suitable for 6 applications: Smart Electricity Meters, AMI Data Concentrators, Streetlight Control Networks, Solar Inverter Communication, Smart Grid Automation Nodes, Industrial M2M Connectivity.
Smart Electricity Meters
The ATPL230AG55J19-R fits smart electricity meter designs because it combines a PRIME-compliant PLC PHY (PL230A-AKU-R) with an ARM Cortex-M4 MCU (SAMG55J19A-MUT) that has the processing headroom for metering firmware, tariff logic, and security functions. In a typical meter, the PLC modem communicates consumption data over the existing 230V power line, eliminating the need for dedicated communication wiring. The PL230A's integrated analog front end couples to the line through an external coupling network, while the OFDM PHY sustains narrowband PRIME data rates resilient to line noise. Designers should budget the Cortex-M4 core for both PRIME MAC processing and application tasks, and validate the coupling network against the target grid's impedance profile.
Recommended
AMI Data Concentrators
In advanced metering infrastructure (AMI), data concentrators aggregate readings from hundreds of neighborhood smart meters over PRIME power line communication. The ATPL230AG55J19-R provides the PLC modem silicon set for the concentrator's metering-side interface: the PL230A-AKU-R PHY handles OFDM modulation over the low-voltage distribution line, while the SAMG55J19A Cortex-M4 MCU runs the PRIME MAC layer and the backhaul bridging firmware. The dual-chip architecture keeps real-time PHY processing deterministic, which matters when managing many concurrent meter sessions. Concentrator designers typically add an Ethernet, GPRS, or cellular backhaul alongside, leaving the bundle responsible only for the PRIME access network.
Recommended
Streetlight Control Networks
Streetlight and smart lighting controllers use PRIME power line communication to receive dimming commands and report energy usage over the lighting circuit's power lines, avoiding the cost of wireless network deployment. The ATPL230AG55J19-R delivers the complete PLC node silicon: the PL230A-AKU-R PHY with its integrated analog front end connects through a coupling network to the lighting power line, and the SAMG55J19A Cortex-M4 MCU executes both the PRIME protocol stack and the lighting application logic. The bundle's single ordering code simplifies procurement for lighting OEMs deploying thousands of nodes. Power budget is favorable because the PHY operates only during communication windows, useful for controllers with standby energy targets.
Recommended
Solar Inverter Communication
Grid-tied solar inverters increasingly use PRIME power line communication to exchange production data, curtailment commands, and grid-support signals with utility head-end systems over the existing AC wiring. The ATPL230AG55J19-R supplies the PLC modem silicon set for this link: the PL230A-AKU-R OFDM PHY transmits over the inverter's AC output line, while the SAMG55J19A Cortex-M4 MCU bridges inverter control firmware to the PRIME network layer. The PLC approach avoids additional radio hardware and licensing, and the OFDM modulation maintains connectivity in the electrically noisy environment near power conversion stages. Designers must ensure the coupling network tolerates the inverter's switching harmonics and provides adequate isolation at the grid connection point.
Recommended
Smart Grid Automation Nodes
Distribution automation equipment such as secondary substation monitoring units, load-break switch controllers, and grid sensors use PRIME PLC as a cost-effective communication medium on medium- and low-voltage networks. The ATPL230AG55J19-R gives automation node designers a validated PHY-plus-MCU pairing: the PL230A-AKU-R handles robust OFDM communication over power lines with its integrated AFE, while the SAMG55J19A Cortex-M4 DSP-capable core processes protocol traffic and local automation logic simultaneously. This suits nodes that must react locally (protection, load shedding) while reporting upstream. The bundle packaging guarantees the PHY and MCU silicon combination has been qualified together by Microchip, reducing grid-operator qualification risk.
Recommended
Industrial M2M Connectivity
Industrial machine-to-machine (M2M) deployments that span buildings or plants can exploit existing power wiring for data using the PRIME standard, and the ATPL230AG55J19-R is the Microchip silicon set for such modems. The PL230A-AKU-R PHY provides OFDM narrowband communication with its integrated analog front end, and the SAMG55J19A Cortex-M4 MCU offers sufficient performance to run the PRIME stack plus application firmware such as sensor polling or remote I/O control. Compared with wireless options, PLC reaches shielded or metal-rich environments where RF propagation is poor. Integration effort centers on the line coupling network and stack licensing rather than the silicon itself, since the bundle provides the complete modem signal chain.
Recommended
Recommended Products Summary
Engineering reference data for ATPL230AG55J19-R β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATPL230AG55J19 | PL230A-AKU-R | SAMG55J19A-MUT |
|---|---|---|---|---|
| Package | LQFP (bundle of two LQFP devices) | LQFP - same, non-reel packaging | LQFP - PHY device only | LQFP-64 - MCU device only |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Bundle Contents | PL230A-AKU-R + SAMG55J19A-MUT | PL230A-AKU-R + SAMG55J19A-MUT | PLC PHY only | MCU only |
| Target Protocol | PRIME PLC | PRIME PLC | PRIME PLC | None (general-purpose MCU) |
| Core | ARM Cortex-M4 (via SAMG55J19A) | ARM Cortex-M4 | None (dedicated PHY) | ARM Cortex-M4 |
| Packaging | Tape and Reel (-R) | Tray / cut tape | Tape and Reel | Tray |
| Application | PRIME PLC modules/modems | PRIME PLC modules/modems | PLC modem front end | General embedded applications |
Key Differentiators
- Validated PHY-plus-MCU silicon pairing in one orderable item (vs PL230A-AKU-R (PHY only))
- Reduced BOM and procurement complexity for PRIME designs (vs SAMG55J19A-MUT (MCU only))
- Trade-off: larger total footprint than any single-chip PLC solution (vs ATPL230AG55J19 (non-reel bundle variant))
Design Notes
Do not treat ATPL230AG55J19-R as a single chip on the BOM: it is a bundle commercial part number covering two physically separate LQFP devices (PL230A-AKU-R PHY and SAMG55J19A-MUT MCU). PCB layout must accommodate both footprints and their interconnect, and incoming inspection must receive two distinct package drawings. Confirm at ordering whether your contract manufacturer expects the bundle CPN or the two constituent part numbers, as some distributors stock the devices separately even when quoting the bundle.
The PL230A PLC PHY drives an analog front end that couples OFDM signals onto the power line through a transformer and coupling capacitors. Keep the PHY-to-coupling-network traces short and differential, isolate the analog AFE section from the Cortex-M4 digital switching, and follow the PRIME coupling-network reference design in Microchip's ATPL230 application materials. Ground the AFE return path separately from high-current digital ground to protect receiver sensitivity on noisy lines.
The bundle spans two supply domains: the SAMG55J19A MCU core/IO rails and the PL230A analog supply for the line driver, which can draw burst currents during OFDM transmit bursts. Decouple the PHY supply with bulk capacitance sized for transmit bursts in addition to standard 100 nF per-pin ceramics, and verify voltage sag on the line-driver rail at maximum PLC transmit power during design validation, since sag during bursts can corrupt PRIME frame timing.
Compliance Information
Compliance data not present in the retrieved web data; confirm RoHS/REACH status on the Microchip product page or environmental datasheet before order release.
